Patents Examined by L. Brown
  • Integrated semiconductor circuits with contact interconnect levels comprised of an aluminum/silicon alloy
    Patent number: 4527184
    Abstract: Contact interconnect levels for integrated circuit with a semiconductor substrate consisting of silicon in which and on which components forming the circuit are produced, are composed essentially of an aluminum/silicon/titanium alloy having a proportion of about 1 through 2% by weight silicon and a titanium content of less than about 0.5% by weight. The reliability and loadability of electrical interconnects for VLSI systems is increased by utilization of this metallization.
    Type: Grant
    Filed: September 9, 1983
    Date of Patent: July 2, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventor: Franz Fischer