Patents Examined by Leonard Leo
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Patent number: 6098706Abstract: A heat exchanger is formed from a metal strip wound concertina fashion to provide superimposed plates. The plates are stamped in pairs separated by a narrow section which forms a return bend for folding the two plates over one another. Each plate is provided with ribs shaped to guide gas flow paths through the pocket between an inlet in one corner region of the plate and an outlet in a second corner region of the plate. Corrugated zones are formed in the plate between the ribs to promote a whirling motion of air as it travels between the ribs flanking the corrugated zones.Type: GrantFiled: December 31, 1998Date of Patent: August 8, 2000Assignee: Eco Air LimitedInventor: John Francis Urch
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Patent number: 6095234Abstract: A conveyance vehicle for the transportation of a vessel to be evacuated includes a heat sink in the form of one or more heat pipes located adjacent a seal forming part of a gripper assembly. The heat sink inhibits degradation of the seal when subjected to elevated temperatures consequent to engaging the neck of the vessel to be evacuated.Type: GrantFiled: February 26, 1997Date of Patent: August 1, 2000Assignee: BOC Group plcInventor: Graeme Huntley
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Patent number: 6095240Abstract: A heat exchanger having a plurality of coaxially aligned chambers for providing radiant, thermal heat transfer between a plurality of separately contained fluids within a single unit and a helical tube having at least one portion positioned within at least one of the chambers. A first, second, third, and fourth chambers are in coaxial alignment. The heat exchanger heats a cryogenic liquid to a gas phase using four different heat transfer fluids in one contained unit without mixing any of the fluids in the exchanger, thus reducing the size and cost, while increasing the efficiency of the heat exchanger.Type: GrantFiled: July 1, 1998Date of Patent: August 1, 2000Assignee: Vita International, Inc.Inventors: Hany E. Hassanein, James A. Bodhaine
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Patent number: 6092589Abstract: A counterflow evaporator for refrigerants, in particular for zeotropic refrigerants, where elongated inner members are inserted in the elongated tubular members of the evaporator to form an annular passage through which the refrigerant can flow. Resilient support members maintain the elongated inner members in position within the elongated tubular members.Type: GrantFiled: December 16, 1997Date of Patent: July 25, 2000Assignee: York International CorporationInventors: Ronald Henry Filius, Stephen Harold Smith
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Patent number: 6092587Abstract: A heating/cooling system includes a plurality of solid panels which form part of a wall or floor. The panels are in the form of heating/cooling modules and incorporate a heat exchange element within the panel and in thermal contact with the material, e.g. chipboard, fibreboard or plywood, forming the panel. The panels can be provided with, for example, tongue and groove formations so that they can engage with like panels or with "industry-standard" panels which do not incorporate heat exchange elements.Type: GrantFiled: November 12, 1997Date of Patent: July 25, 2000Inventor: Rex Anthony Ingram
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Patent number: 6092590Abstract: In a method and evaporator device for evaporating a low temperature liquid medium, such as hydrogen for example, the hydrogen is first evaporated and at least partially superheated in a forward-flowing first channel, and is then directed to flow back in the opposite direction in a second return-flowing channel. The second channel is especially interposed between the first channel and a passage through which flows a heat-providing medium such as a hot exhaust gas. Thus, the superheated hydrogen flowing in the second channel serves as an intermediate layer for heat transfer from the heat-providing medium through the hydrogen in the second channel to the low temperature, initially liquid hydrogen in the first channel. The heat exchange surfaces in contact with the heat-providing medium are not directly adjacent the extremely cold surfaces in contact with the in-flowing low temperature liquid hydrogen, and the superheated hydrogen acts as a buffer between the hot side and the cold side of the evaporator.Type: GrantFiled: May 5, 1997Date of Patent: July 25, 2000Assignee: DaimlerChrysler Aerospace Airbus GmbHInventor: Friedemann Suttrop
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Patent number: 6089314Abstract: The invention concerns a cooling body having at least one cooling duct for receiving a cooling medium which is fed to the cooling duct at a predetermined speed, the cooling duct comprising a plurality of stall centers.Type: GrantFiled: October 24, 1997Date of Patent: July 18, 2000Assignees: Daimler-Benz Aktiengesellschaft, ABB Daimler Transportation (Deutchland ) GmbHInventors: Klaus Becker, Wolfgang Staiger, Matthias Jung, Peter Heinemeyer
