Patents Examined by Ken Hotron
  • Method of bonding silicon wafers at temperatures below 500 degrees centigrade for sensor applications
    Patent number: 5413955
    Abstract: A process for silicon wafer-to-wafer bonding at temperatures lower than 500.degree. C. has been developed. It consists of (1) treating the cleaned surfaces to make them smooth and hydrophilic, (2) initiating the bond by making intimate contact between wafers and (3) enhancing the bond strength at elevated temperatures. This bonding process can be applied to sensor packaging.
    Type: Grant
    Filed: December 21, 1993
    Date of Patent: May 9, 1995
    Assignee: Delco Electronics Corporation
    Inventors: Han-Sheng Lee, Steven E. Staller, Dan W. Chilcott