Abstract: A light-emitting element includes a semiconductor laminated structure including a first semiconductor layer, a light-emitting layer and a second semiconductor layer, an insulation layer provided on the semiconductor laminated structure, a first wiring including a first vertical conducting portion and a first planar conducting portion and being electrically connected to the first semiconductor layer, the first vertical conducting portion extending inside the insulation layer, the light-emitting layer and the second semiconductor layer in a vertical direction and the first planar conducting portion extending inside the insulation layer in a planar direction, and a second wiring including a second vertical conducting portion and a second planar conducting portion and being electrically connected to the second semiconductor layer, the second vertical conducting portion extending inside the insulation layer in a vertical direction and the second planar conducting portion extending inside the insulation layer in a

Abstract: Methods and systems for phase current reconstruction are disclosed. An example method comprises: sampling a current from a power stage comprising: three phase legs, a current sensor to measure a dc-link current, and three more current sensors configured to measure three summations of currents for the power stage, storing the sampled current into a current stack if the sampled current comes from a survived sensor and is one of the phase currents from the switching state in the state stack, and reconstructing an unknown phase current by using the previously stored currents along with the sampled current to calculate the unknown phase current. Other embodiments are described and claimed.

Abstract: Provided is a method of manufacturing a semiconductor device having a capacitor under bit line (CUB) structure capable of increasing a gap between a bit line in a cell area and an upper plate of a capacitor, reducing coupling capacitance therebetween, and forming deep contacts in a logic area. A capacitor including a lower electrode, a dielectric material layer, and an upper electrode is formed in an opening of a first insulating layer for exposing a first part of a semiconductor substrate in a cell area. A second insulating layer is formed on the first insulating layer. The first and second insulating layers are etched. First and second contact plugs are formed in first and second contact holes for exposing second and third parts in the cell area and the logic area. A third insulating layer including first through third conductive studs is formed on the second insulating layer.

Abstract: An electrosurgical system includes an electrosurgical generator including at least one source of radio frequency (RF) power, and a plurality of output connections, only one of the output connections at any one time being active in that it is able to receive radio frequency power from the source. The generator includes selection means adapted to change the active output connection, and a controller adapted to control the supply of radio frequency power from the source to the active output connection. The system also includes a plurality of electrosurgical assemblies, each including an electrosurgical instrument and a cable connecting the electrosurgical instrument to one of the output connections. The electrosurgical assemblies each include a handswitch adapted to send a signal to the selection means to change the active output connection.

Abstract: A system may include a gateway that is configured to intercept messages being exchanged between multiple services, a message repository that is logically coupled to the gateway and that is configured to store the intercepted messages, a service description repository that is configured to store multiple service descriptions, where each of the service descriptions corresponds to one of the services, a rules repository that is configured to store mapping rules and an adaptation engine that is configured to generate a sequence of firing rules using the service descriptions and the mapping rules responsive to the intercepted messages, to generate one or more outgoing messages in response to the intercepted messages using the sequence of firing rules, and to detect at runtime an occurrence of a termination anomaly.

Abstract: A system and method for recalibrating a bar code scanner or other optical system is described. In some cases, the system dynamically adjusts the focal length of a lens assembly based on open-loop process, such as based on feedback related to a distance between the lens assembly and an imaged object. In some cases, the system dynamically adjusts the lens assembly in order to provide auto focusing or zoom adjustment.

Abstract: An apparatus for mapping and/or ablating tissue includes a braided conductive member that may be inverted to provide a ring-shaped surface. When a distal tip of the braided conductive member is retracted within the braided conductive member, the lack of protrusion allows the ring-shaped surface to contact a tissue wall such as a cardiac wall. In an undeployed configuration, the braided conductive member is longitudinally extended, and in a deployed configuration, the distal end of the braided conductive member is retracted to invert the braided conductive member.

Abstract: A low-pass filter includes an input portion inputting an electromagnetic signal, an output portion outputting the electromagnetic signal, a high impedance transmission portion electrically connecting the input portion and the output portion to transmit the electromagnetic signal therebetween, and a pair of low impedance transmission members arranged on opposite sides of the high impedance transmission portion. Each of the low impedance transmission members electrically connects the input portion, the output portion, and the high impedance transmission portion, and includes a first low impedance transmission portion and a second low impedance transmission portion. A width of the first low impedance transmission portion is different from that of the second low impedance transmission portion.