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Patent number: 6089313Abstract: An apparatus for exchanging heat between at least three fluids includes an elongate sealed chamber having at least two separate plate cores arranged inside the sealed chamber and means for supporting each of the plate cores inside the scaled chamber. Each of the plate cores are provided with circuits for two separate fluids, fluid inlet and outlet means for the respective circuits of the plate cores, and connecting means enabling fluid circulation between the plate cores.Type: GrantFiled: March 31, 1999Date of Patent: July 18, 2000Assignee: PackinoxInventors: William Levy, Dominique Sabin
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Patent number: 6085833Abstract: There is provided a heat sink having excellent heat dissipation characteristics and mechanical reliability, which is used for motors for electric vehicles, control circuits therefor, internal combustion engines, general power control units, general motors, general semiconductors (CPUs, power modules, etc.), optical semiconductors and various electronic components, etc. The heat sink is configured so that an aluminum alloy layer is formed on at least one side or on both sides of a metallic plate shaped body and fins are formed on the aluminum alloy layer. Because the fins are formed on the aluminum alloy layer provided on the metallic plate shaped body, satisfactory thermal diffusion is effected in the metallic plate shaped body, and the thermal resistance between the metallic plate shaped body and the fin is low, so that the heat radiating effect is high, and the heat sink can be made small. Also, excellent and stable heat dissipation can be achieved for a long period of time.Type: GrantFiled: June 9, 1997Date of Patent: July 11, 2000Assignee: Furukawa Electric Co., Ltd.Inventors: Naoki Kimura, Jun Niekawa, Osamu Kodachi
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Patent number: 6083101Abstract: An air outlet has a plurality of vertical vortex generating structures 21 in a triangular shape arranged so as to be oriented at an angle .theta. with respect to diffused air.Type: GrantFiled: February 24, 1998Date of Patent: July 4, 2000Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kunihiko Kaga, Tomoko Suzuki, Satoru Kotoh, Katsuhisa Ootsuta, Takayuki Yoshida, Eriko Kumekawa, Sakuo Sugawara, Tatsuo Seki
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Patent number: 6082445Abstract: A heat exchanger contains one or more heat exchange plates having on a common facial surface thereof a first heating fluid facial subchannel set containing at least one heating fluid facial subchannel and a first cooling fluid facial subchannel set containing at least one cooling fluid facial subchannel; wherein the heating fluid facial subchannel set and the cooling fluid facial subchannel set are mutually aligned in a heat exchange relationship on the common facial surface of the heat exchange plate(s).Type: GrantFiled: February 22, 1995Date of Patent: July 4, 2000Assignee: BASF CorporationInventor: Jeffrey S. Dugan
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Patent number: 6082439Abstract: In a mechanically assembled type heat exchanger, in which an end portion of an oval tube is inserted into a barring hole of a core plate and expanded to be press fit to the core plate. Then adhesive is potted on the core plate for sealing the press fit portion in the end of the tube. A reinforcing member is formed around the barring hole for increasing the rigidity of the core plate so as to improve the durability of sealing.Type: GrantFiled: November 26, 1997Date of Patent: July 4, 2000Assignee: Denso CorporationInventors: Seiichi Kato, Hisashi Nakashima, Sumio Susa
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Patent number: 6082448Abstract: The invention relates to a header of a heat exchanger for motor vehicles with an at least two-part design of the header of a tube bottom and a cap, which together form, optionally with at least one further component, the housing of the header. According to the invention, it is intended that the cap and/or the tube bottom together with the respective housing wall extending around is an integral diecast part.Type: GrantFiled: February 9, 1999Date of Patent: July 4, 2000Assignee: Valeo Klimatechnik GmbH & Co, KGInventor: Roland Haussmann
