Abstract: A process is provided for forming spacers useful in large area displays. The process comprises steps of : forming bundles or boules comprising fiber strands which are held together with a binder; slicing the bundles or boules into slices; adhering the slices on an electrode plate of the display; and removing the binder. In the step of forming bundles or boules comprising fiber strands, the function of the binder is initially or fully performed by glass tubings surrounding the glass fibers. The clad glass of the envelopes etches more readily than the core glass.
Type:
Grant
Filed:
February 2, 2001
Date of Patent:
March 26, 2002
Assignee:
Micron Technology, Inc.
Inventors:
David A. Cathey, Charles M. Watkins, Darryl M. Stansbury, James J. Hofman, Robert T. Rasmussen, Surjit S. Chadha
Abstract: Fabrication of support structures for use in field emitter displays through a photolithographic process that involves (1) depositing a photolithable material on a substrate, (2) etching the material to create column areas in the material, (3) filling the column areas with a support material, (4) planarizing the support material, photolithable material, and the filled column areas to the desired height, and (5) removing the remaining photolithable material by exposing the filled column areas as support structures on the substrate.
Abstract: An apparatus for soldering printed circuit boards includes a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path, preferably in the form of a closed loop; a pair of laterally spaced movable rails defining a part of the transfer path and adapted for supporting engagement with the carrier; a vessel containing molten solder placed beneath the space between the rails; and driving means for moving the rails up and down to allow the printed circuit board to be dipped in the molten solder.