Patents Examined by Krista Z. Soderholm
  • Patent number: 7285842
    Abstract: Structures employing siloxane epoxy polymers as diffusion barriers adjacent conductive metal layers are disclosed. The siloxane epoxy polymers exhibit excellent adhesion to conductive metals, such as copper, and provide an increase in the electromigration lifetime of metal lines. In addition, the siloxane epoxy polymers have dielectric constants less then 3, and thus, provide improved performance over conventional diffusion barriers.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: October 23, 2007
    Assignees: Polyset Company, Inc., Rensselaer Polytechnic Institute
    Inventors: Pei-I Wang, Toh-Ming Lu, Shyam P. Murarka, Ramkrishna Ghoshal