Abstract: A flexible two-phase conversion heat transfer device includes a main body enclosing a chamber. A working liquid is received in the chamber. A capillary structure body is disposed in the chamber. The main body has at least one bellows section. The bellows section has multiple waved stripes. The waved stripes at least have a waved stripe feature including a waved stripe height or a waved stripe width or a waved stripe pitch between each two adjacent waved stripes. By means of the different waved stripe features, the main body is bendable by an angle ranging from 0-180 degrees without interference between the waved stripes.

Abstract: An evaporation unit includes a first and second pipe conduits. The first and second pipe conduits each include a near-end part, a long circumference part, a junction part, a short circumference part, and a far-end part. Around a storage chamber, the first long circumference part extends in a first direction, the first junction part turns, and the first short circumference part extends in the first or second direction. The second short circumference part extends in the first direction, the second junction part turns, and the second long circumference part extends in the first or second direction. The first and second turning part located at the same position counted from the respective near-end part sides are disposed respectively on wall surfaces facing each other.

Abstract: The present invention provides a flexible wick structure and a deformable heat-dissipating unit using the same. The heat-dissipating unit comprises a heat-dissipating body and a flexible wick structure. The heat-dissipating body has an upper plate, a chamber, and a lower plate. The flexible wick structure is disposed in the chamber and has a wick body and plural extension portions being able to be elastically deformed under compression; the extension portions extend outwards from a side of the wick body to carry the wick body. In addition, the extension portions and the wick body together define an axial-displacement space; the wick body or the extension portions are in contact with an inner side of the upper plate or the low plate.

Abstract: A vapor chamber with structure for enhancing two-phase flow boiling includes a main body formed of a first and a second plate member, which are correspondingly closed to each other to define an airtight chamber between them. The airtight chamber has a condensing side and an evaporating side and has a working fluid filled therein. The evaporating side is formed on its surface with a plurality of projected sections and a plurality of recessed sections and has a wick structure provided thereon. The projected sections extend through and project beyond the wick structure, and the recessed sections are located below the wick structure without being filled by the wick structure to thereby form spaces for receiving the working fluid. The provision of the projected and the recessed sections enables the vapor chamber to provide largely enhanced two-phase flow boiling effect in the airtight chamber.

Abstract: A controlling unit controls a refrigerant circuit and a flow path switching mechanism to perform a first humidity control operation or a second humidity control operation. In the first humidity control operation, a bypass passage is closed, and outside air is supplied into a room through one of first and second adsorption heat exchangers, and room air is exhausted to outside through the other of the first and second adsorption heat exchangers. In the second humidity control operation, the bypass passage is opened, and the outside air is supplied into the room through one of the first and second adsorption heat exchangers and the bypass passage, and room air is exhausted to outside through the other of the first and second adsorption heat exchangers.

Abstract: A wick sheet for a vapor chamber is sandwiched between a first sheet and a second sheet of the vapor chamber that encloses a working fluid. The wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a penetration space that penetrates the sheet body, a first groove assembly that is disposed on the second body surface and that communicates with the penetration space, and the second groove assembly that is disposed on the first body surface and that communicates with the penetration space. The flow channel cross-sectional area of a second mainstream groove of the second groove assembly is greater than the flow channel cross-sectional area of a first mainstream groove of the first groove assembly.

Abstract: A loop type heat pipe includes: an evaporator that vaporizes working fluids; a first condenser and a second condenser that liquefy the working fluids respectively; a first liquid pipe that includes a first flow channel and connects the evaporator and the first condenser to each other; a second liquid pipe that includes a second flow channel and connects the evaporator and the second condenser to each other; and a first vapor pipe that connects the evaporator and the first condenser to each other; and a second vapor pipe that connects the evaporator and the second condenser to each other. The evaporator includes: a third flow channel connected to the first liquid pipe and the first vapor pipe; a fourth flow channel connected to the second condenser and the second vapor pipe; and a partition wall that partitions the third flow channel and the fourth flow channel from each other.

