Abstract: Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate to transfer heat between the semiconductor structure and the insulating substrate.

Abstract: An integrated circuit (100) includes a semiconductor die (102, 103) and a semiconductor package (101) that has a leadframe (20, 40, 60, 80) for mounting the semiconductor die. The leadframe includes a first laminate (20) whose bottom surface (7) is patterned with leads (106, 107, 131, 132) of the integrated circuit. A second laminate (40) has a bottom surface (3) attached to a top surface (5) of the first laminate to electrically coupling the leads to the semiconductor die.

Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.

Abstract: A semiconductor device is configured of a first semiconductor chip mounted on a substrate, a plate member arranged on the first semiconductor chip, and a second semiconductor chip arranged on the plate member. Bonding wires electrically connect the pads of the first semiconductor chip and the pads of the second semiconductor chip to the pads of the substrate, and a sealing resin seals the first semiconductor chip and the second semiconductor chip. A first portion of the plate member is displaced away from the ends of the first and second semiconductor chips, and a second portion of the plate member extending perpendicular to the first portion, projects outward from the first and second semiconductor chips to be exposed to the outside.

Abstract: A heat removal system for integrated circuit chips, lasers, portable electronic devices, and the like which produce destructive amounts of heat employs a device which delivers working fluid to a high heat flux surface in a manner to avoid any change in phase of the fluid. The invention is based on the recognition that the heat flux produced by such sources is so high that prior art heat sinks fail to remove heat at a sufficient rate from a high heat flux surface and become inefficient in removing heat. The fluid here is maintained at a pressure and pumped at a rate to provide a sufficiently short dwell time to maintain the fluid in a supracritical state thus avoiding vapor lock. The fluid also may be cooled by, for example, either an evaporative or an absorption chiller driven by the heat from the heat source or by a thermoelectric cooler.

Abstract: After a barrier film is formed on a pad electrode, Ni particles having a diameter of 2 &mgr;m or less are selectively deposited on the barrier film, thereby forming a Ni fine particle film. Then, a bump electrode made of a solder ball is provided on the pad electrode through the Ni fine particle film. Thereafter, the bump electrode is melted by a heat treatment to join the Ni fine particle film to the bump electrode. Thus, a bump electrode structure is finished.

Abstract: A configuration of at least two TSOP memory chip housings stacked one on another, is described. Each of the TSOP memory chip housings has at least one memory chip with a number of pins disposed in an interior of the TSOP memory chip housing. The pins leading out of a respective TSOP memory chip housing and, via a rewiring configuration, are connected to pins leading out of a respectively directly adjacent TSOP memory chip housing of the same TSOP memory chip housing stack. In order to be able to produce such a housing stack as cost-effectively and simply as possible by an automated mounting method, the rewiring configuration is implemented in the form of leadframes respectively disposed between or at the side between the individual TSOP memory chip housings.

Abstract: The pins of rotating crankshafts are fine-machined by resiliently biasing the workpiece towards a grinding device with a predetermined force.

Abstract: Multiple-spindle lathe with a drive shaft which is rotatably and longitudinally displaceably mounted in a headstock, a spindle carrier which is mounted on the headstock for rotation about an indexing axis, and several work spindles which are rotatably mounted in the spindle carrier and comprise at their outer ends chucks and at their inner ends coupling elements for coupling one respective work spindle with the drive shaft.