Patents Examined by Kevn M. Picardat
  • Patent number: 7208392
    Abstract: A method of creating an electrically conducting bonding between a face of a first semiconductor element and a face of a second semiconductor element using heat treatment. The method applies the faces one against the other with the placing between them of at least one layer of a material configured to provide, after heat treatment, an electrically conducting bonding between the two faces. The deposited layers are chosen so that the heat treatment does not induce any reaction product between said material and the semi-conductor elements. Then, a heat treatment is carried out.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: April 24, 2007
    Assignee: Soitec
    Inventors: Claude Jaussaud, Eric Jalaguier, Roland Madar