Abstract: When a fault in an energized power distribution cable flashes over, the surge draws charge from both sides of the line. The fault thus produces a pair of current surges that propagate from the fault in opposite directions along the line. These oppositely-directed current surges create pulsed electromagnetic fields of different directions which, in turn, induce voltages of different polarities in a receiving antenna positioned along the line. The polarity of the first such voltage pulse induced in the antenna indicates the direction from the antenna to the fault. In one embodiment, the line is repeatedly "thumped," causing flashovers to recur at the fault. By moving the antenna along the line until the polarity of the initial received pulse inverts, the precise location of the fault can be determined.

Abstract: Time coefficient .beta., voltage coefficient d and temperature coefficient .phi..sub.0 of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under the same condition are obtained through experiment using -BT stress test, mean value .mu. and standard deviation .sigma.

Abstract: An improved substrate processing system. The system may be used for double sided scrubbing of a semiconductor substrate. The wet stations of the system has covers which prevent accumulated liquid from dripping outside of the station and which minimize dripping on the substrates. Transport tunnels are provided between modules to prevent leakage between the modules. A substrate transport mechanism which is moveable along a rail is provided with the stabilizer to provide for stable substrate transfer. The processing system has two brush stations which are placed within a single enclosure. The sensors located throughout the system, which sense the presence of a wafer, are fixedly mounted in a frame so that they are self-aligned to one another. In the sender station, two sensors are used, with the system requiring both sensors to sense the presence of a wafer to increase the reliability. In the dry station, the heating lamp is shielded from the substrate to reduce particulate contamination.

Abstract: A probe test apparatus comprising a test section for testing a wafer, a cassette having an opening at one side through which the wafer is taken into and out of the cassette, grooves formed in inner faces of both sides of the cassette to hold wafers therein, and a convex member projected downward from the underside of the cassette, a stage on which the cassette is mounted keeping the wafers therein substantially horizontal, and holder members projected upward from the top of the cassette-mounted stage and having a recess into which the convex member of the cassette falls, wherein when the convex member is not fitted into the recess but contacted with the holder members, the wafers in the cassette are tilted and when it is fitted into the recess, they can be kept substantially horizontal in the cassette to thereby position the cassette relative to the test section.

Abstract: A high voltage differential is applied across two separated electrodes by a oltage supply. Between these electrodes is located a sample of the solid propellant or other energetic material. The voltage differential across the electrodes generates a spark of measurable voltage, current and time duration in the sample in order to foretell at what energy level sustained ignition of the sample occurs. This spark is measured by a voltage monitor which, upon reaching a predetermined level, sends a signal to a short-circuiting network. The short-circuiting network, after a predetermined time delay, shorts the electrical path across the electrodes thereby removing the voltage differential across the sample and ending the ignition test. An operator is then able to determine visually whether or not the spark of known voltage, current and time duration has created sustained ignition of the sample material.

Abstract: A device for finding an inoperative bulb in a series string of lights, such as a string of Christmas tree lights having a plug, a pair of electrically conductive leads connected to the plug and having their ends terminating within a casing of the device, a polarity switch having first and second terminals each connected to a lead of the pair of leads connected to the plug, a probe for insertion into and contact with the wire of the socket of the light string, and an indicator circuit for determining whether an electric current is passing through the series string thus indicating the presence or lack of an inoperative bulb. The indicator circuit is located between the polarity switch and the probe and a protective sheath is provided to prevent any part of the probe from being exposed to avoid a user from being shocked, the protective sheath being continuously biased to cover the probe.

Abstract: An auxiliary plug-and-socket assembly (28) has a plurality of pins (29) at one end which plug into a socket (30) at the rear end of a tractor vehicle (31) and sockets (32) at the other end which receive a plug (33) from a trailer vehicle. The auxiliary assembly (28) also has conductors (38) which extend between corresponding pins (29) and sockets (32), light emitting diodes (20-25) in respective circuits between conductors (38) and a common ground pin and socket, a gating diode (37), and an energizer (17) and switch (34) bridging the gating diode (37).

Abstract: A probe card includes an oscillator generating an AC signal, an averaged value detecting circuit receiving a signal outputted from a prescaler IC, for generating an averaged DC signal, and a plurality of switches for changing a flow of a signal among the IC tester, the prescaler IC, the oscillator and the averaged value detecting circuit. The switches is so controlled that the AC signal is supplied to the prescaler IC, and the signal outputted from the prescaler IC is supplied to the averaged value detecting circuit and converted to the averaged DC signal, whereby a non-defective/defective of the AC function of the prescaler IC is discriminated on the basis of the obtained averaged DC signal. The switches are also so controlled that a DC test signal is supplied from the IC tester to the prescaler IC and a DC output signal outputted from the prescaler IC is supplied to the IC tester.

Abstract: An apparatus for determining the characteristics of a particular ionization chamber by measuring the capacitance of the chamber and using that capacitance to identify the particular type of chamber being used to measure the ionizing radiation.

Abstract: A multipath component detector detects the correlation between a received signal and a reference signal in a training period of the received signal and estimates and outputs the multipath received component levels at a plurality of timing points. A component ratio calculator calculates the ratio of each received component to the overall received power. By this, the level ratio of a specified received component can be detected. Power dissipation can be minimized by switching the detector to a differential detector or an adaptive equalizer in accordance with the result of the delay spread measurement.