Abstract: A floating heat pipe assembly includes a floating heat pipe and a clamp collar used with the floating heat pipe. The floating heat pipe has a flattened section that has a flattened pipe size smaller than a pipe size of any other section of the floating heat pipe, so that the floating heat pipe is adjustable at the thinner flattened section for other sections of the floating heat pipe located at two opposite ends of the flattened section to displace to two positions having a height difference between them. The clamp collar is fitted on around the flattened section and includes two symmetrically arranged elastic clamping sections that elastically clamp on two opposite outer sides of the flattened section to hold the same in place, so that the sections of the floating heat pipe located at different heights do not deform to cause reduced or failed capillary action efficiency.

Abstract: A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.

Abstract: A heat dissipation unit with floating section includes an upper plate and a lower plate, which are closed together to define a chamber in between them, and the chamber has a working fluid filled therein. The upper and the lower plate respectively include a front section, a read section, and a middle section located between the front and the rear section. The front section and the rear section of one or both of the upper and the lower plate have a plate thickness larger than that of the middle section, such that the middle sections form flexible floating sections that allow for a floating adjustment thereat, making the front and the rear sections of the heat dissipation unit to be located at two positions having a height difference between them.

Abstract: A water cooling system for showers has a water tank filled with water to be cooled, and a heat exchange loop which includes an internal heat exchange (HX) evaporator immersed into the water within the water tank, and a condenser HX unit positioned externally above the internal evaporator unit. A refrigerant in the loop absorbs the heat from the water in the water tank, circulates in the HX loop, and passes to the condenser HX unit to release heat to ambient air. The water cooling process is passive and does not require any form of external energy. The subject heat transport attains a minimal thermal resistance by two-phase evaporation and condensation process (heat piping) which achieves positive flow at as low as 0.2° C.-1° C. temperature difference between the ambient air and the tank water.

Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.

Abstract: A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation plate. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation plate is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.

Abstract: A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.

Abstract: Disclosed are systems and methods of flexibly cooling thermal loads by providing a complex compound system for burst mode cooling, a vapor compression system for ancillary cooling, and a thermal storage system for helping efficiently maintain and cool a thermal load such as a directed energy weapon system.

Abstract: A system and method of controlling corrosion of a heat exchanger, having a hot gas inlet and outlet and a cold side inlet and outlet. The method includes determining a temperature of the heat exchanger at a first selected location, controlling a temperature of a corrosion sensing device to a first selected temperature based on the temperature of the surface of the heat exchanger and determining a corrosion rate associated with the heat exchanger surface at the first selected location for the first selected temperature. The method also includes comparing the corrosion rate to an expected corrosion rate, determining a cold side fluid inlet temperature target for the heat exchanger based at least in part on the comparing, the determined corrosion; and controlling a cold side fluid inlet temperature based at least in part on the determined inlet temperature target, determined corrosion rate, and expected corrosion rate.

Abstract: The present invention provides a stack-type vertical heat dissipation device comprising an evaporator unit and a condenser unit. The evaporator unit has a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state. The condenser unit is stacked on a top side of a housing of the evaporator unit, and is provided therein with a flow channel that is in communication with the evaporator unit and allows passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle.

Abstract: A heat exchanger 100 includes: an inner cylinder 10 through which a first fluid can flow, the inner cylinder 10 being configured to be capable of housing a heat recovery member 40; an outer cylinder 20 disposed so as to be spaced on a radially outer side of the inner cylinder 10 such that a second fluid can flow between the outer cylinder 20 and the inner cylinder 10; and an intermediate cylinder 30 disposed between the inner cylinder 10 and the outer cylinder 20, the intermediate cylinder 30 partitioning a flow path for the second fluid into an inner flow path 31b and an outer flow path 31a. In the heat exchanger, the intermediate cylinder 30 includes communication holes 32 that are communicated in a radial direction, and the communication holes 32 are provided in an axial direction of the intermediate cylinder 30.

Abstract: Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.