Patents Examined by Lionel Nouketcha
  • Patent number: 11493226
    Abstract: Provided is an air conditioning apparatus that sufficiently raises the temperature of hot air to be blown out when receiving a request for high-temperature air temporarily raising the temperature of the hot air. A first use side unit includes a first use side heat exchanger and a first use side fan. A second use side unit includes a second use side heat exchanger and a second use side fan. When the first use side unit receives a request for the high-temperature air and the second use side unit receives no request for the high-temperature air, the air conditioning apparatus shifts to a mode that performs control to reduce the airflow volume of the second use side fan or make the airflow volume of the second use side fan zero such as reducing the number of revolutions of the second use side fan in another room by 40 rpm.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: November 8, 2022
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Akihiro Nakano, Takeshi Yamakawa
  • Patent number: 11486607
    Abstract: Thermal management systems include an open circuit refrigeration system featuring a first receiver configured to store a gas, a second receiver configured to store a liquid refrigerant fluid, an evaporator configured to extract heat from a heat load that contacts the evaporator, and an exhaust line, where the first receiver, the second receiver, the evaporator, and the exhaust line are connected to provide a refrigerant fluid flow path.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: November 1, 2022
    Assignee: Booz Allen Hamilton Inc.
    Inventors: James A. Davis, Igor Vaisman, Joshua Peters
  • Patent number: 11486602
    Abstract: The present invention provides a foldably packed temperature adjustment fan, which comprises a water tank assembly, having a water storage cavity; and a shell assembly, mounted on a top of the water tank assembly, wherein the shell assembly comprises a plurality of side plate assemblies for surrounding and forming an airflow cavity and a top plate assembly, at least a part of the side plate assemblies are respectively utilized as a whole body and are detachably mounted on an edge of the top of the water tank assembly, and at least a part of the side plate assemblies can be completely accommodated in the water storage cavity after being detached. The present invention further provides a folding method of the foldably packed temperature adjustment fan.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 1, 2022
    Assignee: Jmatek (Zhongshan) Ltd.
    Inventors: Naresh Kumra, Yi Pu, Huoxi Zhou
  • Patent number: 11474576
    Abstract: An electrical device with thermally controlled performance is disclosed. The electrical device includes at least one die with a plurality of device components disposed upon or at least partially embedded within the die. The electrical device further includes a plurality of signal paths interconnecting the plurality of device components. The electrical device further includes a plurality of temperature sensors disposed upon or at least partially embedded within the die. The temperature sensors are configured to detect thermal loads at respective portions of the die. The electrical device further includes at least one controller disposed upon or at least partially embedded within the die. The controller is configured to adjust one or more operating parameters for one or more of the device components based on the thermal loads detected by the temperature sensors.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: October 18, 2022
    Assignee: Rockwell Collins, Inc.
    Inventors: Alan P. Boone, Brandon C. Hamilton, Kyle B. Snyder, Bryan M. Jefferson
  • Patent number: 11466922
    Abstract: A refrigeration device capable of chilling beverage ingredients and accessories is disclosed. The refrigeration device may include a first compartment that defines a first open top area, a second compartment that defines a second open top area, and a wall disposed between the first and second compartments. The refrigeration device may further include a controller configured to control the temperature in at least one of the first and second compartments, a temperature regulator configured to adjust a thermal communication between the first and second compartments, and a lid assembly movable between an opened and a closed position.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: October 11, 2022
    Assignee: Perlick Corporation
    Inventors: Tobin G. Ellis, Karl R. Krumbiegel, Jonathon Haggerty, Brian J. Madson
  • Patent number: 11466673
    Abstract: In a cryopump, a primary cryopumping array having adsorbent and cooled by a second refrigerator stage extends along radiation shield sides. That array is shielded by a condensing cryopumping array that extends along the primary cryopumping array. The primary cryopumping array may be a cylinder with adsorbent on an inwardly facing surface, and the condensing cryopumping array may comprise an array of baffles having surfaces facing the frontal opening. A raised surface such as a conical surface at the base of the radiation shield redirects molecules received from the frontal opening toward the primary cryopumping array. The refrigerator cold finger may extend tangentially relative to the radiation shield or connect to the base of the radiation shield.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: October 11, 2022
    Assignee: Edwards Vacuum LLC
    Inventors: Allen J. Bartlett, Gerald M. Szarek, Paul K. Mahoney
  • Patent number: 11466929
    Abstract: A refrigerator may include a cabinet, and a drawer provided with a front panel and a storage bin provided at a rear of the front panel, the front panel being provided so that the open front portion of the storage chamber is opened and closed, and the storage bin being received in a storage chamber. The refrigerator may also include a deodorizing case including an upper end part provided on an inner surface of the storage bin, and a lower end part provided on an outer surface of the storage bin. Additionally, a deodorizing member provided in an inner part of the deodorizing case to remove an odor of the storage chamber.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: October 11, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Kwang Hyun Choi
  • Patent number: 11454414
    Abstract: A method and system of activating a fan for an air conditioning system is disclosed. Upon the sensing of rain in the proximity of the air conditioning system, such as a condenser, a fan is activated. The fan is configured to drive air and rain through the condenser. The fan can be configured to operate periodically or for a pre-set amount of time while rain is being sensed.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: September 27, 2022
    Assignee: CARRIER CORPORATION
    Inventors: Kerry Allahar, Matthew Patterson
  • Patent number: 11446980
    Abstract: A sound damper and associated system are disclosed for damping sound. In embodiments, the sound damper is utilized within an automotive HVAC system. A passage wall defines an air passageway that transmits air. The sound damper includes a micro perforated panel (MPP) located within an opening formed into a passage wall. A back wall is spaced from the MPP, and a cavity is provided between the back wall and the MPP that is outside the air passageway. In embodiments, the MPP can be covered by a non-perforated film that is acoustically transparent and air impermeable.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: September 20, 2022
    Assignee: DENSO INTERNATIONAL AMERICA, INC.
