Abstract: A semiconductor device that is a facedown mountable, chip-size-package type semiconductor device, the semiconductor device including: a semiconductor substrate; and a metal layer that is disposed on the semiconductor substrate and is exposed to outside. One or more marks are provided on an exposed surface of the metal layer. The one or more marks each include an outline portion defining an outline of the mark, and a central portion located inward of the outline portion. In a plan view of the exposed surface of the metal layer, the outline portion has a color different from at least one of a color of the central portion or a color of a base portion that is a portion of the exposed surface of the metal layer on which the one or more marks are not provided.

Abstract: A rotary laser engraving device for supporting and rotating an object to be engraved during a laser engraving process is provided and includes a support frame. The support frame may include a central bar, a stationary vertical post and a movable post movable along a length of the central bar. A first support assembly is movably mounted on the frame, such as on the stationary vertical post, and includes a first pair of rollers for supporting a first end of the object to be engraved. A second support assembly is movably mounted on the frame, such as on the movable post, and includes a second pair of rollers for supporting a second end of the object to be engraved. At least one longitudinal adjustment mechanism and at least one vertical adjustment mechanism are carried by the frame and allow to adjust the longitudinal and vertical separation, respectively, between the first and second pairs of rollers.

Abstract: A method of separating a coated substrate includes directing an infrared laser beam onto a first surface of the coated substrate. The coated substrate includes a coating layer disposed on a transparent workpiece, a plurality of defects is disposed within the coated substrate along a contour line that divides a primary region from a dummy region of the coated substrate from a dummy region of the coated substrate. The method also includes translating at least one of the coated substrate and the infrared laser beam relative to each other such that an infrared beam spot traces an oscillating pathway that follows an offset line in a translation direction and oscillates between an inner and outer track line, the oscillating pathway is disposed on the dummy region of the coated substrate, and the infrared laser beam applies thermal energy to the plurality of defects to induce separation of the coated substrate.

Abstract: A high-power laser processing head has precisely centered stationary lenses. The assembly of the lenses in the head can reduce contamination. The lens is affixed (soldered) in a ring-shaped highly precise mount, which ensures a high thermal conductivity of the joining interface. The mount and lens can be cleaned as a unit and inserted in a precisely manufactured receptacle of a housing module. A seal can provide sealing between an inner surface in the receptacles and a base surfaces of the mount. The modules has a groove around the diameter of the receptacle to catch any particles generated when inserting the lens mounts into the receptacle. The assembly is clamped into place by the next housing module. The lens is directly cooled by the module's body to mitigate contamination on the lens surface. During repairs, both lens and mount can be exchanged as a unit.

Abstract: The present disclosure relates to a method for controlling a spot welding arrangement, the method comprising the steps of moving a welding tip portion of the spot welding arrangement between a first and a second position by applying a force to the welding tip portion; determining a distance moved between the first and second positions; determining a type of welding yoke connected to the spot welding arrangement based on the determined distance and the applied force; and controlling settings of the spot welding arrangement based on the welding yoke connected to the spot welding arrangement.

Abstract: Provided is a laser device including a light source generating a laser beam, a stage, and a lens assembly disposed between the light source and the stage and irradiating the laser beam to a substrate disposed on the stage. The laser device is capable of irradiating a uniform laser beam over an entire processing area to which the laser beam is irradiated. Thus, the laser device may irradiate a uniform laser beam to not only a center area, but also the edge area of the processing area.

Abstract: A laser processing apparatus according to an embodiment includes a laser light irradiation unit and a conveying stage capable of allowing a substrate to float and convey. The conveying stage includes: a laser light irradiation region; and a substrate conveying region separated from the laser light irradiation region, a surface of the laser light irradiation region facing the substrate is configured by a first member from which a first gas is capable of jetting out to float the substrate, a surface of the substrate conveying region facing the substrate is configured by a plurality of second members from which a second gas is capable of jetting out to float the substrate, and the plurality of second members in the substrate conveying region are disposed to be separated from each other.

