Patents Examined by Khiem M. Nguyen
  • Patent number: 11502458
    Abstract: A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating frame, a first metal shield and a second metal shield. The first metal shield includes a first elastic piece, and the second metal shield includes a second elastic piece. The second backplane connector includes a number of second differential signal terminals, an insulating block sleeved on the second differential signal terminals, and a metal shell sleeved on the insulating block. When the first backplane connector is mated with the second backplane connector, the first elastic piece and the second elastic piece are in contact with the metal shell to increase the grounding shielding area, reduce crosstalk and improve the quality of signal transmission.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: November 15, 2022
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Tao Song, Kun Liu, Rongzhe Guo, Chuanqi Gong, Xiaogang Liu, Ming Li
  • Patent number: 11495918
    Abstract: A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: November 8, 2022
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.
    Inventors: Tao Song, Kun Liu, Rongzhe Guo, Chuanqi Gong, Xiaogang Liu, Ming Li
  • Patent number: 11485391
    Abstract: Disclosed is a train coupler connector module for electrically coupling a first rail vehicle to a second rail vehicle, the module including: a fixing block with an inner side able to be mounted on an electrical train coupler; a plurality of contact units arranged side by side in the fixing block, each contact unit having a first end facing the inner side of the fixing block and a second end extending outwards from the fixing block, one of the first and second end being a female contact and the other being a male contact; wherein at least one of the contact units is arranged to be individually removable from the fixing block in a direction outwards from the fixing block.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: November 1, 2022
    Assignee: DELLNER COUPLERS AB
    Inventor: Bo Nilsson
  • Patent number: 11489292
    Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: November 1, 2022
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 11469553
    Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: October 11, 2022
    Assignee: FCI USA LLC
    Inventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Patent number: 11469554
    Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: October 11, 2022
    Assignee: FCI USA LLC
    Inventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
  • Patent number: 11456585
    Abstract: An electrical wall plate having a front face plate, an opposing rear plate face, at least one electrical device opening extending through both the front plate face and rear plate face, and at least one movable extension member configured to move and extend away from and also back toward the front plate face and support at least one electronic accessory device placed on the movable extension member is provided.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: September 27, 2022
    Inventors: Jeffrey P. Baldwin, John E. Klein
  • Patent number: 11450982
    Abstract: An electrical connector assembly which has a housing formed of a first photocurable polymer composition. Signal contacts are positioned in the housing for transmitting signals at a determined signal speed. A dielectric constant of the photocurable polymer composition is tuned to have a higher or lower dielectric constant to be compatible with the desired signal performance characteristics of the signals transmitted over the signal contacts in the housing.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: September 20, 2022
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventors: David Patrick Orris, Jessica H. B. Hemond
  • Patent number: 11437754
    Abstract: A plug-connector module for electrical contacts in the vehicle sector features the following: at least two contact elements that each feature at least one contact opening for receiving an electrical contact, and each features at least one first engagement device; and at least one positioning element for connecting the contact elements. For this purpose, the positioning element includes at least two second engagement devices that are configured complementary to the first engagement devices. Each contact element features at least one positioning opening for pushing-through the at least one positioning element. Furthermore, the present disclosure relates to a method for connecting at least two contact elements to a plug-connector module.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: September 6, 2022
    Assignee: Lisa Draexlmaier GmbH
    Inventor: Ulrich Egenhofer
  • Patent number: 11431117
    Abstract: A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: August 30, 2022
    Assignee: Lockheed Martin Corporation
    Inventors: Samuel Muen Shyu, Raymond Yu, Robert James Hill
  • Patent number: 11432411
    Abstract: A device for connecting one or more electrical connectors to a printed circuit board includes a casing, a printed circuit board supported within the casing, and a miniaturized connector system. The miniaturized connector system includes a connector element mounted on a main side of the printed circuit board. The connector element includes a main body connected to the printed circuit board and defining a receptacle, and a metal terminal electrically connected to the printed circuit board. The metal terminal is arranged inside the receptacle and cooperates with a terminal of a cable. The miniaturized connector system includes an auxiliary portion of the main body arranged on an extension of the main body and defining an extension portion of the receptacle. The auxiliary portion is an integral part of a portion of the casing and has at least one seat receiving the printed circuit board and positioning the printed circuit board.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: August 30, 2022
    Assignee: TE Connectivity Italia Distribution S.r.l.
