Patents Examined by Kevin C T Li
  • Patent number: 11066733
    Abstract: It is an object of the present invention to provide a production method of a calcium-based metallic glass alloy molded body for medical use which has a biodegradable property, has a mechanical strength equal to or higher than that of metal materials, and enables complex molding and a wide range of applications. The calcium-based metallic glass alloy molded body for medical use is produced by mixing a metal powder including a calcium powder, alloying the mixed metal powder, and sintering the alloyed mixed metal powder.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: July 20, 2021
    Assignee: TOHOKU UNIVERSITY
    Inventors: Hiroyasu Kanetaka, Guoqiang Xie, Hajime Takada
  • Patent number: 11011282
    Abstract: Systems, methods, and apparatus for meta-materials which are stretchable and tunable using an array of liquid conductor meta-atoms encased in one or more layers of elastomer. Fabrication techniques allow effective manufacture of the metamaterial in a number of form factors for a number of applications, including but not limited to fabrics or wraps around three-dimensional shapes.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: May 18, 2021
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Liang Dong, Peng Liu, Siming Yang, Jiming Song
  • Patent number: 10998881
    Abstract: A composite substrate includes a supporting substrate and a functional substrate that are directly joined together, the supporting substrate being a sintered sialon body.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: May 4, 2021
    Assignee: NGK Insulators, Ltd.
    Inventors: Yuki Nomoto, Kei Tanaka, Katsuhiro Inoue, Yuji Katsuda
  • Patent number: 10995422
    Abstract: A GaAs substrate has a first surface. The sum of the number of particles having a longer diameter of more than or equal to 0.16 ?m which are present in the first surface, per cm2 of the first surface, and the number of damages having a longer diameter of more than or equal to 0.16 ?m which are present in a second surface, per cm2 of the second surface, is less than or equal to 2.1, the second surface being formed by etching the first surface by 0.5 ?m in a depth direction.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: May 4, 2021
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shinya Fujiwara, Yasuaki Higuchi
  • Patent number: 10982714
    Abstract: A plain bearing may comprise a bearing substrate, a bearing overlay, and an interlayer disposed between the bearing substrate and the bearing overlay. The interlayer may comprise hexagonal boron nitride.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: April 20, 2021
    Inventors: Roger Gorges, John Carey, Anil Rathod, Stephan Koerner
  • Patent number: 10960463
    Abstract: The present disclosure describes embedding thermally-resistant flexible cabling within a metal casting during die-casting. A die-casting process may include fixing the thermally-resistant flexible cabling within a die, and die-casting the metal to form a metal casting having the thermally-resistant flexible cabling embedded within the metal casting. In some cases, the thermally-resistant flexible cabling may be utilized for grounding of the metal casting.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: March 30, 2021
    Assignee: International Business Machines Corporation
    Inventors: John R. Dangler, Austin Carter, Gunnar Mills, Colin E. Masterson
  • Patent number: 10900751
    Abstract: A ballistic protective composition having a sintered product of boron carbide and BAM where the sintered product includes up to about 80% BAM by weight based on the weight of the total BAM and boron carbide and wherein the sintered product is configured to prevent penetration of a ballistic threat through the sintered product. The ballistic protective composition may also be bonded to a ballistically protective fabric material to form a ballistic composite, which may be a wearable material, such as a body armor article.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: January 26, 2021
    Assignee: NEW TECH CERAMICS, INC
    Inventor: Peter Hong
  • Patent number: 10889900
    Abstract: The present invention provides a ceramic laminate having excellent mechanical properties, heat dissipation property, insulating property, heat resistance and anti-reactivity, and particularly an insulative heat dissipating body having an excellent thermal cycle reliability and a high withstand voltage. The ceramic laminate 1 according to the present invention is a ceramic laminate in which a ceramic film 3 is formed on a metal layer 2, wherein the ceramic film 3 has a minimum film thickness of 1 ?m or more, contains silicon nitride and inevitable impurities, and has silicon nitride crystal grains having an average grain size of 300 nm or less in the film thickness direction and an average grain size of 500 nm or less in the in-plane direction.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: January 12, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Keisuke Tokuhashi, Keiichi Kimura, Tomohiro Uno, Yutaka Sato
  • Patent number: 10889912
    Abstract: The invention relates to a strip consisting of an aluminium alloy for providing adhesive connections. In addition, the invention relates to a method for producing a strip having a one or two-sided surface structure which consists of an aluminium alloy, at least provided in certain areas and prepared for an adhesive connection, and also relates to a corresponding adhesive connection. The object of providing an aluminium alloy strip optimised for adhesive connections, which has optimised surface properties for ageing-resistant adhesive connections, on the one hand, and which can be cost-effectively produced in a way which is reliable in terms of the process, on the other hand, is achieved for a strip consisting of an aluminium alloy for providing adhesive connections by the strip at least in areas having a surface structure prepared for adhesive connections, wherein the surface structure has depressions which were produced using an electrochemical graining process.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: January 12, 2021
    Assignee: Hydro Aluminium Rolled Products GmbH
    Inventors: Bernhard Kernig, Henk-Jan Brinkman, Kathrin Eckhard, Gernot Nitzsche, Frank Hirschmann
  • Patent number: 10822285
    Abstract: Coating systems are provided for positioning on a surface of a substrate, along with the resulting coated components and methods of their formation. The coating system may include a layer having a compound of the formula: A1?bBbZ1?dDdMO6 where: A is Al, Ga, In, Sc, Y, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Fe, Cr, Co, Mn, Bi, or a mixture thereof; b is 0 to about 0.5; Z is Hf, Ti, or a mixture thereof; D is Zr, Ce, Ge, Si, or a mixture thereof; d is 0 to about 0.5; and M is Ta, Nb, or a mixture thereof.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: November 3, 2020
    Assignee: General Electric Company
    Inventor: Glen Harold Kirby
  • Patent number: 10808404
    Abstract: An elongate profile (1) having a first portion (2) and a second portion (3), the first and second portions (2, 3) being joined together at a first joining portion (JP1), the first and second portions (2, 3) being non collinear, the joining portion (JP1) comprising an array of raised or rebated formations (10a), each formation extending across the joining portion (JP1) in a direction which is non-parallel to the principal axis of the profile and flat lands being provided between successive formations in an array (10A) and the pitch (P) between successive formations in an array being from 2 to 20 times, for example from 5 to 15 times, the thickness (G) of the flatlands.