Abstract: The present invention describes a method for testing the interconnect networks of a multichip module for opens and shorts. An electron beam lands on a pad of an interconnect network located on a substrate. The electron beam is used to interrogate the pad. An extract grid located above the substrate is maintained at a positive potential. While the electron beam interrogates the pad, the pad emits secondary electrons until such a point that the pad reaches a positive potential near that of the positive potential of the extract grid. The extract grid is then switched to a negative potential. The pad, still being interrogated by the electron beam, then collects secondary electrons until such a point that the pad reaches a negative potential near that of the negative potential of the extract grid. The test time, the length of time it takes for the pad to change from the positive potential to the negative potential, is measured and compared to a reference value.

Abstract: An apparatus and method for sensing impedances of materials placed in contact therewith. The invention comprises a plurality of drive electrodes and one or more sense electrodes. Both rotating electric fields and differently shaped electric fields are provided for, as are analysis of structure and composition at different orientations and depths.

Abstract: A portable diagnostic device for checking electrical signalling systems of road going trailers. The device has several receptacles for connection to a corresponding receptacle or pin connector of most types of trailers. An electrical circuit includes switches for energizing individual signalling or illumination circuits of the trailer individually, and indicating lamps for annunciating circuit operability. The device, which is contained on a wheeled cart, has its own power supply and circuit overcurrent protective devices, and is thus independent of a tractor which normally generates the signals. The device enables a shop to perform a safety check for many varieties of trailers, while remaining independent of the tractor vehicles associated with the trailers.

Abstract: An apparatus for detecting the amplitude and phase of an a.c. signal detects the a.c. signal with signal detection means (4), calculates an a.c. signal that is phase-shifted by the amount of the phase characteristic .phi. of the calculation circuit (14) at the frequency of the detected a.c. signal, multiplies the detected a.c. signal by cos .phi., and multiplies by 1/sin .phi. the multiplication result subtracted by the phase-shifted a.c. signal.

Abstract: A connector, for use with an automatic test system for testing integrated circuit boards, consists of a non-conductive carrier that supports a plurality of electrically conductive contacts. In a preferred embodiment, the carrier includes a plurality of holes, each of which is filled with a wire mesh. The wire mesh compresses as necessary to accommodate variations in the lengths of the leads of the device-under-test or the wires of a system component, such as the system fixture. In an alternative embodiment, a flexible carrier supports a plurality of wires. The wires may be embedded in the carrier, or they may be wrapped partially around the carrier, to electrically connect leads proximate to top of the carrier with leads or contacts proximate to the bottom of the carrier. In a second alternative embodiment, the connector consists of a plurality of conductive drops, that are strategically placed on the ends of wires, leads or contacts.

Abstract: A test structure for submicrometer metrology as used in integral circuit manufacture comprises a bridge conductor divided into three segments by pairs of voltage taps. A first segment has no intermediate taps; a second segment has a number of dummy taps intermediate its ends; and a third segment has a single central tap, which may typically be formed in a different step than the remainder of the test structure, intermediate its ends. Preferably, the central tap extends from the same side of the bridge conductor as the taps at the ends of the third segment thereof. In order to evaluate a manufacturing operation, for example, to monitor the accuracy of registration of successive manufacturing steps, test signals are applied successively between the pairs of pads.

Abstract: Methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.

Abstract: An electronic probe circuit having ac and dc amplifiers and an input compensation subcircuit is enclosed within a trim housing that replicates the electrical effect of the probe housing. The circuit is laser trimmed through ports in the trim housing. The difference between the voltage at 80 nsec and 1.4 .mu.sec points on a step voltage provides a first calibration factor while the difference between the 3 nsec voltage and the 80 nsec voltage provides a second calibration factor. A resistor in the DC amplifier is trimmed to an absolute voltage with a step scan laser cut. A resistor in the AC amplifier is trimmed with a laser L-cut until the difference between the 80 nsec and 1.4 .mu.sec points of the step voltage equals the first calibration factor. A capacitor in the input compensation subcircuit is trimmed until the voltage difference between the 3 nsec and 80 nsec points equals the second calibration factor.

Abstract: An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chips provide an interface between a power supply and power pads on the product chips, at least one voltage regulator for each product chip. The voltage regulators provide a specified Vdd voltage to the product chips, whereby the Vdd voltage is substantially independent of current drawn by the product chips. The voltage regulators or other electronic means limit current to any product chip if it has a short. The voltage regulator circuit may be gated and variable and it may have sensor lines extending to the product chip. The test chips can also provide test functions such as test patterns and registers for storing test results.

Abstract: An impedance meter enables a real value of a component's impedance value to be forced to be negative when contact between measurement terminals and the component is poor. The value of the real part of the measured value is compared with a standard value for judging whether the contact is good or bad. The contact is judged poor when the real part of the measured value is more negative than the standard value. The standard value for judging whether the contact is good or bad is made more negative than the magnitude of the dispersion of the real part of the measured values, and thus erroneous judgments due to dispersion of measured values are eliminated. The circuit that forces the real part of the measured value to become negative is formed as follows: the input of an inverse gain amplifier is connected to the output terminal of a signal generator, the output of the inverse gain amplifier is connected to a high-voltage voltage terminal through a resistance.