Patents Examined by Leung Philip H.
  • Holding structure of substrates
    Patent number: 4725920
    Abstract: A multiple substrate assembly has a metallic plate sandwiched in between two printed circuit substrates. The metallic plate has cut and erect segments passing through thru-holes formed in at least one substrate, so that printed circuit paths on the outer surfaces of the substrates can be grounded to the metallic plate.
    Type: Grant
    Filed: October 9, 1985
    Date of Patent: February 16, 1988
    Assignee: Alps Electric Co., Ltd.
    Inventors: Sadayoshi Ijichi, Tetsuro Umemoto