Abstract: Photonic processors are described. The photonic processors described herein are configured to perform matrix-matrix (e.g., matrix-vector) multiplication. Some embodiments relate to photonic processors arranged according to a dual-rail architecture, in which numeric values are encoded in the difference between a pair optical signals (e.g., in the difference between the powers of the optical signals). Relative to other architectures, these photonic processors exhibit increased immunity to noise. Some embodiments relate to photonic processors including modulatable detector-based multipliers. Modulatable detectors are detectors designed so that the photocurrent can be modulated according to an electrical control signal. Photonic processors designed using modulatable detector-based multipliers are significantly more compact than other types of photonic processors.

Abstract: A light barrel configured to filter out stray light of a test light includes a casing and a number of light shield plates arranged within the casing. The light shield plates are parallel to each other and arranged within the casing along a direction in which the light source emits the test light. Each of the light shield plates defines a through hole for light from the test light to pass through. The through holes of the light shield plates are a same size and aligned. The light shield plates sequentially filter out stray light that does not pass through the through holes.

Abstract: An optical reflective component and an optical encoder using the same are disclosed. The optical reflective component includes a main body, an optical pattern, a first attaching portion and a second attaching portion. The main body has a first central axis and a reflective surface perpendicular to each other. The optical pattern is disposed on the reflective surface and centered at the central axis. The first attaching portion is centered at the first central axis of the main body and extends from the man body in a direction parallel to the first central axis. The first attaching portion has an inner wall. The second attaching portion has a plane perpendicular to the first central axis. The plane is connected to the inner wall. The main body, the first attaching portion and the second attaching portion are formed of a metal material and are integrally formed with the optical pattern.

Abstract: Embodiments describe optical imagers that include one or more micro-optic components. Some imagers can be passive imagers that include a light detection system for receiving ambient light from a field. Some imagers can be active imagers that include a light emission system in addition to the light detection system. The light emission system can be configured to emit light into the field such that emitted light is reflected off surfaces of an object in the field and received by the light detection system. In some embodiments, the light detection system and/or the light emission system includes micro-optic components for improving operational performance.

Abstract: A light intensity detecting unit, a display panel, and a method of detecting light intensity are provided. The light intensity detecting unit includes N scanning signal lines, J reading signal lines, at least one enable signal line, N×J photoelectric conversion circuits configured to convert optical signals into electric signals, and at least one gating circuit. Each of the reading signal lines is connected to one or more of at least one gating circuit. Each of the gating circuits is connected to output terminals of a plurality of photoelectric conversion circuits. Each of the scanning signal lines is connected to one or more photoelectric conversion circuits. Each of the enable signal line is connected to one or more of the at least one gating circuit. The gating circuit is configured to transmit the electric signal to the reading signal line in response to an enable signal from the enable signal line.

Abstract: A photodetector includes a semiconductor substrate; a light receiving part for signal detection and an infrared light receiving part which are formed in the semiconductor substrate and are covered at least by first color filters having a common color; and second color filters which overlap with the first color filters on the infrared light receiving part and are configured to block light in a wavelength range transmitting through the first color filters.

Abstract: A sensing module is provided, including a sensing unit. The sensing unit is formed by a plurality of sensing pixels arranged in an array. Each of the plurality of sensing pixels includes a body and a sensing element. The sensing element is disposed on a bottom surface of the body. During sensing, a light may enter and pass through the bodies and be transmitted to the sensing elements. The sensing pixels are divided into at least a first group and a second group from a center of the array to a periphery of the array, and photon collection efficiency of sensing pixels in the first group is less than photon collection efficiency of sensing pixels in the second group. Meanwhile, a design method of a sensing module is also provided.

Abstract: An imaging system has an imager comprising a plurality of jots. A readout circuit is in electrical communication with the imager. The readout circuit can be configured to facilitate the formation of an image by defining neighborhoods of the jots, wherein a local density of exposed jots within a neighborhood is used to generate a digital value for a pixel of the image.

Abstract: A semiconductor device includes light-emitting elements, a selection circuit, a control circuit, light-receiving elements, and switch elements. The selection circuit is configured to accept one input signal and output a signal for selecting an element to emit light among the light-emitting elements. The control circuit is configured to control the light-emitting elements, based on the signal outputted from the selection circuit. The light-receiving elements are each configured to receive light of each of the light-emitting elements and generate a signal for driving a switch, based on a light-receiving state. The switch elements are each configured to be driven by application of voltage outputted from each of the light-emitting elements.

Abstract: In a measuring device for capturing ambient light for use in a motor vehicle, having a light-sensitive detector and an optical element, which is provided and formed to direct ambient light onto the detector, it is essential to the invention that the optical element has an outer lateral surface, a light entry side and a light emission side and that at least one of the two sides, light entry side or light emission side, has a curved surface. The curved surface is at least partially roughened and has a higher roughness than the lateral surface of the optical element.

Abstract: A rotation angle encoder apparatus is disclosed. The rotation angle encoder apparatus may comprise a plurality of light sources, a plurality of light detectors, and a plurality of pinions rotatable about a shaft. Each of the pinions may comprises a plurality of teeth and a plurality of gaps. The rotation angle encoder apparatus may comprise a plurality of stacked configurations such that, when the shaft is rotated, transmissivity may be measured to determine or calculate at least one measurement, such as an angle of rotation, position, movement, distance, or other discernable measurement. The rotation angle encoder apparatus with a plurality pinions and associated measurable transmissivities may enable an optical spectrum analyzer to increase wavelength accuracy and improve resolution in optical measurements.

