Abstract: Disclosed herein a workpiece, a workpiece processing method and a workpiece processing system. To achieve hermetic sealing in a workpiece, it is often desirable to remove contaminants from channels and to seal up the channels. The workpiece processing method comprising applying a low surface energy solution on a surface of the workpiece, the low surface energy solution includes a carrier solvent and a filler material dissolved in the carrier solvent; allowing the low surface energy solution to impregnate into a channel in the workpiece; removing the solvent from the low surface energy solution to remain the filler material in the channel to hermetically seal the channel.

Abstract: Substrate processing apparatuses and methods are provided. A substrate processing apparatus includes placing a first substrate on a first stage in a process chamber, placing a second substrate on a second stage in the process chamber, performing a first deposition process on the first substrate, and performing a second deposition process on the second substrate. The performing the first deposition process includes supplying the first substrate with a first gas. The performing the second deposition process includes supplying the second substrate with a second gas. The supplying the first substrate with the first gas includes alternately and repeatedly performing steps of filling a first gas supply unit with the first gas for a first time length, and supplying the first substrate with the first gas for a second time length. The second time length is greater than the first time length.

Abstract: In accordance with some embodiments herein, methods and apparatuses for flowable deposition of thin films are described. Some embodiments relate to cyclical processors for gap-fill in which deposition is followed by a thermal anneal and ultraviolet treatment and repeated. In some embodiments, the deposition, thermal anneal, and ultraviolet treatment are carried out in separate stations. In some embodiments, a second station is heated to a higher temperature than a first station. In some embodiments, a separate module is used for curing.

Abstract: A method of forming a multilayer structure that reflects an omnidirectional structural color by atomic layer deposition (ALD) includes introducing at least one reflective core particle into a reaction chamber and depositing a conformal dielectric layer encapsulating the at least one reflective core particle in a dielectric-layer ALD cycle. Subsequently, a conformal barrier layer encapsulating the conformal dielectric layer is deposited in a barrier-layer ALD cycle, and a conformal absorber layer encapsulating the conformal barrier layer is deposited in an absorber-layer ALD cycle.

Abstract: A coated cutting tool is provided. The cutting tool is CVD coated and has a substrate of cemented carbide, wherein a metallic binder in the cemented carbide includes Ni. The CVD coating has an inner layer of TiN and a subsequent layer of TiCN and a layer of Al2O3 located between the TiCN layer and an outermost surface of the coated cutting tool.

Abstract: A method for depositing layers containing a group five element on a substrate, in which process gas is fed into a process chamber. After depositing the layer, the process chamber is cleaned as follows. The process chamber is heated to a first cleaning temperature. After reaching the first cleaning temperature, a halogen or a halogen compound is fed into the process chamber in a first cleaning step. After the first cleaning step, the process chamber is brought to a second cleaning temperature. After reaching the second cleaning temperature, O2 is fed into the process chamber in a second cleaning step. After the second cleaning step, the process chamber is brought to a third cleaning temperature. After reaching the third cleaning temperature, substantially only H2 is fed into the process chamber in a third cleaning step. After the third cleaning step, the process chamber is cooled.

Abstract: The present invention relates to a method for manufacturing a gas-barrier coated substrate material, coated with a layer of reduced graphene oxide. The invention further relates to laminated packaging materials comprising the barrier-coated substrate material, in particular intended for liquid carton food packaging, and to liquid carton packaging containers comprising the laminated packaging material.

Abstract: Provided is a thin-film forming raw material, which is used in an atomic layer deposition method, including a compound represented by the following general formula (1): M(R1)x1[A1?N(R2)(R3)]y1??(1) in the formula (1), R1, R2, and R3 each independently represent a linear or branched alkyl group having 1 to 4 carbon atoms, A1 represents a linear or branched alkylene group having 1 to 5 carbon atoms, x1 represents an integer of from 0 to 2, y1 represents an integer of from 1 to 3, and M represents an indium atom or a zinc atom, provided that when M represents an indium atom, a compound in which x1 represents 2, y1 represents 1, and R1, R2, and R3 each represent a methyl group is excluded.

Abstract: The disclosed subject matter is a method to reduce film shedding from components internal to a process chamber. In one example, the method includes forming a dielectric film layer on each of a successive plurality of substrates within the process chamber, and, after a pre-determined number of the successive plurality of substrates have had the dielectric film layers formed thereon, forming an undoped-silicate glass (USG) film on the components internal to the process chamber to passivate accumulated levels of the dielectric film layers. Other devices and methods are disclosed.

Abstract: Methods are provided herein for deposition of oxide films. Oxide films may be deposited, including selective deposition of oxide thin films on a first surface of a substrate relative to a second, different surface of the same substrate. For example, an oxide thin film such as an insulating metal oxide thin film may be selectively deposited on a first surface of a substrate relative to a second, different surface of the same substrate. The second, different surface may be an organic passivation layer.

