Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for providing a 3D memory array apparatus. In one embodiment, the apparatus may comprise a substantially hexagonal arrangement having seven pillars disposed in a die in a repeating pattern. The arrangement may include first and second pillars disposed at a pillar pitch from each other in a first row; third, fourth, and fifth pillars disposed at the pillar pitch from each other in a second row; and sixth and seventh pillar disposed at the pillar pitch from each other in a third row and shifted relative to the first and second pillars respectively by a quarter of the pillar pitch in a direction that is substantially orthogonal to bitlines disposed in the die. Each pillar in the arrangement may be electrically coupled with a different bitline. Other embodiments may be described and/or claimed.