    Type: Grant
    Filed: September 7, 2015
    Date of Patent: October 20, 2020
    Assignee: Hadley Industries Overseas Holdings Ltd.
    Inventor: Michael Castellucci
  • Patent number: 10801115
    Abstract: A terminal material in which galvanic corrosion is not occurred using a copper or copper alloy base material as a terminal crimped to an end part of an electrical wire formed from an aluminum wire material: an intermediate zinc layer 4 formed from zinc or zinc alloy and a tin layer 5 formed from tin or tin alloy are layered in this order on a base material 2 formed from copper or copper alloy; the intermediate zinc layer 4 has a thickness of 0.1 ?m to 5.0 ?m inclusive and a zinc concentration equal to or more than 5 mass %; and the tin layer 5 has a zinc concentration of 0.4 mass % to 15 mass % inclusive and a grain size of the tin layer 5 is 0.1 ?m to 3.0 ?m inclusive preferably.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: October 13, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Kubota, Yoshie Tarutani, Kiyotaka Nakaya
  • Patent number: 10636985
    Abstract: Disclosed is a substrate for a photoelectric conversion element that is low in cost as compared with a conventional ITO/glass substrate, easy to handle, and does not lower the power generation performance of the solar cell. The substrate for a photoelectric conversion element is made of a stainless steel sheet having a passive film on a surface thereof, an atomic ratio Cr/(Fe+Cr) of the passive film on a surface thereof is 0.08 or more.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: April 28, 2020
    Assignee: JFE STEEL CORPORATION
    Inventors: Takashi Kawano, Shin Ishikawa, Takuya Murakami
  • Patent number: 10603732
    Abstract: It is an object of the present invention to effectively suppress the overflow of brazing material from each joint of a sinter-brazed component, such as a planetary carrier, obtained by brazing a plurality of members together. According to the present invention, there is provided a sinter-brazed component obtained by mating and joining a first member having a first bonding surface and a second member having a second bonding surface to each other. Brazing material is provided between the first bonding surface and the second bonding surface. The first bonding surface has a first recess, the first recess having an inner peripheral wall and a bottom surface. The inner peripheral wall extends along and on an inner side of a profile line of the first bonding surface.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: March 31, 2020
    Assignee: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
    Inventors: Shinichi Hirono, Reiko Okuno
  • Patent number: 10603866
    Abstract: Auxetic structures, low porosity auxetic sheets, systems and devices with auxetic structures, and methods of using and methods of making auxetic structures are disclosed. An auxetic structure is disclosed which includes an elastically rigid body with a plurality of apertures extending through the elastically rigid body and a plurality of protrusions projecting from the elastically rigid body. The apertures and protrusions are arranged in an engineered pattern, such as an array of rows and columns. The apertures are cooperatively configured with the protrusions to provide a predefined porosity while exhibiting stress reduction through negative Poisson's Ratio (NPR) behavior under macroscopic planar loading conditions. In some embodiments, the protrusions, which are elliptical or semispherical dimples, are interposed in square or hexagonal patterns with the apertures, which are S-shaped through slots or circular boreholes.
    Type: Grant
    Filed: January 9, 2016
    Date of Patent: March 31, 2020
    Assignees: President and Fellows of Harvard College, Siemens Canada Limited
    Inventors: Katia Bertoldi, Fabian Enrique Sanchez Guerrero, Farhad Javid, François Jette, Minh Quan Pham, Megan Schaenzer, Ali Shanian
  • Patent number: 10597792
    Abstract: An electrically conductive material for a connection component that includes a Cu—Sn alloy coating layer in which a Cu content is 55 to 70 atomic % and has an average thickness of 0.1 to 3.0 ?m, and a Sn coating layer having an average thickness of 0.2 to 5.0 ?m, which are formed in this order on a surface of a base material made of a copper or copper alloy sheet strip. When a reflected electron image of a material surface is observed with a scanning electron microscope at a magnification of 100 times, a region A and a region B having a higher brightness than the region A and in which the Cu—Sn alloy coating layer is not exposed coexist on the material surface, and an area ratio of the region A on the material surface is 2 to 65%.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: March 24, 2020
    Assignee: Kobe Steel, Ltd.
    Inventors: Masahiro Tsuru, Shinya Katsura
  • Patent number: 10421692
    Abstract: A coated substrate is provided that comprises: a substrate; and a barrier coating comprising a compound having the formula: Ln2ABOs, where Ln comprises scandium, yttrium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, or mixtures thereof; A comprises Si, Ti, Ge, Sn, Ce, Hf, Zr, or a combination thereof; and B comprises Mo, W, or a combination thereof. In one embodiment, B comprises Mo.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: September 24, 2019
    Assignee: General Electric Company
    Inventors: Glen Harold Kirby, Thomas Grandfield Howell