Patents Examined by Kiley A Stoner
  • Vacuum soldering apparatus and control method therefor
    Patent number: 9676048
    Abstract: In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients ? plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient ? in the evacuation control property.
    Type: Grant
    Filed: December 25, 2013
    Date of Patent: June 13, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tsutomu Hiyama, Hiroyuki Inoue, Shunsuke Kimoto, Tomotake Kagaya
  • Electrode cartridge for pulse welding
    Patent number: 9676054
    Abstract: A cartridge assembly for a tool includes a cartridge body or casing that contains a conductor. A conductor is connected to a pulse generator or source of stored charge that is discharged to vaporize the conductor and create an electro-hydraulic or electro-magnetic shockwave that is used to impact or pulse weld two parts together.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: June 13, 2017
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: John Joseph Francis Bonnen, Sergey Fedorovich Golovashchenko, Alexander Mamutov, Lloyd Douglas Maison, Scott Alwyn Dawson, James deVries
  • Laser guided nano-brazing method for reinforced aluminum composite material having high volume fraction silicon carbide particles
    Patent number: 9662729
    Abstract: A laser guided nano-brazing method for a reinforced aluminum composite material having high volume fraction silicon carbide particles, comprising 4 steps: nanocrystallizing the surface of the reinforced aluminum composite material having high volume fraction silicon carbide particles, preparing solder material, assembling pieces to be soldered, and dual-beam laser brazing. The use of nano-technology for the brazing of reinforced aluminum composite material having high volume fraction silicon carbide particles, and the use of dual-beam laser technology for brazing temperature field control enhance the humidity during the brazing process of said material and filling ability of the solder material, and satisfy the strict requirements of electronic packaging.
    Type: Grant
    Filed: April 27, 2013
    Date of Patent: May 30, 2017
    Assignee: Henan Jingtai Aerospace High-Novel Materials Technology Co., Ltd.
    Inventors: Jitai Niu, Dongfeng Cheng, Zeng Gao, Peng Wang, Qiang Li, Baoqing Zhang, Erzhen Mu, Sijie Chen, Hengze Xian, Gang Zeng, Xitao Wang
  • Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method
    Patent number: 9662748
    Abstract: There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200° C. or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: May 30, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Hiromasa Miyoshi, Takashi Hinotsu, Satoru Kurita, Yoshiko Kohno
  • Electronic component mounting system and electronic component mounting method
    Patent number: 9661793
    Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: May 23, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Katsuhiko Itoh, Mitsuo Nakamura, Daisuke Nagai, Kenji Okamoto
  • Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
    Patent number: 9660176
    Abstract: A method of manufacturing an electronic device including an electronic element, a base substrate, and a lid member, includes joining the lid member to the sealing part by application of an energy beam so that a plate thickness of the lid member may be larger in a part joined to the sealing part than in a part located inside of the part in a plan view along the thickness direction.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: May 23, 2017
    Assignee: Seiko Epson Corporation
    Inventor: Hideo Miyasaka
  • Method of making a bracket assembly for a brake assembly
    Patent number: 9649720
    Abstract: A method of making a bracket assembly for a brake assembly. The method may include friction welding a brake wing to a camshaft tube that may receive a camshaft for actuating a brake pad assembly. Rotation of the brake wing and/or the camshaft tube about an axis may be controlled to fix an angular position of the brake wing with respect to the camshaft tube within a predetermined tolerance.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: May 16, 2017
    Assignee: ArvinMeritor Technology, LLC
    Inventor: Peter Moss
  • Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
    Patent number: 9649712
    Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: May 16, 2017
    Assignee: Entegris, Inc.
