Patents Examined by Leonard R. Leo
  • Patent number: 8201616
    Abstract: A radiator fin of a heat sink has a shape of a portion of a circle with a small radius which is not overlapped with a circle with a large radius when two circles with different radiuses are overlapped with each other such that centers of the two circles are in a single circle, as a cross sectional shape. An arrangement of radiator fins of a heat sink on a radiator plate, includes at least two radiator fins provides to at least one radiator plate such that centers of inner and outer arcs of circles forming the radiator fins are on a reference line, and an outer arc of one of two adjacent radiator fins moves within a track of an inner arc of the other radiator fin or an inner arc of one radiator fin moves out of a track of an outer arc of the other radiator fin.
    Type: Grant
    Filed: August 4, 2007
    Date of Patent: June 19, 2012
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Dong Kwon Kim, Tae Young Kim, Sung Jin Kim
  • Patent number: 8196647
    Abstract: A method and equipment for distribution of two fluids into and out of channels in a multi-channel monolithic structure (monolith) where the channel openings are spread over an entire cross-sectional area of the monolithic structure. The equipment consists of a manifold head, a monolith unit or a monolith stack, a row of monolith units or monolith stacks, or a monolith block. In addition a method and a reactor for mass and/or heat transfer between two fluids transfers the two fluids using one or more of the manifold heads and monolith units, the monolith stack, the row of monolith units or monolith stacks, or the monolith block.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: June 12, 2012
    Assignee: Norsk Hydro ASA
    Inventors: Tor Bruun, Bjørnar Werswick
  • Patent number: 8196644
    Abstract: A heat exchanger comprising a large number of flexible individual elements, has supply and discharge devices for the heat exchanger media and also has, for these elements, tension devices which expand during heating. The tensioning of the individual elements, which are adhesively bonded at each of their two ends into slots of end plates, takes place by the application of the required forces to the end plates. A heat exchanger of this type is illustrated in FIG. 1.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: June 12, 2012
    Assignee: Tetra Laval Holdings & Finance SA
    Inventor: Jörgen Niske
  • Patent number: 8181696
    Abstract: The invention relates to a plate heat exchanger including a plurality of plates. The plates extend in parallel to a main extension plane and include several heat exchanger plates and a strengthening plate (2). The heat exchanger plates are provided beside each other and form a plate package with first plate interspaces and second plate interspaces. Each heat exchanger plate has four portholes forming ports (8) through the plate package. The heat exchanger plates include an outermost heat exchanger plate at one side of the plate package and an outermost heat exchanger plate at an opposite side of the plate package. Two of the plate interspaces in the plate package form a respective outermost plate interspace at a respective side of the plate package, which are delimited outwardly by a respective one of the outermost heat exchanger plates. The strengthening plates are provided outside one of the first heat exchanger plates.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: May 22, 2012
    Assignee: Alfa Laval Corporate AB
    Inventor: Jens Erik Johannes Rassmus
  • Patent number: 8176972
    Abstract: An arrangement for improving the cooling efficiency of semiconductor chips. One embodiment is to construct a vapor chamber with one compliant surface for improving the efficiency of transferring heat from a semiconductor chip to the vapor chamber, and another embodiment is to construct a vapor chamber with the chip substrate such that the chips are embedded inside the vapor chamber. One surface of the vapor chamber has a flexible structure to enable the surface of the vapor chamber to be compliant with the surface of a chip or a heat sink device.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: May 15, 2012
    Assignee: International Business Machines Corporation
    Inventor: Lawrence S. Mok
  • Patent number: 8162038
    Abstract: A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket includes a mounting portion secured on the base and a pair of supporting arms extending from the mounting portion and fixed to the fan. Four screws extend through the fan to threadedly engage with the fin group. Lower two of the screws also extend through the supporting arms of the supporting bracket whereby the supporting bracket also connects with the fan.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: April 24, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Qiang Wu, Chun-Chi Chen
  • Patent number: 8162034
    Abstract: An elongated structure (100) for the transmission of fluid-based compositions at non-ambient temperatures comprising a first conduit (130) for the transmission of a fluid-based composition, at least one flexible, elongated and inflatable temperature control conduit (110a, 110b) for the transmission of a temperature control fluid, the temperature control conduit (110a, 110b) having a relatively rigid elongated reinforcement member (116a, 116b); and elongated cover (140) holding said temperature control conduit (100a, 110b) in thermal communication with the first conduit (130).
