Abstract: An opto-isolator with a correction circuit is disclosed. The correction circuit is configured to make adjustments for degradation of the light source of the opto-isolator. The correction circuit may comprise a photodetector for detecting degradation of the light source of the opto-isolator. When the light source degrades below a predetermined level, the correction circuit may be configured to make adjustments.

Abstract: Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels, analog control circuitry and storage and processing circuitry. The array of image pixels, the analog control circuitry, and the storage and processing circuitry may be formed on separate, stacked semiconductor substrates or may be formed in a vertical stack on a common semiconductor substrate. The image pixel array may be coupled to the control circuitry using vertical metal interconnects. The control circuitry may route pixel control signals and readout image data signals over the vertical metal interconnects. The control circuitry may provide digital image data to the storage and processing circuitry over additional vertical conductive interconnects coupled between the control circuitry and the storage and processing circuitry. The storage and processing circuitry may be configured to store and/or process the digital image data.

Abstract: A color sensitive image sensor includes first, second, and third image sensor layers vertically aligned in an image sensor stack. Each of the image sensor layers includes a pixel array oriented to generate image data in response to light incident on the image sensor stack and readout circuitry coupled to the pixel array to readout the image data. A first optical filter layer is disposed between the first image sensor layer and the second image sensor layer and has a first edge pass filter characteristic with a first cutoff wavelength. A second optical filter layer is disposed between the second image sensor layer and the third image sensor layer and has a second edge pass filter characteristic with a second cutoff wavelength offset from the first cutoff wavelength.

Abstract: A structured illumination microscopy optical arrangement includes a projection path and an imaging path. The imaging path includes an imaging sensor and imaging optical elements. The projection path includes a light generator, a pattern generating element such as a spatial light modulator (SLM), and projection optical elements including an output lens and a projector artifact suppression element (PASE) located in the projection path between the SLM and the output lens. The PASE may include birefringent material which splits respective light rays of the structured illumination pattern source light to provide at least one replication of the structured illumination pattern with an offset transverse to the projection path. The offset replication of the structured illumination pattern increases the accuracy of the system by reducing spatial harmonic errors and spurious intensity variations due to projector pixel gap artifacts which may otherwise produce errors in resulting Z-height measurements.

Abstract: To make miniaturization of a laser module easier. In the laser block of a laser module, multiple semiconductor laser elements that each emit a beam of laser light are disposed. A collimating lens receives and collimates the individual beams of laser light emitted from the laser block, and emits collimated light. Photodiodes detect the individual beams of collimated light emitted from the collimating lens, and output signals corresponding to the intensities of the individual beams of collimated light. Additionally, the photodiodes are disposed on the propagation paths of collimated light emitted from the collimating lens, and in addition, are disposed at positions that receive a portion of collimated light for all the individual beams of collimated light which are emitted.

Abstract: An image sensor includes a photosensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photosensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.

Abstract: An analytical instrument may have multiple distinct channels. Such may include one or more illumination sources and sensors. Illumination may be delivered to specific locations of a specimen holder, and returned illumination may be delivered to specific locations of a sensor array. Illumination may first pass a specimen, and a mirror or reflector may then return the illumination past the specimen. Optical splitters may be employed to couple pairs of fiber optics proximate a specimen holder. Such channels may further include a plurality of illumination sources positioned on one side of a specimen holder and a plurality of sensors on the other side. The plurality of sensor may capture image of a specimen and a spectrophotometer may concurrently scan the specimen. A plurality of specimens may be imaged and scanned in a single pass of a plurality of passes. Spherical or ball lenses may be placed in an optical path of the illumination to achieve a desired illumination pattern.

Abstract: A pixel of an image sensor includes a color filter configured to pass visible wavelengths, and an infrared cut-off filter disposed on the color filter configured to cut off infrared wavelengths.

Abstract: Disclosed is a portable handheld characteristic analyzer used to analyze chemical compositions in or near real-time. One method of using the analyzer to determine a characteristic of a sample includes directing the handheld characteristic analyzer at the sample, the handheld characteristic analyzer having at least one integrated computational element arranged therein, activating the handheld characteristic analyzer, thereby optically interacting the at least one integrated computational element with the sample and generating optically interacted light, receiving the optically interacted light with at least one detector arranged within the handheld characteristic analyzer, generating an output signal corresponding to the characteristic of the sample with the at least one detector, receiving the output signal with a signal processor communicably coupled to the at least one detector, and determining the characteristic of the sample with the signal processor.

Abstract: An optical detector module includes a carrier, a photodetector secured to a top surface of the carrier and having a light detecting portion, an anode terminal, and a cathode terminal, an amplifier circuit secured to the top surface of the carrier and having a first edge, an input terminal, and a GND terminal. The input terminal and the GND terminal are located along the first edge. A first wire connects the anode terminal to the input terminal, and to a composite component secured to the top surface of the carrier and having a metal portion and a resistive portion integrated together. The metal portion is in contact with the carrier. A capacitor, having a top surface electrode and a bottom surface electrode is secured to the carrier.

