Patents Examined by Kobert R. Koehler
  • Lead frame material
    Patent number: 6117566
    Abstract: A lead frame material, which can be provided with an etching stop layer without requiring a troublesome process such as vapor deposition and has an excellent heat-resistance, is obtained by forming a nickel-phosphorus alloy layer (B) of 1.6 to 10 .mu.m thickness containing 0.3 to 1.0 wt % of phosphorus on a copper or copper alloy layer (A) of 35 to 300 .mu.m thickness, and forming an optional copper layer (C) of 0.2 to 30 .mu.m thickness on the nickel-phosphorus alloy layer (B).
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: September 12, 2000
    Assignees: Nippon Denkai, Ltd., North Corporation
    Inventors: Tatsunori Matsumoto, Masami Noguchi, Kazuyoshi Aso