Abstract: An ultrasonic transducer used in a bonding apparatus, comprising a first hollow section, which communicates with a rear end opening formed in a base end of a horn body of the transducer, and an inner unit, which is installed inside the first hollow section. The inner unit comprises a vibrator assembly and a pressing block, and the pressing block pushes and fastens in place the vibrator assembly in the first hollow section. A through-hole is formed in the central portion of the inner unit, and a second hollow section and third hollow section are further formed in the horn body. Signal wires are connected to the vibrator assembly through the rear end opening.

Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die are available. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.