Patents Examined by Kim Glenn
  • Patent number: 6847269
    Abstract: A high-frequency module is connected to a transmitting circuit (TX), a receiving circuit (RX) and an antenna (ANT) to control the connections between the transmitting circuit (TX) and the antenna (ANT) and between the receiving circuit (RX) and the antenna (ANT). The module comprises means (2) for controlling transmitted signals, which includes a first phase-shift circuit (5) and a high-frequency amplifier (4) provided between the antenna (ANT) and the transmitting circuit (TX). The high-frequency amplifier (4) and the first phase-shift circuit (5) are integrated into a module composed of a plurality of dielectric layers.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: January 25, 2005
    Assignee: Hitachi Metals, Ltd.
    Inventors: Mitsuhiro Watanabe, Shigeru Kemmochi, Tsuyoshi Taketa, Hiroyuki Tai, Satoru Yokouchi