Abstract: An electronic device to be loaded on an electronic equipment or an electronic component is mounted on a mount substrate, the mount substrate being made thin and flexible and having strong resistance to bending. An electronic device package including: a flexible substrate having a wiring pattern formed thereon; and an electronic device having a terminal formation face on which a connection terminal is provided, wherein the connection terminal is electrically connected directly or via a conductive member to the wiring pattern, and the terminal formation face is substantially aligned in a neutral plane of bending in a thickness direction of the electronic device package.

Abstract: A socket is adapted for electrically connecting a chip module and a printed circuit board, and the socket includes a main body having a base and a plurality of contacts arranged in the base for resiliently contacting with the chip module, wherein the base includes a foundation and two lateral sidewalls extending from the foundation; an upper lid movably connecting to the main body; and a lock member securing the upper lid and the main body together. Each of the two lateral sidewalls has a projection disposed on at least one corner of an upper surface thereof for abutting against the upper lid.

Abstract: An EPROM structure for a nonvolatile semiconductor memory includes a plurality of memory cells that each include a floating gate transistor (6) that can be programmed by hot electrons and erased by UV light. An additional, common gate capacitance (7) is associated with each memory cell to raise the potential at the floating gate transistor (6) to the level required for writing by applying to the gate capacitances a predetermined voltage, common to all the memory cells.

Abstract: A semiconductor light emitting device including a semiconductor substrate and an active layer having band gap energy smaller than that of the active layer, and the bottom surface of the semiconductor substrate opposite to the active layer is a photo diffused reflection surface having unevenness. The unevenness reduces an amount of reflection rays to enable the stable operation.

Abstract: A flexible substrate strip comprises a plurality of substrate units adapted for mounting semiconductor chips. The surface of the flexible substrate strip is provided with a plurality of degating regions at locations such that the edges of mold runners and gates of a mold used to encapsulate the semiconductor chips in encapsulant material fit entirely within the degating regions when the substrate strip is placed in the mold during encapsulation of the semiconductor chips. The present invention is characterized in that each degating region has a buffer region at a location corresponding to the gate of the mold during encapsulation. The degating regions have a degating region material formed thereon with the buffer regions not coated with the degating region material. The adhesive force between the encapsulant material and the degating region material is less than the adhesive force between the encapsulant material and the substrate.