Abstract: The disclosure concerns an electrical connection assembly comprising: a conductive plate with a drillhole, a first column with a hole passing axially through it and comprising a shoulder to abut against one of the faces of the conductive plate, and a second column with a hole passing axially through it and comprising a shoulder to abut against the other face of the conductive plate, a first cylinder with a radius sized to enable it to enter the hole in the first column and a length sized such that, when the shoulder is in abutment, the free end of the first cylinder projects beyond the conductive plate, and a second cylinder with a radius sized to enable it to enter the drillhole, wherein the free end of the first cylinder is crimped by radial expansion and then by axial compression in the hole in the first column.

Abstract: Solutions for improving current spreading in organic substrates are disclosed. In one aspect, a packaging substrate is disclosed, the packaging substrate comprising: a substrate base having a first surface and a second surface; and a controlled collapse chip connect (C4) pad over a portion of the first surface, the C4 pad including: an electrolessly plated copper (Cu) layer over the first surface; an electrolytic nickel (Ni) portion over the first electrolytic Cu portion; and a first electrolytic Cu portion over the electrolytic Ni portion; wherein the electrolessly plated Cu layer has a portion extending in one direction away from the C4 pad.

Abstract: A heat sink assembly is packaged by placing the heat sink assembly in a container. The container is secured within a hard disk drive cage.