Abstract: A recording and reproducing apparatus has an optical head that is provided with a laser light source for emitting light and a reflection converging optical system. The reflection converging optical system reflects light emitted from the laser light source, and converges the light on one point of a bottom surface of a solid immersion lens. Here, the reflection converging system has a first reflection surface for reflecting incident light; and a second reflection surface for further reflecting the light reflected by the first reflection surface and for converging the light onto the bottom the solid immersion lens.

Abstract: The present invention provides an X ray film cassette with a permanent marking means for identifying the side of the radiographic film that faced the X ray tube during exposure. Such identification is achieved irrespective of whether the film is exposed through the cover or base of the cassette and does not require any separate action by the X ray technologist, eliminating the element of human error. In a preferred embodiment, the working means is comprised of chirally asymmetric X ray opaque and/or light-opaque letters or markings permanently mounted in the film cassette. A user friendly apparatus is described, for installing the light-opaque markers on the intensifying screens of the X ray film cassette.

Abstract: An X-ray exposure system for exposing a semiconductor wafer to a mask with X-rays contained in synchrotron radiation, is disclosed. In this system, the mask and the wafer are held on a main frame so that their surfaces extend substantially parallel to a vertical axis. The main frame suspends from a supporting frame through a plurality of air mounts, each being vertically displaceable. The supporting frame is placed on the same reference surface as that of an SOR ring that produces synchrotron radiation. By using these air mounts, any tilt of the mask and the wafer relative to the irradiation region of the synchrotron radiation, as well as the position of the mask and the wafer in the vertical direction, with respect to the irradiation region, can be controlled and maintained constant. Thus, accurate pattern printing is ensured.