Patents Examined by Lauren M Beronja
  • Patent number: 10610995
    Abstract: A lapping system for lapping portions of a workpiece. The lapping system includes, a lap that is defined by a surface. Portions of the surface are a lapping surface. The lapping surface has a coating that enhances material removal from a workpiece in a lapping process. The lapping system further includes, a scanning probe microscope having a tip and a substrate. The scanning probe microscope controls lapping motion of the lap and workpiece.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: April 7, 2020
    Inventor: Victor B. Kley
  • Patent number: 10478945
    Abstract: An abrasive recovery system for a waterjet cutter, the abrasive recovery system comprising: a drain coupler including at least one drain nozzle, the drain nozzle having at least one wall defining a drain nozzle bore, the drain coupler defining a drain opening wherein the drain opening is in fluid communication with the drain nozzle bore; and a flexible hose coupled to the drain nozzle to establish fluid communication between the drain opening and the flexible hose.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: November 19, 2019
    Assignee: HMCC ACQUIRECO2, LLC
    Inventors: Richard Ralph Ward, Benjamin J. Adams
  • Patent number: 10479917
    Abstract: The present invention addresses the problem of providing a water-soluble cutting or grinding fluid that has excellent permeability and washability, that can be widely used in cutting or grinding, and that is particularly suitable for use in superfinishing. The present invention provides a water-soluble cutting or grinding fluid that contains a glycol compound (A), at least one substance (B) selected from the group consisting of organic amines and inorganic alkalis, a surfactant (C), and water (D), the water-soluble cutting or grinding fluid having a contact angle of 2 to 15° as measured using the ?/2 method one second after a drop of a dilution of the water-soluble cutting or grinding fluid is dropped on an SPCC-SB plate.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: November 19, 2019
    Assignee: NTN Corporation
    Inventors: Masashi Kitai, Kohei Higashi, Hidekazu Hirano, Hajime Isa, Masanori Nishira, Hitoshi Shiotani, Keiji Iwamoto, Youhei Migaki
  • Patent number: 10464184
    Abstract: Before a first surface of a substrate is polished using a chemical mechanical process, the substrate is transferred to a modification station. The substrate comprises a side wall connected with the first surface at an edge and a second surface opposite to the first surface and also connected to the side wall. The first surface is substantially flat. The side wall is substantially perpendicular to the first surface. The edge of the substrate is modified at the modification station by removing material from a region of the first surface. The side wall of the substrate is a boundary of the region. The modified edge comprises a modified first surface that tapers within the region towards the second surface. The side wall remains substantially perpendicular to the first surface.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: November 5, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Jimin Zhang, Zhihong Wang, Wen-Chiang Tu
  • Patent number: 10449656
    Abstract: A continuous-generation gear grinding method of conducting a gear grinding process such that while a thread-shaped grinding wheel is rotated around an axial center thereof and fed in an axial center direction, a position coming into contact with abrasive grains is constantly changed in the presence of a water-soluble grinding fluid by performing a grinding feed in a direction parallel to an axial center of a gear blank and by serially rotating the gear blank around the axial center, the grinding wheel being a vitrified grinding wheel having abrasive grains bonded by a vitrified bond with pores formed among the abrasive grains, and the abrasive grains having a grain size of F120 to F180.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: October 22, 2019
    Assignees: TOYOTA MOTOR HOKKAIDO INC., NORITAKE CO., LIMITED, YUSHIRO CHEMICAL INDUSTRY CO., LTD.
    Inventors: Masatoshi Ozaki, Toru Yamazaki, Kazuhiro Horimi, Tatsuyoshi Yasuda, Yoshihisa Hayakawa, Sho Nakajima
  • Patent number: 10434627
    Abstract: A component in a CMP tool disclosed herein having a surface and a hydrophobic layer deposited on the surface. In one example, the component is a component for delivering a fluid in a CMP tool. The component for delivering a fluid in a CMP tool includes an elongated member having a first end and a second end, and an elongated upper surface extending between the two ends. A hydrophobic layer is deposited on the elongated upper surface. In another example, the component is a ring shaped body having an upper side and a lower side. A hydrophobic layer is deposited on the inner surfaces of both the upper and lower sides. In another example, the component is a disk shaped body having a top surface, bottom surface, and ledge defined by the top and bottom surfaces. A hydrophobic layer is deposited on the surfaces and the ledge.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: October 8, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Sreenidhi Attur
  • Patent number: 10434626
    Abstract: A method of conducting a material removal operation using a grinding system including moving an abrasive article relative to a workpiece, detecting a change in a dimension of the abrasive article during moving, and reducing resonance vibrations in the grinding system.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: October 8, 2019
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS
    Inventors: Christophe Huber, Christopher Arcona, Robin Bright
  • Patent number: 10414015
    Abstract: A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: September 17, 2019
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Shingo Togashi
  • Patent number: 10406646
    Abstract: A device and a method for polishing of an optical lens by means of rotary tool are proposed, a fixture for the lens being pivotable around a pivoting axis transversely to the axis of rotation by means of a push-rod adjustment and being pivotable up out of a machining position such that the lens can be changed from overhead. This allows a compact structure and easy changing of the lens.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: September 10, 2019
    Assignee: SCHNEIDER GMBH & CO. KG
    Inventors: Gunter Schneider, Helwig Buchenauer, Ulf Börner, Klaus Krämer
  • Patent number: 10335920
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: July 2, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Patent number: 10322486
    Abstract: A grinding machine includes a manual rotating handle provided with a rotation detector that outputs a rotation detection signal so that the position of a grinding wheel with respect to a workpiece can be relatively moved in accordance with the rotation detection signal. The grinding machine further includes a grinding wheel, a moving apparatus that moves the position of the grinding wheel with respect to a workpiece W, a proximity detector that outputs a proximity detection signal corresponding to a relative position or a relative distance between the workpiece and the grinding wheel, a manual rotating handle provided with a rotation detector, and a control apparatus that controls the moving apparatus based on the rotation detection signal. The manual rotating handle is provided with a rotational-torque varying apparatus. The control apparatus controls the rotational-torque varying apparatus based on the proximity detection signal.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: June 18, 2019
    Assignee: JTEKT CORPORATION
    Inventors: Hisayuki Nagaya, Kikutoshi Okada, Shinji Nishio, Hidetaka Sugiura