Abstract: A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device has a first substrate provided with a photoelectric converter on its primary face, a first wiring structure having a first bonding portion which contains a conductive material, a second substrate provided with a part of a peripheral circuit on its primary face, and a second wiring structure having a second bonding portion which contains a conductive material. In addition, the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. Furthermore, the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films.

Abstract: An image sensor comprises plural sets of a unit pixel outputting a pixel signal based on an electric charge generated through photoelectric conversion and a conversion unit converting the pixel signal into a digital signal. A reference signal source generates reference signals and supplies the generated reference signals to the conversion unit through signal lines. The conversion unit of each set comprises a comparator which compares the level of the reference signal with that of the pixel signal, a count circuit which counts a clock based on the comparison processing, a selection circuit which selects, among the signal lines, a signal line to be selectively connected to the input of the comparator, and a switch which selectively connects the selected signal line to the input of the comparator, and selectively connects a load to an unselected one of the signal lines.

Abstract: A sensor and a method of detecting a target analyte are provided. The sensor includes a substrate; a layer comprising a plurality of through holes, wherein the layer is disposed above the substrate; a first element configured to detect a target analyte; a second element that can produce a detectable signal; wherein the first element and the second element are configured to couple the target analyte between the first element and the second element.

Abstract: According to one embodiment, a light receiving circuit includes a light receiving element, a differential circuit, a fifth transistor, and first and second current sources. The differential circuit includes an amplifier and a bias circuit. The amplifier includes a first transistor, a second transistor, and a first feedback resistor. The amplifier is configured to convert a current from the light receiving element into a voltage. The bias circuit includes a third transistor, a fourth transistor, and a second feedback resistor. A reference voltage is supplied to a control electrode of the fourth transistor. The second and third transistors are included in a current mirror circuit. A fifth transistor has a control electrode connected to a connection point between the first and second transistors. A voltage signal switched to a high level or a low level according to a change of an optical signal is outputted.

Abstract: A method for controlling an intensity of light entering a vehicle is provided. The method includes determining an operational status of a display device in the path of the light entering the vehicle, and receiving, by a computing device, an intensity of light present in the vehicle using at least one light sensor. The method also includes comparing the intensity of light with a predefined intensity threshold, and activating a light damping mechanism when the measured light intensity exceeds the predefined intensity threshold and when the operational status of the display device is active, wherein the light damping mechanism facilitates at least one of reducing the intensity of light interacting with the display device and reducing light from the display device reflecting off a window.

Abstract: An optical submount has a circumscribed 4-faced depression on its bottom surface and a 3-faced depression at an edge of its bottom surface. An optical signal is transmitted through a face of the 3-faced depression and internally reflected from a face of the 4-faced depression. A set of additional depressions and intervening areas on the submount bottom surface act as an alignment mark.

Abstract: A photoelectric conversion device includes a circuit board, light-emitting modules, light-receiving modules, an optical coupling module, and a protecting member. The light-emitting modules and the light-receiving modules are mounted on the circuit board. The optical coupling module is mounted on the circuit board, and includes first and second optical surfaces, a reflection surface, first converging lenses formed on the first optical surface and corresponding to the light-emitting modules and the light-receiving modules, and second converging lenses formed on the second optical surface and corresponding to the first converging lenses. The protecting member is mounted on the circuit board to shield the optical coupling module, the light-emitting modules, and the light-receiving modules, and only exposes the second converging lenses.

Abstract: An image sensor includes a pixel array including a plurality of unit pixels, each having a photodiode, a transfer transistor, a reset transistor, a drive transistor, and a select transistor, an analog to digital converter for sampling an analogous sensing signal from the pixel array and converting the analogous sensing signal into a digital sensing signal, and a timing controller for forwarding a transfer signal which turns on the transfer transistor until after sampling the sensing signal.

Abstract: A method for reading a pixel, including at least two integration periods, at least one of said periods including at least one integration sub-period, wherein an output value of the pixel is determined by taking into account the amounts of photogenerated charges contained in the pixel at the end of each of said periods and the amount of photogenerated charges stored in a photodiode of the pixel beyond a threshold during said at least one sub-period.

Abstract: The invention relates to a test method for testing the operability of an optical sensor for monitoring a monitored zone in which at least one test object is used which is located in a detection zone of the sensor including the monitored zone. Provision is made in accordance with the invention that the test object is changed during the carrying out of the test method with respect to its position, alignment or its optical properties and produces a test signal when the change cannot be detected in the expected manner. The invention further relates to an optical sensor for monitoring a monitored zone, wherein the test method in accordance with the invention can be used.