Abstract: A transformer contains a multi-layered coil block which is formed by laminating and sintering sheets having conduction patterns. External electrodes which are connected to the conduction patterns are formed at the edges of the multi-layered coil block. A hole is made at the center of the multi-layered coil block, and a core is inserted into the hole. For the sheet material, a ceramic material containing glass is used. For the ceramic material, for example, an alumina ceramic material or dielectric ceramic material is used. Also, for the glass, for example, lead glass, borosilicate zinc glass, or borosilicate lead glass is used.

Abstract: A transformer designed for 1:N voltage transformation (where 1:N may be any rational number) at high frequencies (such as over 7 megahertz) can achieve acceptable frequency response and attendant improved values of signal attenuation and signal distortion by physically separating two or more sets of electrically tightly coupled windings and connecting one winding of different sets in parallel and the other winding of the same sets in series. This interconnection of windings to achieve a 1:N transformation ratio reduces the negative effects of the interwinding capacitance thereby providing the improved frequency response.

Abstract: A high-tension current transformer having two or three type of insulating units with one coil, the transformer being provided for storing and for being assembled in a short time, to prevent the need for performing the insulation and the production of transformers on order.

Abstract: A printed circuit board is provided having a beveled edge for ease of insertion into a receptor. The beveled edge is extended onto the solder mask to present a contiguous beveled surface. Moreover, the PCB includes bonding pads which can be surface mounted with pins extending from the receptor. Each bonding pad includes a forward portion and a rearward portion. The forward portion is covered with the solder mask layer to present a smooth surface channeled inward in a V-shaped configuration. The forward portion channels or directs the pin along a central axis near the apex of the V-shaped forward portion onto the upper surface of the bonding pad rearward portion. Accordingly, the pin is channeled to an area absent solder paste along the central axis such that during subsequent reflow operation the solder paste is reliably extended over and around the centrally placed pin.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: A distribution transformer has a wound magnetic core (50) of overall circular shape and rectangular cross-section with between two and four overall rectangular shape electric coils (20,30) extending through the core window. The coils (20,30) are pre-formed and assembled so that their parts (20A,30A) which meet form a circular section solid cylinder. A mandrel (40) is then located around this cylinder (20A,30A) and continuous non-amorphous steel strip is wound thereon to form an unannealed, uncut wound magnetic core of axial length in the range 250 mm to 1 m. In a modification, amorphous steel strip is first wound on to another mandrel, annealed, and then transferred from the other mandrel on to the mandrel around the coils.

Abstract: A polymer lead frame is made from a flexible substrate with flexible conductive traces. The generally square lead frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

Abstract: A method of securing a flexible temperature sensing element to a duct spacer element of the type which is commonly used in an electrical transformer includes steps of forming a groove in a surface of duct spacer element; and securing a flexible temperature sensing element within the groove so that the flexible temperature sensing element does not protrude from the groove beyond the surface in which the groove is formed. In this way, the duct spacer element and sensing element may be assembled into an electrical apparatus such as a transformer without imparting destructive mechanical forces to the sensing element. The disclosure also embraces an integrated temperature sensing duct spacer unit.

Abstract: A TAB tape having multiple metallic conductors arranged on the surface of a base film with substantially square device holes is formed with designed areas of stress refief formed by one or more slits and/or arrays of holes which extend outward from the corners or sides of the device holes, such that dimensional stability in the base film is improved in a direction parallel to inner leads when thermo-compression bonding is performed to connect the inner leads with IC chips resulting in improved connection reliability for connection between inner leads and IC chips.

Abstract: A pad arrangement (100) for aligning and attaching a surface mount component (402) with other circuitry includes a substrate (102) upon which opposing pads (108) are attached. Each of the pads occupies a substantially rectangular area (110) having four sides. In order to facilitate alignment of the surface mount component the substantially rectangular area has two opposing flat sides an outwardly extending arcuate area (112) along at least one of the other two sides.

Abstract: A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit.

Abstract: An ignition coil is disclosed that includes a primary coil, a secondary coil and a core about which the primary and secondary coil are disposed. The secondary coil has in inner diameter greater than the diameter of the primary coil. The primary coil is disposed on the core and the secondary coil is disposed about the primary coil. The secondary coil includes a spiral-back pyramid winding configuration which results in a desired distributed capacitance for the secondary windings thereby providing desired electrical characteristics for a resonant circuit. The winding layers of the secondary coil decrease in the number of turns as the coil is wound to achieve a desired distributed capacitance of the coil. A spiral-back winding technique decreases adjacent winding layer voltages so that the inter-layer insulation requirements are reduced to a lower value thereby decreasing the insulation thickness of the secondary coil.

Abstract: A probe board is provided with a guide-mask system. The probe board has at least one head which passes through a respective guide-hole located on the filmed guide-mask. The utilization of this guide-mask has the advantage of minimizing slipping of probe heads out of respective mating test terminals of IC chips. Additionally, the utilization of this guide-mask provides accurate probe head positioning and provides enforcement to the heads by way of the filmed guide-mask because of the precise support holes provided in the masks.

Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.

Abstract: An engine igniting coil device comprising a coil case with a plurality of coil units disposed therein and integrally potted with insulating resin, which is featured by provision with a coil cover that fits in the coil case and can mount therein high-voltage and low-voltage terminal sockets for the coil units, allowing the assembly of the electrical connections of the coil units in optimal conditions.

Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.

Abstract: An electrical power distribution busway system which includes a housing having side channels and top and bottom channels is described. The channels enclose and secure at least one stack of conductive busbars in place. At least one of the top or bottom housing channels is adjustably mounted between the side channels so the overall housing may be adjusted to accommodate various arrangements of busbars or busbars having different thicknesses. In a preferred form of the invention, the adjustable channels include holes which are aligned with elongate slots through the side channels. Fasteners extending through the aligned holes and slots allow the adjustable channel to be moved and fixed at different locations along the elongate slot.

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract: A two-sided printed circuit board including a base having a first surface, a second surface substantially parallel to the first surface, and a plurality of through-holes formed in the base; a first conductive layer provided on the first surface of the base; a second conductive layer provided on the second surface of the base; and a conductive particle buried in each of the through-holes in a pressurized state for electrically connecting the first conductive layer and the second conductive layer.