    Inventors: Tianniu Chen, Michael B. Korzenski, Ping Jiang
  • Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body
    Patent number: 9644962
    Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on a surface which is welded with the base, and an opening area of the groove on the inner space side which is smaller than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: May 9, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Shinya Aoki, Osamu Kawauchi, Juichiro Matsuzawa, Masaru Mikami
  • Friction stir spot welding structure
    Patent number: 9630274
    Abstract: A friction stir spot welding structure includes a pair configured of an upper side flange portion and a lower side flange portion that are friction stir spot welded together by being pressed by a rotating pin rotating from one thickness direction side at a mutually overlapping location. A pair of protruding portions that project out in a protruding shape from the upper side flange portion toward the lower side flange portion are formed to the upper side flange portion. A pair of engagement holes into which the pair of protruding portions are inserted are formed to the lower side flange portion.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: April 25, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kohei Chiashi, Yutaka Yamada
  • Electronic component mounting system and electronic component mounting method
    Patent number: 9629292
    Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: April 18, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Katsuhiko Itoh, Mitsuo Nakamura, Daisuke Nagai, Kenji Okamoto
  • Refillable apparatus for aligning and depositing solder columns in a column grid array
    Patent number: 9629259
    Abstract: A disposable apparatus with a plurality of preloaded pins such as solder columns, micro-coil springs, or other cylindrically shaped metallic parts (solder columns, et al.) in an array pattern is provided for aligning and dispensing onto a column grid array (CGA) substrate. The apparatus includes a carrier plate with a pattern of holes that is covered by removable covers to retain, position and hold an array of solder columns, et al. Alignment features on the top of the carrier plate plugs into a jig-alignment fixture or frame that precisely positions the solder columns, et al. over a CGA substrate. After inverting (flipping over) the apparatus and jig-fixture or frame upside down, the payload of solder columns, et al. detaches and transfers by gravity onto a pattern of metal pads on the CGA substrate, without the use of vacuum or vibration.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: April 18, 2017
    Assignee: TopLine Corporation
    Inventors: Martin B. Hart, Roger C. Young, Jeffrey Ryan Butcher
  • Low temperature method for hermetically joining non-diffusing ceramic materials
    Patent number: 9624137
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: April 18, 2017
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Reflow treating unit and substrate treating apparatus
    Patent number: 9629258
    Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: April 18, 2017
    Assignee: Semigear Inc.
    Inventor: Jian Zhang
  • Method for manufacturing ferrous material
    Patent number: 9617613
    Abstract: A base material of a ferrous material is heated to an AC1 point, which is a temperature to cause austenite appearance, or higher, and austenite appears in the base material 1a and 1b (S101). An amount of a strain assuming that an Mf point, which is a temperature where the base material becomes martensite completely, is decreased to be less than room temperature is introduced into the base material (S102). The all ferrous material becoming martensite on the occasion of cooling the ferrous material to room temperature is prevented. The base material is cooled to room temperature at a cooling rate where a line extrapolated a cooling curve of the base material intersects with a region where martensite is produced on the CCT diagram (S103). Austenite remains in the manufactured ferrous material at room temperature.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: April 11, 2017
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada
  • Electronic component mounting system and electronic component mounting method
    Patent number: 9615495
    Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information—when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: April 4, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Katsuhiko Itoh, Nobuo Komiya
  • Manufacturing of a heat sink by wave soldering
    Patent number: 9615444
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: April 4, 2017
    Assignee: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Giuseppe Luigi Malgioglio, Rosalba Cacciola
  • Method of fabricating a steam turbine deflector
    Patent number: 9604323
    Abstract: The invention relates to a method for manufacturing a steam turbine low-pressure or medium-pressure module deflector, said deflector comprising an internal ring and an external ring as well as vanes, said method comprising a step of welding said vanes to said rings. The main characteristic of a method according to the invention is that the welding step is preceded by a step of automatically machining the ends of each vane to create a peripheral recess around each of said ends.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: March 28, 2017
    Assignee: General Electric Technology GmbH
    Inventors: Arnaud Buguin, Dominique Travers
  • Friction-stir welding tool, friction stir welding device, and method for manufacturing welding material
    Patent number: 9604306
    Abstract: A friction-stir welding tool includes a front shoulder; a rear shoulder in contact with plate materials; and a probe penetrating the plate materials between the front and rear shoulders, the probe connecting the front shoulder and the rear shoulder to each other. The probe has a first screw part provided on at least one axial end section, and at least one of the front shoulder and the rear shoulder has a second screw part in threaded engagement with the first screw part, the threaded engagement changing so that the rear shoulder and the front shoulder approach each other along the axial direction as the front shoulder and the rear shoulder rotate relative to each other, and the threaded engagement with the first screw part linking at least one of the rear shoulder and the front shoulder with the probe.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: March 28, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventor: Yoshinori Kato
  • Method of manufacturing composite metal material, method of manufacturing mold, method of manufacturing metal product, and composite metal material
    Patent number: 9604307
    Abstract: Provided is a method of manufacturing a composite metal material which includes a first metal member made of first metal and a second metal member made of second metal having a smaller linear expansion coefficient than first metal. The method includes in the following order: a metal member preparation step of preparing the first metal member made of first metal and a plurality of divided members made of second metal; an assembling step of assembling the respective metal members into an assembled body; and a bonding step of, by applying a first temperature and a first pressure which enable the respective metal materials to be bonded to each other to the assembled body, bonding the plurality of divided members to each other thus forming the second metal member and also of bonding the first metal member and the second metal member to each other.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: March 28, 2017
    Assignee: ASAHI CO., LTD.
    Inventors: Toshiaki Kitazawa, Manabu Yoshihara