Patents Examined by Khem Nguyen
  • Patent number: 5752846
    Abstract: An IC socket is provided for obtaining a contact pressure between a contact of a socket body and a lead of an IC package placed on the contact by pressing down an IC package body or the IC lead by an IC presser. The IC socket comprises a cover movably mounted on an upper portion of the socket body for upward and downward movement, and a pressing lever. The pressing lever is axially pivotably supported with respect to the socket body, an external end of the pressing lever being linked to the cover so as to be moved upwardly and downwardly in response to the upward and downward movement of the cover.
    Type: Grant
    Filed: December 29, 1995
    Date of Patent: May 19, 1998
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Shunji Abe
  • Patent number: 5601450
    Abstract: A bolt provided on a female connector housing is tightened relative to a nut, provided on a male connector housing, displacing the two connector housings relative to each other in a connecting direction, thereby fitting them together. An upwardly-extending, bar-like projection portion is provided on the male connector housing. A detection member is provided in an insertion hole formed in the female connector housing. When the two connector housings are displaced relative to each other in the connecting direction, the projection pin and the detection member cooperate to indicate a fitting-completed condition, enabling easily perceived completion of the connection. Alternatively, the male and female connector housings include electrically engageable sensing elements that indicate the fitting-completed condition.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 11, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Akira Nabeshima, Kaoru Watanabe, Toshikazu Saba