Abstract: An IC pin adjustment tool includes a pair of side arms and a center portion disposed between the side arms. The side arms are hingedly mounted on the center portion at one end thereof, and biased outwardly away from the center portion by spring means attached to the other end of the side arms. The center portion, and the portions of the side arms adjacent to the center portion, are configured such that an IC of either of two widths may be disposed on the associated one of two sides of the center portion such that the IC pins extend into gaps between the side arms and the center portion. By squeezing the side arms toward each other, the side arms force the pins toward the center portion to thereby adjust the orientation of the pins, such that they may immediately be inserted into an IC socket without further adjustment.