Patents Examined by Leo P. Picard
  • Patent number: 7589962
    Abstract: An apparatus for cooling a heat generating component located within a portable computer system enclosure. In one embodiment a flat heat pipe is attached to the bottom surface of the portable computer keyboard support plate. The flat heat pipe is thermally coupled to one or more heat generating components housed within the computer system enclosure.
    Type: Grant
    Filed: July 29, 1997
    Date of Patent: September 15, 2009
    Assignee: Intel Corporation
    Inventor: Rakesh Bhatia
  • Patent number: 7274974
    Abstract: An independent automatic shedding system that automatically allows any combination of loads to powered under limited power availability (such as a standby power source) without overloading the generator or rewiring, while contributing to the stability of the power grid. A motorized disconnection actuation mechanism under control of a controller disconnects or recloses the contacts of a branch circuit breaker. A sensor detects the presence or absence of a power source and the type of power source, which is classified according to its type. A power source classification program is executed by the controller that interprets the sensor data and causes disconnection or reclosing of the disconnection actuation mechanism depending on a desired status (ON or OFF) of the branch circuit breaker when standby power is available. Conventional circuit protection is provided an optional advanced circuit protection such as ground or arc fault circuit interruption.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: September 25, 2007
    Assignee: Square D Company
    Inventors: Scott R. Brown, Gary M. Kuzkin
  • Patent number: 7139617
    Abstract: The systems and methods described herein relate in part to intuitive methods for creation and design of lighting sequences, e.g., for theatrical, entertainment, or advertising purposes, using a software interface. Additionally, the lighting sequences can be coordinated with control of additional devices. Also described herein is a controller capable of executing programs for lighting sequences and modifying the output and/or execution of the program based on external signals. In this way, the final output can be made responsive to external stimuli, or even interactive.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: November 21, 2006
    Assignee: Color Kinetics Incorporated
    Inventors: Frederick M. Morgan, Michael K. Blackwell, Kevin J. Dowling, Ihor A. Lys
  • Patent number: 6798662
    Abstract: A first apparatus includes a semiconductor device and a heatsink thermally coupled to the semiconductor device. The heatsink is located and formed to screen the device from external electromagnetic radiation or to contain radiation produced by the device. A second apparatus includes a semiconductor device, a heatsink thermally coupled to the semiconductor device, and a grounding structure having a capacitive coupling to the heatsink.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: September 28, 2004
    Assignee: Intel Corporation
    Inventors: Harry G. Skinner, Walter M. Kirkbride
  • Patent number: 6556456
    Abstract: Of the electronic components used for a video monitor installed in an aircraft, components 14 radiating electromagnetic waves are covered with a case formed by combining first and second metal plates 16,17, and part of the case is connected to a frame ground. By connecting the case to the frame ground, the radiation of electromagnetic waves is suppressed.
    Type: Grant
    Filed: October 18, 1999
    Date of Patent: April 29, 2003
    Assignee: Minebea Co., Ltd.
    Inventor: Takao Takehara
  • Patent number: 6542785
    Abstract: Functions in various kinds of forms, whether to be rational functions or not, to express a plurality of curved surfaces are unified into a set of functions with respect to parameters u and v by an algebraic method or an analytical method. Based on the set of functions, intersections which are necessary for machining of the curved surfaces are calculated, and paths of a cutting tool to machine the curved surfaces are determined.
    Type: Grant
    Filed: May 11, 2000
    Date of Patent: April 1, 2003
    Assignee: Kabushiki Kaisha F A Labo
    Inventor: Kenichi Honda
  • Patent number: 6519500
    Abstract: A system and a method of fabricating a three-dimensional object on a substrate includes adding material layers incrementally and consolidating the layers by using ultrasonic vibrations and pressure. The layers are placed in position to shape the object by a material feeding unit, and they come in various forms, including flat sheets, segments of tape, strands of filament or single dots of material. The material may be plastic or metallic, and composition may vary discontinuously or gradually from one layer to the next, creating a region of functionally gradient material. The invention permits the construction and repair of dense objects, including fiber-reinforced composites and aerospace structures. Excess material may be removed one or more layers are bonded, including following end of the process after the final object is fabricated.
    Type: Grant
    Filed: March 23, 2000
    Date of Patent: February 11, 2003
    Assignee: Solidica, Inc.
