Patents Examined by Leah Simon Macchiarolo
  • Patent number: 10378750
    Abstract: A diode lighting module comprising both a diode matrix mounted on a support plate and heat dissipator means for dissipating the heat given off by the diode matrix, includes a metal plate having an outside face in contact with the support plate and an inside face supporting a cellular metal foam including a plurality of calibrated holes passing through each cell in two perpendicular directions, and a vessel-forming box filled with the cellular metal foam and for which the metal plate constitutes a lid. The box has inlet and outlet orifices passing through the box to receive a cooling liquid, and a separator defining two separate cooling fluid flow zones in the cellular metal foam, a cooling fluid feed zone and a cooling fluid discharge zone, with passage from one of the zones to the other taking place through a cutout in the separator.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: August 13, 2019
    Assignee: XYZED
    Inventors: Maurice Rebiffe, Laurent Mivis