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: April 24, 2012
    Inventor: Michael R. Bonner
  • Patent number: 8162040
    Abstract: A heated energy system includes an integral ceramic insert heat exchanger having an integral ceramic construction and an outer ceramic wall that is helical in shape. When the heat exchanger is positioned within a surrounding fluid path enclosure, the outer ceramic wall forms, with the enclosure, at least one spiral path for flowing products of energy generation. No more than one insert body has an outer wall that is helical in shape that is present along the first length of the surrounding fluid path enclosure. The outer ceramic wall receives heat energy when the products of energy generation flow through the fluid path. A method for fabricating integral ceramic insert heat exchangers includes using a tool having a silicon carbide channel and a cavity channel, the silicon carbide channel extending at least partially outside the cavity channel in directions defined by a rotational plane of the tool.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: April 24, 2012
    Assignee: Spinworks, LLC
    Inventor: Thomas D. Briselden
  • Patent number: 8136581
    Abstract: A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: March 20, 2012
    Assignee: Sony Corporation
    Inventors: Minehiro Tonosaki, Eisaku Kato, Masakazu Yajima, Takashi Yajima
  • Patent number: 8122943
    Abstract: Heat exchanger, for example for a motor vehicle air-conditioning circuit, comprising a plurality of tubes (12) for circulating a heat-transfer fluid, the ends of said tubes (12) opening into manifolds and reservoirs (11) of thermal storage material in contact with the tubes (12) so that the storage material and the heat-transfer fluid exchange heat with one another. The exchanger comprises a plurality of heat-exchange elements (4) each housing at least one reservoir (11) and at least one tube (12) which are nested.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: February 28, 2012
    Assignee: Valeo Climatisation
    Inventors: Régine Haller, Sylvain Moreau, Jean-Luc Thuez
  • Patent number: 8113269
    Abstract: A combustion gas furnace includes a plurality of primary heat exchangers for passage of combustion gases therethrough. A plurality of secondary heat exchangers receive the combustion gases from the primary heat exchanger. Each of the secondary heat exchangers includes a heat conductive element defining a plurality of elongate passageways for the flow of combustion gas therethrough. The passageways include aligned ports at either end thereof. The passageways are generally aligned and separated by longitudinal walls extending between the ends. The walls are positioned for heat conductive contact with the combustion gases flowing through passageways.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: February 14, 2012
    Assignee: Thomas & Betts International, Inc.
    Inventor: Werner O. Specht
  • Patent number: 8096136
    Abstract: A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.
    Type: Grant
    Filed: September 1, 2008
    Date of Patent: January 17, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong-Bo Zheng, Meng Fu, Chun-Chi Chen
  • Patent number: 8091616
    Abstract: A heat transfer tube can comprise a tube body, and outer fins integrated with the tube body which are formed by allowing material on the tube body to extend along radial direction of the tube body and wind and extend around the tube outer surface in helical manner, wherein microscale channels are formed on at least one lateral surface of the outer fin.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: January 10, 2012
    Assignee: Jiangsu Cuilong Precision Copper Tube Corporation
    Inventors: Minghua Lu, Chunming Zhang, Xing Luo, Haoping Zhou
  • Patent number: 8087455
    Abstract: A rib plate type heat exchanger comprises a heat exchange core consisting of rib plate type heat exchange plates. A surrounding edge of the rib plate type heat exchange plate is formed as a sealing bevel. The rib plate type heat exchange plate comprises the first end zone, the second end zone and a central heat exchange zone. The first and second distribution zones are provided in the first and the second end zones respectively. The central heat exchange zone and first and second distribution zones are arranged on a same plane and are extended in the height of a lower plate plane. Heat exchange ribs and flow guide ribs are provided in the central heat exchange zone and the distribution zones respectively. Corner holes which are surrounded by adjacent edge zones at the upper plate plane height and lower plate plane height are provided in the first end zone and the second end zone.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: January 3, 2012
    Assignee: Wuxi Hongsheng Heat Exchanger Co.