    Inventor: Dawn White
  • Patent number: 6515856
    Abstract: An information processing device including a keyboard for inputting characters or the like, a display for displaying the characters or the like input from the keyboard, a printed wiring board on which electronic components for performing process and display control of the characters or the like input from the keyboard are mounted, and a housing for supporting the keyboard, the display, and the printed wiring board. The information processing device further includes a laterally horizontal shaft supported to a rear portion of the housing, a hollow tilt stand pivotably mounted on the shaft to take a retracted position where the tilt stand is horizontally retracted at a bottom portion of the housing and a raised position where the tilt stand is substantially vertically raised to support the housing in its tilted condition, and a fan provided in the tilt stand. The tilt stand has opposed side walls formed with first ventilation holes. The bottom portion of the housing is formed with second ventilation holes.
    Type: Grant
    Filed: May 21, 1998
    Date of Patent: February 4, 2003
    Assignee: Fujitsu Limited
    Inventor: Shigeru Hidesawa
  • Patent number: 6515855
    Abstract: A mechanism for mounting and removing a data storage device, such as detachable hard disk or optical disc driver, into and from a computer according to the present invention includes a lever pivotally mounted in the middle front of the data storage device; an engaging portion formed on one end of the lever; and a guiding rail formed on a carrier to be engaged with the engaging portion of the lever. The guiding rail is so designed to transform the movements of the lever into assistant forces of pushing and pulling the data storage device into and from the carrier. Moreover, the engagement of the lever to the guiding rail restricts the moving speed of the data storage device and prevents it from being bumped or damaged.
    Type: Grant
    Filed: August 3, 2000
    Date of Patent: February 4, 2003
    Assignee: Inventec Corporation
    Inventor: Yen-Kuang Removedummy
  • Patent number: 6498723
    Abstract: A disk drive system includes a disk drive array enclosure forming receiving cavities for housing respective disk drive modules. Each receiving cavity is defined by top, bottom, and rear surfaces, and an opening. The top and bottom surfaces of each receiving cavity expand away from one another to form receiving slots adjacent the opening of the receiving cavity. The disk drive system further includes a disk drive module having a housing and a disk drive carrier handle connected to the housing. The drive module is insertable into a receiving cavity of the drive array enclosure such that the housing is enclosed by the top, bottom, and rear surfaces of the receiving cavity and the drive carrier handle is positioned at the opening of the receiving cavity. The drive carrier handle has tab purchases located around the periphery of the drive carrier handle.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: December 24, 2002
    Assignee: Storage Technology Corporation
    Inventors: Michael Vaughn Konshak, Barry D. Lovvorn, Mark Alan Grabbe, Dale Robert Eichel
  • Patent number: 6463351
    Abstract: A method for producing a medical device, such as a prosthetic or orthotic structure which makes the procedure more widely available at less cost. The method involves making a model of the body part for which a medical structure is to be manufactured using conformable fabric impregnated with a settable resin. The model may be prepared by a physician or a prosthetist who has no direct access to an expensive digitizing scanner. The model is removed from the patient's body part and shipped to a scanning facility where a digitizing scanner is used to produce a digitized image of the model. The digitized image is shrunk to compensate for the thickness of the model and the digitized data file is preferably sent back to the physician or prosthetist who manipulates the digitized image using a customized software program to produce a modified data file.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: October 8, 2002
    Assignee: Clynch Technologies, Inc.
    Inventor: George S. Clynch
  • Patent number: 6459582
    Abstract: A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device (“chip”). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: October 1, 2002
    Assignee: Fujitsu Limited
    Inventors: Hassan O. Ali, Richard L. Bechtel
  • Patent number: 6456495
    Abstract: A logic controller formed by self-contained device modules plugged onto a DIN rail and onto a backplane contained in the DIN rail, the modules variously comprising a power supply, a logic control, I/O devices and gateways, each I/O device having microprocessor power, and the modules having a sliding lock movable into position adjacent DIN-rail-engaging flexible tabs to block deflection of the tabs and removal of the module from the DIN rail.
