Patents Examined by Krista Lynch
  • Inorganic substrates with hydrophobic surface layers
    Patent number: 8236426
    Abstract: Inorganic substrates with a hydrophobic surface layer of a fluorinated material having the following structure are disclosed: where A is an oxygen radical or a chemical bond; n is 1 to 20; Y is H, F, CnH2n+1 or CnF2n+1; X is H or F; b is at least 1, m is 0 to 50, and p is 1 to 20. The fluorinated material can be directly adhered to the inorganic substrate or can be indirectly adhered to the inorganic substrate through an intermediate organometallic coating.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: August 7, 2012
    Assignee: Aculon, Inc.
    Inventors: Eric L. Hanson, Eric L. Bruner
  • Bonding material, electronic component, bonding structure and electronic device
    Patent number: 8227090
    Abstract: A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: July 24, 2012
    Assignee: Panasonic Corporation
    Inventors: Akio Furusawa, Kenichiro Suetsugu, Shigeki Sakaguchi, Kimiaki Nakaya