Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heat-sink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heat-sink element. The heat-sink element is formed by a heat-sink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heat-sink die towards the body and rest on the body.
Type:
Grant
Filed:
December 7, 2015
Date of Patent:
January 14, 2020
Assignee:
STMICROELECTRONICS S.R.L.
Inventors:
Concetto Privitera, Maurizio Maria Ferrara, Fabio Vito Coppone