    Type: Grant
    Filed: March 13, 2000
    Date of Patent: September 24, 2002
    Assignee: Eaton Corporation
    Inventors: Christopher John Wieloch, Anthony Edward Develice, Michael Thomas Little
  • Patent number: 6453219
    Abstract: A method and apparatus for controlling the temperature response profile of a part being exposed to heating and/or cooling conditions in a thermal processor incorporates measured data from the part to adjust the thermal processor control settings by closed loop feedback.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: September 17, 2002
    Assignee: KIC Thermal Profiling
    Inventors: Philip C. Kazmierowicz, Eric Dransfeldt, Stanley Douglas Schultz
  • Patent number: 6445589
    Abstract: A method of improving the life expectancy of surface mount components is electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a predetermined distance defined as the stand-off height. The relationship between the stand-off height and the life expectancy of the component is directly proportional. A larger stand-off height translates into a longer life expectancy. The stand-off height is limited only by manufacturing constraints, such as process limitations and cost concerns. The stand-off height is set to a predetermined dimension by way of a spacer positioned between the surface mount component and the printed circuit board.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: September 3, 2002
    Assignee: Delphi Technologies, Inc.
    Inventor: Mahesh K. Chengalva
  • Patent number: 6442017
    Abstract: A battery-power distribution unit comprises two printed circuit assembly bus units that carry eight pairs of ± screw terminal connections and their associated GMT-type fuses. Each A-side and B-side bus unit needs only one pair of heavy cables that feed it power inside a RETMA-rack cabinet. Heavy-duty foil buses etched on the printed circuit boards on both sides are reinforced with tinned copper flat bar to increase the current carrying capacity.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: August 27, 2002
    Assignee: Server Technology, Inc.
    Inventors: Carrel W. Ewing, Andrew J. Cleveland
  • Patent number: 6434443
    Abstract: A method/system for performing dynamic re-scheduling of priorities of work-in-process in a fabrication plant for manufacturing of a product is provided. It reads a key stage report for the work-in-process and a master production schedule for the work-in-process from stored data. It generates a master production schedule report from the key stage report and the master production schedule following only Due_Date data for the work-in-process, and generates a work-in-process distribution matrix for integrating the master production schedule report with work-in-process quantity data within a deliverable cycle time; allocates selected lots from the work-in-process distribution matrix using a snake pattern method to allocate the selected lots from the matrix, and changes the due date for the selected lots of the work-in-process selected by the snake pattern method. It generates a final re-scheduling table for the work-in-process including the selected lots.
    Type: Grant
    Filed: May 17, 1999
    Date of Patent: August 13, 2002
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventor: Kuo-Chen Lin
  • Patent number: 6434444
    Abstract: A method and apparatus for cutting patterned sheet material to provide a predetermined relationship between a pattern characteristic and the part to be cut. An estimated position of a pattern characteristic is projected onto the sheet material and a distance between the estimated position and an actual position of the pattern characteristic is identified. A transforming program calculates a position for other pattern characteristic positions and cutting instructions are then created and executed.
    Type: Grant
    Filed: March 11, 1998
    Date of Patent: August 13, 2002
    Assignee: Gerber Technology, Inc.
    Inventor: James S. Herman, Jr.
  • Patent number: 6430041
    Abstract: The present invention provides for an apparatus and method for cooling a computer component in a computer system. Some embodiments include single or multiple panels hinged to a chassis of the computer system to carry, locate, and temporarily reposition cooling fans within the computer system. Some disclosed methods provide for cooling of computer components through various combinations of cooling fans that are employed to move air into the system and subsequently move air over components of the system.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: August 6, 2002
    Assignee: MicronPC, LLC
    Inventors: Gregory P. Johnson, Paul Petersen, Jacques Gagne, Philip Hartley, Ray Gradwohl
  • Patent number: 6430049
    Abstract: A clip (10) for securing a heat sink (20) to an electronic device (30) includes a body (12) and a pair of fasteners (16) attached to opposite ends of the body. The body has a pressing portion (122), a pair of first connection portions (126) extending away from opposite ends of the pressing portion, and a fixing portion (134) depending from the pressing portion. The fixing portion includes a pair of stopping tabs (138). The pressing portion and the fixing portion each form a projection (142). The stopping tabs are received in cutouts (28) of the heat sink, to prevent the clip from moving parallel to grooves (26) defined in the heat sink. The projections are received in the grooves, to prevent the clip from moving perpendicular to the grooves. Thus a pair of clips and the heat sink are securely combined to form a single assembly (50).
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: August 6, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Cheng Tien Lai, Chao Wang