Patents Examined by Kishor Mayrkar
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Patent number: 5985125Abstract: A selective copper deposition method, comprising the steps of: forming barrier metal patterns on a wafer; and depositing copper only on the barrier metal patterns by electrochemistry, by which high pure copper film patterns can be formed simultaneously with deposition of copper, with ease.Type: GrantFiled: July 3, 1997Date of Patent: November 16, 1999Assignee: LG Semicon Co., Ltd.Inventor: Jae-Jeong Kim
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Patent number: 5779991Abstract: An apparatus having a first and second zones, for destroying hazardous compounds of a first and second types respectively present in a gas stream. The first zone has a first live electrode and a ground electrode. The first live electrode and the ground electrode define a first gas passage. These electrodes are excitable at a first energy level for generating a first electric field capable of generating a plasma in a gas flowing through the first gas passage. The second zone has a second live electrode spaced apart from the ground electrode. The second live electrode defines with the ground electrode a second gas passage communication with a downstream end of the first gas passage. The second live electrode is excitable at a second energy level for generating with the ground electrode a second electric field capable of sustaining the plasma in the gas flowing through the second gas passage.Type: GrantFiled: November 12, 1996Date of Patent: July 14, 1998Assignee: Eastern Digital Inc.Inventor: George M. Jenkins
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Patent number: 5549807Abstract: In accordance with the present invention, electropolymerization in a substantially aqueous solution is used to form thick (e.g. greater than 2 microns or 30 weight %) and thermally stable coatings of thermoplastic materials onto electrically conductive filler materials (e.g. rods, plates, fibers). In a first preferred embodiment, the thick thermoplastic matrix comprises a copolymer of 3-carboxyphenyl meleimde and styrene. In a second preferred embodiment, cyclic (and preferably aromatic) N-substituted methacrylamide monomers are electropolymerized onto electrically conductive (e.g., graphite) filler (e.g., fibers, plates, film or cloth) to form a novel polymer composite exhibiting high Tg as well as a controlled degree of cross-linking which can prevent flow at high temperature. This invention is particularly will suited for direct preparation of thermoplastic prepregs containing commercially available bundles of graphite fibers.Type: GrantFiled: March 1, 1995Date of Patent: August 27, 1996Assignee: The University of ConnecticutInventors: James P. Bell, Jude O. Iroh, Daniel A. Scola, Jengli Liang
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Patent number: 5500106Abstract: A process for electroplating a substrate by coating the substrate with a porous coating of conductive particles having a reducing agent within its pores and electroplating over said coating. The reducing agent causes formation of an initial electroless metal deposit over the conductive particle coating thus enhancing its conductivity. The process is especially useful for the fabrication of printed circuit boards.Type: GrantFiled: June 12, 1995Date of Patent: March 19, 1996Assignee: Shipley Company, L.L.C.Inventor: Robert L. Goldberg
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Patent number: 5203985Abstract: Process for manufacturing a galvanized steel sheet, comprising steps of coating a steel sheet with nickel in an amount of from 0.2 to 2 g/m.sup.2, heating the steel sheet thus coated to a temperature within the range of from 420.degree. C. to 500.degree. C. in a non-oxidative atmosphere, and dipping the nickel coated steel sheet into a molten zinc bath containing aluminum at a content of from 0.1 to 1% without contract with air, wherein the steel sheet is dipped into the molten zinc bath within 15 seconds after the temperature of the steel sheet extends 350.degree. C. in the heating step.Type: GrantFiled: May 15, 1991Date of Patent: April 20, 1993Assignee: Nippon Steel CorporationInventors: Kazumi Nishimura, Hisao Odashima, Tetsuya Ohara, Ryohei Mizoguchi, Shigeto Fujii
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Patent number: 5185065Abstract: An electrocoating composition containing an epoxy amine adduct which is the reaction product of a polyepoxide resin and an amine, an acrylic amine resin and a blocked polyisocyanate crosslinking agent;wherein the composition is prepared by blending a first emulsion of the epoxy amine adduct and the blocked polyisocyanate crosslinking agent with a second emulsion of the acrylic amine resin and a blocked polyisocyanate crosslinking agent; where the first and second emulsions are each individually formed by blending the adduct or resin with the blocked crosslinking agent and then adding an organic acid to form a salt which forms a stable aqueous emulsion.Type: GrantFiled: August 1, 1991Date of Patent: February 9, 1993Assignee: E. I. Du Pont de Nemours and CompanyInventors: Ding Y. Chung, Allisa Gam, Robert A. Tessmer
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Patent number: 5178736Abstract: Disclosed herein are cathodic electrocoat compositions which contain electroconductive pigments. These pigments are light in color, and can be added at higher pigment to binder ratios for improved edge coverage. More specifically, the electroconductive pigments are a two-dimensional network of antimony-containing tin oxide crystallites which exist in a unique association with amorphous silica or with a silica-containing material.Type: GrantFiled: July 19, 1991Date of Patent: January 12, 1993Assignee: E. I. Du Pont de Nemours and CompanyInventor: Eugene Richardson