Abstract: A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element.

Abstract: There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.

Abstract: A developing device includes: plural developing units; a rotary body, where the plural developing units are attached, that rotates so as to place one of the plural developing units in a developing position to develop a subject of development; a first driving unit that drives the rotary body; a second driving unit that drives at least one of the plural developing units; and a regulatory mechanism that regulates a position of the rotary body using a rotational force caused in the rotary body in accordance with driving by the second driving unit.

Abstract: A structure and method for a semiconductor device includes a silicon device layer and a gallium nitride (GaN) device layer. In an embodiment, the silicon device layer and the GaN device layer have upper surfaces which are coplanar with each other. In another embodiment, the GaN device layer does not directly underlie the silicon device layer, and the silicon device layer does not directly underlie the GaN device layer. The semiconductor device can further include a silicon-based semiconductor device formed on and/or within the silicon device layer, and a nitride-based semiconductor device formed on and/or within the GaN device layer. The GaN device layer can include a plurality of layers which can be formed as conformal blanket layers and then planarized, or which can be selectively formed then planarized.

Abstract: A shuttle message that is passed between GPS enabled devices that is processed at either a bit level or word level with data that the GPS enable device has already gathered and augmenting the positioning data stored at GPS enabled devices by retrieving data contained in the shuttle message. The shuttle message is then passed with any updated information from a GPS enabled device to one or more other devices such as a mobile station.

Abstract: A semiconductor device including a semiconductor substrate, and a memory cell and a peripheral circuit provided on the semiconductor substrate, the memory cell having a first insulating film, a first electrode layer, a second insulating film, and a second electrode layer provided on the semiconductor substrate in order, and the peripheral circuit having the first insulating film, the first electrode layer, the second insulating film having an opening for the peripheral circuit, and the second electrode layer electrically connected to the first electrode layer through the opening for the peripheral circuit, wherein a thickness of the first electrode layer under the second insulating film of the peripheral circuit is thicker than a thickness of the first electrode layer of the memory cell.

Abstract: Method and computer program product for supplying power in a computing system, and computer program product implementing the method. The method comprises monitoring power consumption of the computing system, supplying power to the computing system using only a first power supply over a first range of power consumption, and supplying power to the computing system using a combination of the first power supply and a second power supply over a second range of power consumption. The first power supply provides greater efficiency than the combination of the first and second power supplies over the first lower range of power consumption, the combination of the first and second power supplies provides greater efficiency than the first power supply over the second higher range of power consumption.

Abstract: Information is stored in a data pattern. The data pattern includes an identity table, a version table that includes at least one reference to the identity table, and an audit table that includes at least one reference to the version table. The identity table stores information identifying the information. The version table stores version information identifying one or more versions of the information identified in the identity table. The audit table stores audit information identifying when each of the one or more versions of the information was modified. The audit table may also store effectiveness information identifying when each of the one or more versions of the information is in effect.

Abstract: A wafer chucking apparatus for a plasma process includes a lower plate, on which a plurality of wafers are loaded, and an upper plate, which is coupled to an upper portion of the lower plate and fixes the loaded wafers. The upper plate is made of one of Teflon, ceramic and metal, and the lower plate is made of aluminum or ceramic. The lower plate includes a drilled gas feed hole through which gas is fed so as to uniformly maintain temperature of each wafer during the plasma process. One of more of an isothermal sheet and an isothermal coating layer is formed between the wafers and the lower plate so as to maintain temperature uniformity of the wafers. Thereby, the wafer chucking apparatus can improve uniformity of plasma-etched patterns at an edge zone of each wafer during the plasma process.

Abstract: Methods and apparatus utilize a rate of drop in pressure upstream of a gas flow controller (GFC) to accurately measure a rate of flow through the GFC. Measurement of the gas flow through the many gas flow controllers in production use today is enabled, without requiring any special or sophisticated pressure regulators or other special components. Various provisions ensure that none of the changes in pressure that occur during or after the measurement perturb the constant flow of gas through the GFC under test. A pressure regulator is coupled to a gas source. The GFC is positioned downstream of the pressure regulator. A pressure transducer is measuring pressure in a volume between the pressure regulator and the GFC, wherein means are provided for increasing the pressure in the volume.