    Inventors: Zhixian Miao, Xiang Ling, Faqing Niu
  • Patent number: 8079406
    Abstract: A thermal module includes a centrifugal blower (10), a heat sink (20) mounted to an air outlet (11) of the centrifugal blower, a heat pipe (40) connecting the heat sink with a heat generating electronic component, and a resilient clip (80) for mounting the heat pipe onto the heat generating electronic component. The resilient clip includes an M-shaped pressing portion (82) disposed above an evaporation section (44) of the heat pipe, a plate portion (83) disposed at one end of the pressing portion for being fixed to a sidewall (53d), and an abutting portion (85) disposed at the other end of the pressing portion and including an abutting plate (85b) for abutting against a bottom surface of another sidewall (53b).
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: December 20, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jui-Wen Hung, Ching-Bai Hwang, Jie Zhang
  • Patent number: 8069907
    Abstract: A heat pipe for cooling a heat-generating component has a generally planar, sealed flexible body having an evaporator section, a condenser section, and a flexible bellows section. The bellows section is located between the evaporator section and the condenser section along a longitudinal length of the body. A chamber extends from the evaporator section to the condenser section inside the body and contains a working fluid. The bellows section includes internal supports to keep the chamber open during repeated bending of the heat pipe at the bellows section.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: December 6, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Johnny P. Bryant, James R. Bylander, Vern E. Radewald
  • Patent number: 8056615
    Abstract: An evaporative compact high intensity cooler (ECHIC) for transferring heat from a heat source along a heat conduction surface of the heat source with a two-phase coolant, comprises a flow passage labyrinth of flow passages with short conduction paths interrupted by coolant columns that all radiate from at least one coolant supply passage and offer the coolant expanding volume as the coolant evaporates due to absorbing heat within the flow passages from the heat conduction surface to maintain nearly isobaric conditions for the coolant to maintain relatively constant temperature throughout the ECHIC as it absorbs heat from the heat source and limit boundary layer formation within the flow passages to improve heat transfer.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: November 15, 2011
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Robert Scott Downing
  • Patent number: 8006748
    Abstract: Sealing arrangement for an internal tubesheet for tubular heat exchangers comprising, a gasket fitted between a shoulder and a tubesheet, the gasket being made of spiral wound construction but without any metallic rings and without any locating groove in the adjoining components. On the outer side of the tubesheet, a channel box is provided with its inner face resting on a shoulder provided on an outer diameter of the tubesheet while the outer face of the channel box is reduced in diameter and arranged to align with the centerline of the push bolts, the outer face of the channel box resting against and attached to an annular ring and the push bolts being provided in threaded holes that reach up to the outer face of an internal flange. The push bolts, when tightened, load the annular ring, which in turn loads the gasketed joint through the channel box and the tubesheet.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: August 30, 2011
    Assignee: Larsen & Toubro Limited
    Inventors: Anil Kumar Modi, Veeravali Ramesh Nembilli, Venkatesh Murur
  • Patent number: 8006749
    Abstract: Seal for tubular heat exchanger comprising groove with an inner edge; tongue of the diaphragm having front face extending in the radial direction and inner edge parallel to the axis of the channel; the face extending beyond the radial width of the groove in inward direction and overlapping the face of the shoulder of the channel in which the groove being provided. The tongue of the diaphragm being thus kept away from entering the groove; the diaphragm having flexibility to permit deflection of the tongue, the tongue of the diaphragm being loaded from outer side by the internal compression ring, the said internal compression ring being loaded in turn by the threaded push bolts/rods being fitted in the threaded holes on periphery of the threaded lock ring. This load is ultimately transferred to the joint between the gasket and face to achieve leak-proof joint.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: August 30, 2011
    Assignee: Larsen & Toubro Limited
    Inventors: Anil Kumar Modi, Veeravali Ramesh Nembilli, Venkatesh Murur
  • Patent number: 7992626
    Abstract: A combination spray and cold plate thermal management system for effectively thermally managing a heat producing device during startup. The combination spray and cold plate thermal management system includes a spray unit thermally managing a heat producing device and a coolant reservoir thermally connected to the heat producing device. The coolant reservoir includes a porous media with coolant channels for storing a volume of the waste coolant after spraying of coolant has terminated. The coolant reservoir is fluidly connected to the spray chamber within the spray unit to receive the waste coolant.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: August 9, 2011
    Assignee: Parker-Hannifin Corporation
    Inventors: Charles L. Tilton, Donald E. Tilton, Thomas D. Weir, John D. Schwarzkopf