Abstract: The present device is configured for mounting on and movement around the outside surface of a pipe to be processed, and includes a clamping device- and a flexible composite carriage including at least two pivotally connected component parts capable of pivoting about a pin of a hinged connection lying parallel to the axis of the, wherein each part comprises a group of at least two coaxial supporting rollers, the axis of which is situated at a distance from the hinged connection that is less than or equal to ? of the distance between the hinges of the component part and is parallel to the axis of the pipe to be processed. The component parts are connected in succession such that each part bears on two groups of supporting rollers, one of which is mounted on the component part, and the other of which on an adjacent component part.

Abstract: Method for compensating an interfering influence on a welding current, provided by a welding power source (4) for welding a workpiece (3), from another welding power source (4?), comprising the steps of: (a) providing (SA) a compensation voltage (UKomp), which is calculated on the basis of a welding current progression provided by the other welding power source (4?); (b) subtracting (SB) the compensation voltage (UKomp) from a measured voltage (UMess), measured by a voltage measurement unit (8) of the welding power source (4), so as to determine a corrected measured voltage (U?Mess); and (c) regulating (SC) the welding current generated by the welding power source (4) as a function of the corrected measured voltage (U?Mess).

Abstract: A cable-type welding wire provided in the present application, includes a central welding wire and n peripheral welding wires arranged so as to be spirally wound on the central welding wire, with each of the peripheral welding wires having a diameter of dperipheral, and adjacent peripheral welding wires being arranged to be tangential to each other, wherein, the peripheral welding wires have a lay length of T, which satisfies the equation of T=m×(dperipheral+dcentral)/2, where m is a multiple of the lay length, dperipheral is a diameter of the peripheral welding wire, dcentral is a diameter of the central welding wire, and 3.2?m<20. This application can obtain a smaller penetration depth when the welding parameters remain constant due to a small multiple of the lay length of the cable-type welding wire, and can further reduce welding arcing current.

Abstract: A multi-source self-adaptive low-stress additive manufacturing method that includes arranging one or more high-energy sound beam excitation units on an additive manufacturing platform according to a size and a structure of a metal workpiece; planning an additive path according to the size and the structure of the workpiece; fixing a substrate on a self-adaptive additive manufacturing workbench; conducting additive manufacturing of the workpiece and starting a high-energy sound beam regulation system synchronously to generate high-energy sound beam(s) that are transmitted to the workpiece according to a control sequence; acquiring position information of molten pool(s) and position information of the one or more high-energy sound beam excitation units in the additive manufacturing process; continuously monitoring a surface temperature of the workpiece; and closing the high-energy sound beam regulation system when the additive manufacturing of the workpiece is finished and the surface temperature of the metal w

Abstract: A composite floor structure with a new metal decking having openings over the theoretical center of underlying support I-beams which now allows top flanges of beams to be painted and a welding zone for stud shear connectors within the openings then cleaned of paint, galvanizing and contaminates. The openings, which include deck caps if needed, allow visual inspection regarding the deck being tight against the beam and are spaced across the metal decking to provide a desired number of stud shear connectors and facilitate finding the center of the I-beam, provide a clean weld surface and minimize arc blow, weld fumes, weld time and required weld current. The thickness of the deck is no longer limited, and neither are the number of sheets stacked upon one another. All of which provide increased safety, efficiency and quality assurance while helping to control risk management.

Abstract: A home appliance, in particular a home cooking appliance, includes a home appliance cavity used as a cooking cavity. The home appliance cavity includes a substrate that is a fibrous matrix and an inorganic resin that is thermally resistant. In certain examples, the home appliance cavity is a single unit construction, eliminating assembly seams. Also described herein are methods of making the home appliance cavity.

Abstract: A laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section. The laser processing apparatus acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section, and projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data. The laser processing apparatus obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. Therefore, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring a depth of a keyhole.

Abstract: A resistance spot welding method includes: performing test welding; and performing actual welding after the test welding, wherein in subsequent current passage in the test welding, current passage is performed by constant current control under a condition: 0.5 ? Vtp/Vtm ? 2.0 when tc<800 ms; 0.5?0.3·(tc?800)/800 ? Vtp/Vtm ? 2.0?0.5·(tc?800)/800 when 800 ms ? tc<1600 ms; and 0.2 ? Vtp/Vtm ? 1.5 when tc ? 1600 ms, and wherein in main current passage in the actual welding, adaptive control welding is performed, and in subsequent current passage in the actual welding, current passage is performed by constant current control under a condition: 0.8·Itp ? Imp ? 1.2·Itp.