Abstract: Structures employing siloxane epoxy polymers as diffusion barriers adjacent conductive metal layers are disclosed. The siloxane epoxy polymers exhibit excellent adhesion to conductive metals, such as copper, and provide an increase in the electromigration lifetime of metal lines. In addition, the siloxane epoxy polymers have dielectric constants less then 3, and thus, provide improved performance over conventional diffusion barriers.
Type:
Grant
Filed:
April 27, 2004
Date of Patent:
October 23, 2007
Assignees:
Polyset Company, Inc., Rensselaer Polytechnic Institute
Inventors:
Pei-I Wang, Toh-Ming Lu, Shyam P. Murarka, Ramkrishna Ghoshal