Abstract: The present invention enhances the mounting accuracy of a drive circuit chip on a substrate thus realizing a display of high quality. Bumps (for example, gold bumps) on the drive circuit chip are used for alignment. Here, to enhance the recognition property of the alignment bumps, a plane shape of a conductive layer which is formed between a semiconductor substrate (Si substrate) of the drive circuit chip and the alignment bump is set to be included within a profile of a plane shape of the alignment bump. That is, by preventing the conductive layer from being observed in a periphery of the alignment bump, it is possible to prevent a photographed pattern of the bump taken by a camera or the like from be influenced by the conductive layer.

Abstract: A light-emitting diode (LED) component includes a light-emitting chip for emitting luminescent light, and a phosphor for absorbing first luminescent light of the luminescent light and emitting first emission, the first luminescent light having a first wavelength different from that of the first emission, the phosphor having a chemical formula of (Ca1-x-yEuxMy)Se where x is not equal to zero, y is between zero and one, and M is composed of at least one element selected from a group consisting of Be, Mg, Sr, Ba, and Zn.