Patents Examined by Kevin M. Picarday
  • Method for encapsulating light emitting diodes
    Patent number: 5516727
    Abstract: A method of encapsulating semiconductor light emitting diodes, in particular laser diodes, characterized in that a gap is formed in an encapsulant, which is positioned in front of the light emitting facet of the diode, the gap preventing the encapsulant from adhering to the light emitting facet.
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: May 14, 1996
    Assignee: International Business Machines Corporation
    Inventor: Ronald F. Broom