    Inventors: Marcello Farinola, Cinzia Alferi, Arianna Spolverato, Claudia Cezza, Alessandro Genta
  • Patent number: 11431129
    Abstract: An electrical connector includes: a housing; and plurality terminal groups held on the housing, each terminal group including a pair of signal terminals, a first shielding sheet for shielding the pair of signal terminals on at least one side, and a second shielding sheet for shielding the signal terminals on at least another side; wherein the first shielding sheet and the second shielding sheet of each terminal group are electrically connected, and the first shielding sheet of one of the terminal groups is electrically connected to the second shielding sheet of an adjacent terminal group.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: August 30, 2022
    Assignees: FU DING PRECISION INDUSTRIAL (ZHENGZHOU) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Rui-Qin Wang, Yen-Chih Chang
  • Patent number: 11431128
    Abstract: An electrical connector includes: an insulating housing; plural terminals held on the insulating housing, the terminals are arranged in terminal pairs for transmitting differential signals; and plural shielding sheets held on the insulating housing, each of the shielding sheets includes: at least two walls shielding the terminal pair in at least two directions, and plural elastic pieces extending from the at least two walls in order to cooperate with a mating connector; wherein the elastic pieces of each shielding sheet include an inner elastic piece protruding toward an associated terminal pair and an outer elastic piece protruding away from the associated terminals pair.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: August 30, 2022
    Assignees: FU DING PRECISION INDUSTRIAL (ZHENGZHOU) CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Meng Liu, Shih-Wei Hsiao, Yu-San Hsiao, Yen-Chih Chang, Yu-Ke Chen, Jhih-Yao Jiang
  • Patent number: 11424570
    Abstract: A connector includes: an outer housing that includes an inserting part having a tubular shape, and is fixed to a first surface of a wall part in a state in which the inserting part is inserted into a hole part of the wall part; and an inner housing including a main body that is inserted into the hole part from a second surface side to be engaged with the outer housing, and a projecting part projecting from the main body. The projecting part projects from the main body toward a rear side in an insertion direction with respect to the hole part, and is configured such that a rear end surface of the projecting part is located to be flush with the second surface when the main body is completely engaged with the outer housing.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: August 23, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Tetsuya Sekino, Toshinori Yamamoto
  • Patent number: 11424563
    Abstract: A method for manufacturing a board-to-board connecting structure, including providing a first circuit board, including a first dielectric layer, a second dielectric layer stacked on the first dielectric layer, and a first wiring layer sandwiched between the first dielectric layer and the second dielectric layer. A second circuit board is provided, including a third dielectric layer, a fourth dielectric layers stacked on the third dielectric layer, and a second wiring layer sandwiched between the third dielectric layer and the fourth dielectric layer. The first step and the fourth dielectric layer are bonded through a first adhesive layer. The third step and the dielectric layer are bonded through a second adhesive layer. The second step and the fourth step are bonded through the conductive layer.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: August 23, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD, GARUDA TECHNOLOGY CO., LTD
    Inventors: Xiao-Feng Zheng, Xiao-Peng Rong
  • Patent number: 11417982
    Abstract: A connector includes a housing fittable with a fitted portion of a counterpart housing of a counterpart connector. The housing includes a base and a fitting portion. The fitting portion is integrated with the base and fittable with the fitted portion. The fitting portion extends in a direction intersecting a fitting direction with respect to the counterpart housing and faces the base. The fitting portion includes a wall configured to close an opening of the fitted portion when the fitting portion is fitted with the fitted portion.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: August 16, 2022
    Assignee: HIROSE ELECTRIC CO., LTD.
    Inventor: Koichi Nakamura
  • Patent number: 11411338
    Abstract: A CPU socket has an insulative housing equipped with two groups of contacts of different pitches from each other wherein either each group of contacts are arranged with the corresponding contacting arms extending in opposite directions to counterbalance the imposed/reaction forces itself or the two group of contacts are arranged with the corresponding contacting arms extending in opposite direction to somewhat counterbalance the imposed/reaction force during receiving a CPU therein, and or in a mixed manner, i.e., one group of contact with the corresponding contacting arms in the same direction while the other of contacts with the corresponding contacting arms extending in both opposite directions to achieve the total reaction forces in a substantial balanced manner.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: August 9, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shan-Yong Cheng, Chao-Chieh Chen, Ming-Lun Szu
  • Patent number: 11411351
    Abstract: A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins.
    Type: Grant
    Filed: December 27, 2020
    Date of Patent: August 9, 2022
    Assignee: GITech, Inc.
    Inventor: John Williams
  • Patent number: 11404826
    Abstract: A high voltage connector assembly having improved female and male housings with a female terminal position assurance (TPA) device, and a method for improving clearance and creepage of the electrical path in the high voltage connector assembly. The female housing includes an intermediate upper portion having apertures for respectively receiving front downward extending members of frontward extending members of the female TPA device to finally lock high voltage electrical terminals in the female housing, and to place the female TPA device in a full-lock position inside the female housing.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: August 2, 2022
    Assignee: J.S.T. CORPORATION
    Inventor: David Demaratos
  • Patent number: 11387607
    Abstract: An electrical connector assembly includes a plurality of signal terminals, a plurality of grounding terminals, and an elastic conductor. Each of the signal terminals corresponds to a first signal bump. Each of the grounding terminals is adjacent to the signal terminal and corresponds to a first grounding bump. The elastic conductor has a plurality of elastic conducting portions and is disposed on a carrier. An interconnect device is also provided. The interconnect device includes the electrical connector assembly, the carrier, and a chip. The signal terminals and the grounding terminals of the electrical connector are electrically connected to the first signal bumps and the first grounding bumps of the carrier through compressing the elastic conducting portions of the elastic conductor.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: July 12, 2022
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventor: Rong-Zhe Guo