Abstract: Processing methods disclosed herein comprise forming a nucleation layer and a flowable chemical vapor deposition (FCVD) film on a substrate surface by exposing the substrate surface to a silicon-containing precursor and a reactant. By controlling at least one of a precursor/reactant pressure ratio, a precursor/reactant flow ratio and substrate temperature formation of miniature defects is minimized. Controlling at least one of the process parameters may reduce the number of miniature defects. The FCVD film can be cured by any suitable curing process to form a smooth FCVD film.

Abstract: A method of additively manufacturing an aircraft part, having steps of: forming a base, defining a shape of the aircraft part, out of first thermoplastic polymer; forming a lower support surface onto discrete locations of the base by printing a mixture of a second thermoplastic polymer and a catalyst compound formed with metal onto the discrete locations, such that the lower support surface is formed with cavities; and forming an upper support surface by depositing, via electrolysis deposition, a metal plating onto the lower support surface along the discrete locations, to thereby form the aircraft part.

Abstract: An anti-coking surface having a thickness up to 15 microns comprising from 15 to 50 wt. % of MnCr2O4 (for example manganochromite); from 15 to 25 wt. % of Cr0.23Mn0.08Ni0.69 (for example chromium manganese nickel); from 10 to 30 wt. % of Cr1.3Fe0.7O3 (for example chromium iron oxide); from 12 to 20 wt. % of Cr2O3 (for example eskolaite); from 4 to 20 wt. % of CuFe5O8 (for example copper iron oxide); and less than 5 wt. % of one or more compounds chosen from FeO(OH), CrO(OH), CrMn, Si and SiO2 (either as silicon oxide or quartz) and less than 0.5 wt. % of aluminum in any form provided that the sum of the components is 100 wt. % is provided on steel.

Abstract: Provided is a method for forming a SiCN thin film. The method includes the steps of: loading a target wafer onto a chuck heater located inside a chamber; operating the chuck heater to allow the target wafer to be heated to a target deposition temperature in the range of 200 to 550° C.; setting a target process pressure in the chamber to 2.0 to 10.0 Torr; and injecting a gas for plasma excitation and first and second reaction gases for forming the SiCN thin film into the chamber set to the target deposition temperature and the target process pressure to allow the SiCN thin film to have a refractive index in the range of 1.80 to 2.40.

Abstract: A device and method for curing solvent-impregnated (or saturated) graphite parts includes a cure module, wherein graphite parts saturated with a sealant are positioned in the cure module. Water is then placed in the cure module until the graphite parts are immersed in the water. The cure module is then pressurized to between 1 bar-20 Bar or more and the temperature of the water is maintained at any temperature from 90° C.-225° C. or more.

Abstract: The invention relates to the use of a powder comprising at least one polyamide and at least one epoxy resin for producing an electrically insulating coating on a surface. The invention also relates to an electricity transmitting component at least partially covered with a coating that can be obtained by melting such a powder.

Abstract: Methods of selectively depositing a carbon-containing layer are described. Exemplary processing methods may include treating a substrate comprising a carbon-containing surface and a silicon-containing surface with one or more of ozone or hydrogen peroxide to passivate the silicon-containing surface. In one or more embodiments, a carbon-containing layer is then selectively deposited on the carbon-containing surface and not on the silicon-containing surface by flowing a first precursor over the substrate to form a first portion of an initial carbon-containing film on the carbon-containing surface and not on the silicon-containing surface. The methods may include removing a first precursor effluent from the substrate. A second precursor may then be flowed over the substrate to react with the first portion of the initial carbon-containing layer. The methods may include removing a second precursor effluent from the substrate.

Abstract: Disclosed herein is an environmentally friendly wood protecting method against biological deterioration such as fungal, bacterial and insect damage and non-biological wood deterioration such as weathering. The method comprises contacting a wood material with an aqueous solution of a zirconium salts which is followed by a heat treatment step, providing durable protection of wood against biodegradation and improving several other properties of the treated wood.

Abstract: A device for fluidised bed chemical vapour deposition, includes a reactor including a treatment zone in which the fluidised bed chemical vapour deposition is intended to be carried out using at least a first and a second reactive gas and a diffuser under the treatment zone delimiting the reactor, and a heating system configured to heat at least the treatment zone. The device includes a first channel for introducing the first reactive gas and a second channel for introducing the second reactive gas, which second channel is separate from the first channel and opens out under the diffuser, and wherein the first introduction channel is capable of being moved with respect to the heating system.

Abstract: A method and system is provided for reducing surface roughness of a diesel engine component. The method and system may apply a voltage to a plasma electrolyte polishing cell. The plasma electrolyte polishing cell may include a diesel engine component and an aqueous electrolyte solution. The method and system may cause a plasma layer to form around a surface of the diesel engine component as a result of applying the voltage to the plasma electrolyte polishing cell. The method and system may terminate the voltage to the plasma electrolyte polishing cell. The method and system may apply a coating process to the diesel engine component.