Abstract: Provided are embodiments including a system for performing aircraft overheat detection using fiber optic monitoring of light reflectance changing temperature strips. Embodiments also include a sensing strip configured to detect a temperature of an object, a controller configured to monitor the sensing strip, and a fiber optic cable configured to transmit or receive a light signal to the sensing strip, wherein the fiber optic cable is operably coupled to the sensing strip and the controller. Embodiments also include a method for operating an aircraft overheat detection system.

Abstract: A measurement device for a light-emitting device includes a light attenuator, a photometric sphere, and a light detector. The light attenuator includes a first surface and a heat dissipator. A first light that is emitted from the first light-emitting device is incident on the first surface. The first surface is configured to absorb a portion of the first light. The heat dissipator is configured to dissipate heat of the first surface. The photometric sphere has an inner surface to reflect the first light reflected by the first surface. The light detector is configured to receive at least a portion of the first light reflected by the inner surface.

Abstract: A photosensitive sensor includes multiple elementary sensors butted together, each elementary sensor comprising a pixel matrix organized in rows, the pixels of each row being connected to conductors of multiple types, column conductors of which are connected to read circuits of the sensor. The sensor moreover comprises, connected to each of the column conductors, a group of components that is separate from the conductor under consideration, the group of components forming a matching impedance of the conductor under consideration. The impedances in each elementary sensor have the same value and the impedances for different elementary sensors have different impedance values so as to balance the link impedances between the various read circuits and the corresponding column conductors for the various elementary sensors.

Abstract: The present technology relates to an imaging apparatus and electronic equipment that can reduce noise. A photoelectric conversion element, a conversion unit that converts a signal from the photoelectric conversion element into a digital signal, a bias circuit that supplies a bias current for controlling a current flowing through an analog circuit in the conversion unit, and a control unit that controls the bias circuit on the basis of an output signal from the conversion unit are provided, and at the start of transfer of a charge from the photoelectric conversion element, the control unit boosts a voltage at a predetermined position of the analog circuit. The conversion unit converts the signal from the photoelectric conversion element into a digital signal using a slope signal whose level monotonously decreases with time. The present technology is applicable to, for example, an imaging apparatus.

Abstract: A solid state imaging device includes: a pixel array unit that has a plurality of pixels 2-dimensionally arranged in a matrix and a plurality of signal lines arranged along a column direction; A/D conversion units that are provided corresponding to the respective signal lines and convert an analog signal output from a pixel through the signal line into a digital signal; and a switching unit that switches or converts the analog signal output through each signal line into a digital signal using any of an A/D conversion unit provided corresponding to the signal line through which the analog signal is transmitted, and an A/D conversion unit provided corresponding to a signal line other than the signal line through which the analog signal is transmitted.

Abstract: A solid state imaging device includes: a pixel array unit that has a plurality of pixels 2-dimensionally arranged in a matrix and a plurality of signal lines arranged along a column direction; A/D conversion units that are provided corresponding to the respective signal lines and convert an analog signal output from a pixel through the signal line into a digital signal; and a switching unit that switches or converts the analog signal output through each signal line into a digital signal using any of an A/D conversion unit provided corresponding to the signal line through which the analog signal is transmitted, and an A/D conversion unit provided corresponding to a signal line other than the signal line through which the analog signal is transmitted.

Abstract: A dark current compensation circuit comprises a first comparator having inputs for a detection signal and a first voltage, and a second comparator having inputs for the detection signal and a second voltage. The dark current compensation circuit also comprises a controller coupled to the first and second comparators, which has an input for an event signal. An adjustable current source is coupled to the controller and configured to generate a compensation current. The controller adjusts a value of the compensation current based on the first and second comparator outputs and maintains a constant value in response to the event signal indicating photons incident on a photon detector. In some implementations, the dark current compensation circuit further comprises an analog sub-circuit coupled to the adjustable current source and configured to receive the detection signal. The analog sub-circuit generates an analog compensation current in response to the detection signal.

Abstract: An image sensor includes a first unit pixel group including a plurality of photoelectric conversion elements forming a first shared pixel and configured to generate photocharges in response to an incident light, the first unit pixel group further including first transistor elements and first floating diffusion regions configured to store the generated photocharges; and a second unit pixel group located adjacent to the first unit pixel group and including a plurality of photoelectric conversion elements forming a second shared pixel and configured to generate photocharges in response to the incident light, the second unit pixel group further including second transistor elements and second floating diffusion regions configured to store the photocharges, wherein the first shared pixel includes some of the first transistor elements and some of the second transistor elements.

Abstract: The present invention achieves a multiple-optical-axis photoelectric sensor which can be assembled with reduced effort. A multiple-optical-axis photoelectric sensor (100) includes a light projector (110) and a light receiver (120) each having an outer shape defined by a housing (1) including: an outer case (10); a light-transmitting plate (15); and a pressing member (20). Supporting parts (11b) are provided at respective inner surfaces of side plates of the outer case. Extending parts (11c) are provided at end parts of the corresponding side plates. The pressing member is configured to press the light-transmitting plate against the supporting parts by being attached to the respective extending parts.