Patents Examined by Kevin M. Pilardas
  • Processing microchips
    Patent number: 5411918
    Abstract: Uniaxially conductive connector formed in situ on microchip by laser drilling an insulating layer at least 5 micrometers thick to provide holes communicating with the chip bonding sites, and depositing metal in the holes to establish electrical connection with the bonding sites. Excimer U.V. laser ablation of a polyimide insulating layer is preferred, followed by removal of a surface layer (preferably of amorphous polyamide from the insulating layer to expose the ends of the metal deposited in the holes.
    Type: Grant
    Filed: March 18, 1993
    Date of Patent: May 2, 1995
    Assignee: Raychem Limited
    Inventors: Edward A. Keible, Nicholas J. G. Smith