Abstract: A thin laminate film structure comprises a first metallic lamina formed on a surface of a first dielectric lamina and a third lamina formed on a surface of the first metallic lamina opposite the first dielectric lamina. Electrical and mechanical properties of the thin laminate film structure may be determined and/or optimized separately. The first metallic lamina and the first dielectric lamina may comprise aluminized mylar. The third lamina may or may not be made of a dielectric material. The thin laminate film structure may further comprise a second metallic lamina formed on a surface of the third lamina opposite the first metallic lamina and a second dielectric lamina formed on a surface of the second metallic lamina opposite the third lamina. In such a case, the thin laminate film structure allows dual-direction actuation of electrostatically and/or magnetically driven devices, such as microdevice valves, in which the thin laminate film structure may be employed.