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Patent number: 6073688Abstract: A flat tube 2 for a heat exchanger which is formed by bending a single plate or overlaying two plates, wherein long beads 11 in a plurality of rows are previously formed on the plate in the longitudinal direction of the plate, the plate has its surface, to which the respective long beads are opposed, formed flat, the tops of the respective long beads 11 and the flat surface are joined, a plurality of passages 12 for a medium are formed within the tube by long beads and the flat surface, sections at the tube ends to be inserted into the header tanks 3, 4 are pressed back to be flat to form tube insertion sections, and a wall relief, which is formed to protrude in the breadth direction of the tube when the tube insertion sections are formed, is used as a stopper 16 to restrict a tube insertion level.Type: GrantFiled: July 3, 1997Date of Patent: June 13, 2000Assignee: Zexel CorporationInventor: Soichi Kato
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Patent number: 6073681Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.Type: GrantFiled: December 31, 1997Date of Patent: June 13, 2000Assignee: Temptronic CorporationInventors: Paul A. Getchel, Kenneth M. Cole, Sr., Henry A. Lyden
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Patent number: 6070655Abstract: A heat exchanger, for use in particular in connection with the process outlets at paper, pulp and board mills, including substantially parallel tubes or equivalent arranged in a duct. An air flow that delivers heat passes through the tubes and an air flow that receives heat passes through gaps between the tubes in accordance with the cross-flow principle. The heat faces of the tubes are made larger at the side of the flow that receives heat by means of ribs, lamellae or equivalent, and an air that is moist, saturated, or near its saturation curve is used as the air flow that delivers heat in the heat exchanger.Type: GrantFiled: June 6, 1997Date of Patent: June 6, 2000Assignee: Valmet CorporationInventor: Pertti Heikkila
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Patent number: 6070659Abstract: A heat exchanger unit has a case made of plastic or resin, and a heat exchanger is accommodated and fixed within the case. Within the case, first terminal ends of the inlet pipe and outlet pipe are connected to the heat exchanger, and second terminal ends of the pipes are fixed to a wall on the case by the external pipe connection portion. The external pipe connection portion has a flange portion formed integrally with the case itself on the wall, and a nut plate.Type: GrantFiled: January 20, 1998Date of Patent: June 6, 2000Assignee: Sanden CorporationInventor: Kazuki Hosoya
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Patent number: 6070652Abstract: The invention relates to a ball collector for a device for returning balls for the cleaning of the tubes of cooling systems operated with a fluid, namely water, comprising a casing which is subdivided into an upper chamber with an inlet for the balls and a lower chamber with an outlet for the balls, in which between the upper and the lower chambers is provided an opening which can be closed by a movable flap in the closed position thereof and can be opened in the open position thereof, the upper chamber having a strainer screen being connected to the lower chamber by a bypass line having a pump, through which water can be pumped from the upper chamber into the lower chamber.Type: GrantFiled: April 28, 1999Date of Patent: June 6, 2000Assignee: Taprogge GmbHInventors: Hans-Werner Schildmann, Hartono Widjaja, Peter Schink
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Patent number: 6070657Abstract: The heat exchanger tube comprises a cylindrical, smooth walled outer tube (1) of steel into which a profiled insert (2) of aluminium is inserted. The profiled insert is constituted by two half shells (3,4) which engage in one another at their longitudinal edges with groove-shaped recesses (7) and rib-like projections (8). Both half shells (3,4) carry longitudinally extending ribs (5) on their internal surface which are so aligned that each half shell with its ribs constitutes a profile which is open on one side.Type: GrantFiled: September 16, 1996Date of Patent: June 6, 2000Assignee: Hoval Interliz AGInventor: Wolfgang Kunkel
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Patent number: 6068051Abstract: The heat sink includes a mounting block having a channel for clamping a device being coupled to the heat sink. The channel serves as a clamp to substantially eliminate relative rotation between the heat sink and the device when the device is being fastened to the heat sink. The heat sink further includes a first wall and a second wall wherein the first and second walls and the mounting block provide a substantially U-shaped body for the heat sink. In one embodiment, the heat sink includes a threaded nut aligned with a hole in the channel to ease alignment issues when the device is being fastened to the heat sink. In one embodiment, the heat sink includes convection fins extending from a U-shaped base and a U-shaped top of the heat sink. In one embodiment, the heat sink includes mounting pins inserted into the base of the heat sink. In one embodiment, the heat sink includes anti-tipping pins inserted into the base of the heat sink.Type: GrantFiled: March 23, 1998Date of Patent: May 30, 2000Assignee: Intel CorporationInventor: Randall Dean Wendt