Patents Examined by Kofi Aszamli
  • Nickel compound and method of forming thin film using the nickel compound
    Patent number: 9790246
    Abstract: Provided are a heterostructured nickel compound including a nickel amidinate ligand and an aliphatic alkoxy group and a method of forming a thin film including the heterostructured nickel compound. The method includes forming a nickel-containing layer on a substrate by using the heterostructured nickel compound including the nickel amidinate ligand and the aliphatic alkoxy group.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: October 17, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-chul Youn, Gyu-hee Park, Youn-joung Cho, Haruyoshi Sato, Takanori Koide, Naoki Yamada, Akio Saito, Akihiro Nishida