Abstract: The removal of ceramic material from the interior of cast metallic components is accomplished in a closed system. A vessel within the system is filled with a chemical leaching fluid that immerses the cast component having the ceramic material and/or ceramic cores therein. The leaching fluid is superheated and boiling is controlled by varying the pressure within the closed system without changing the molecules in the vessel.
Type:
Grant
Filed:
April 10, 2003
Date of Patent:
May 25, 2004
Assignee:
Rolls-Royce Corporation
Inventors:
Max Eric Schlienger, Michael D. Baldwin, Ariel Eugenio
Abstract: A solder bonding system that includes a substrate having a recess and a conductive pad having a width. The conductive pad is disposed in the recess of the substrate. The solder bonding system also includes a solder pad contacting the conductive pad. The solder pad has a width greater than the width of the conductive pad. When the solder pad is heated, it forms a stable solder bond between the conductive pads.
Abstract: A microelectronic connection component is provided with leads having a surface wettable by a bonding material such as a solder at the tips of the leads which are intended to be bonded with microelectronic devices. The leads have non-wettable surfaces bounding the wettable surfaces. During bonding, the non-wettable surfaces confine liquid bonding material such as liquid solder and prevent the liquid bonding material from spreading along the leads.
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