    Inventors: Prakash Thawani, Stephen Sinadinos, Joseph Burtch
  • Patent number: 11447839
    Abstract: The present invention relates to an air conditioner. The air conditioner according to the present embodiment has a refrigeration capacity of 7 kW to 11 kW, inclusive, and uses a refrigerant R134a as a refrigerant, and since a refrigerant pipe therein is made of a ductile stainless steel material having 1% or less of a delta-ferrite matrix structure with respect to the grain size area thereof, and includes a suction pipe guiding the suction of the refrigerant into a compressor and having an outer diameter of 15.88 mm, the refrigerant pipe can maintain strength and hardness as good as or better than those of a copper pipe, while also maintaining good processability.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: September 20, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Seokpyo Hong
  • Patent number: 11448430
    Abstract: An embodiment of the instant disclosure comprises a reversible heat pump and water heating system for conditioning a space and heating water. The system comprises a refrigerant circuit that includes a compressor, a source heat exchanger, a space heat exchanger, and an expansion device. A 4-way reversing valve alternates between heating and cooling modes of operation. The system includes a heat exchanger for heating water in the water heating loop, and a 3-way valve that either actuates the refrigerant flow through the water heater heat exchanger or bypasses at least a portion of the refrigerant flow around the water heater heat exchanger. The heat pump system is operable in at least five modes—space heating only, space cooling only, water heating only, and either space heating or space cooling combined with water heating.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: September 20, 2022
    Assignee: Climate Master, Inc.
    Inventors: Michael F. Taras, Michael S. Privett, Jeremy R. Smith
  • Patent number: 11448456
    Abstract: In an entrance refrigerator, when a living organism such as a companion animal is detected in a storage compartment, a drain port provided at the bottom of the storage compartment is opened, such that air outside the storage compartment flows into the storage compartment through the drain port.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 20, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Minkyu Oh, Insun Yeo, Kyukwan Choi, Yezo Yun, Deukwon Lee, Minseok Kim, Wonjin Lee
  • Patent number: 11441826
    Abstract: Embodiments of the present disclosure relate to a vapor compression system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, a condenser disposed downstream of the compressor along the refrigerant loop and configured to condense vapor refrigerant to liquid refrigerant, a subcooler coupled to the condenser, where the subcooler is external of a shell of the condenser, and where the subcooler is configured to receive the liquid refrigerant from the condenser and to cool the liquid refrigerant to subcooled refrigerant, and an evaporator disposed downstream of the subcooler along the refrigerant loop and configured to evaporate the subcooled refrigerant to the vapor refrigerant.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: September 13, 2022
    Assignee: Johnson Controls Tyco IP Holdings LLP
    Inventors: Jeb W. Schreiber, Eric H. Albrecht, Kevin D. Krebs, Justin P. Kauffman, Brian L. Stauffer, Xiuping Su, Li Wang, Fang Xue
  • Patent number: 11441825
    Abstract: A cooling system includes a dual plate structure having a porous material disposed between the plates such that the porous material is sealed from ambient at a pressure less than ambient. A cooling device is thermally coupled to a mobile device supported by the structure and actively removes heat from the mobile device.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: September 13, 2022
    Assignee: Honeywell International Inc.
    Inventors: Steven J. Eickhoff, Paul Bryant Koeneman, Jeffrey Michael Klein, Wei Yang, Jong Park, Gustav Rustan
  • Patent number: 11436558
    Abstract: Disclosed is a refrigerator configured to perform artificial intelligence (AI) algorithms and/or machine learning algorithms, communicate with other electronic devices and external servers in a 5G communication environment, and provide information based on an image. The refrigerator includes a camera, a display, and a processor. Accordingly, various services can be provided to improve user convenience by accurately identifying a photographing target.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: September 6, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Yoon Gon Park
  • Patent number: 11439042
    Abstract: A heat exchange assembly includes a thermal bridge including upper and lower bridge elements including upper and lower plates arranged in plate stacks. The lower plates include lower fin plates and lower spacer plates with lower ends configured to be mechanically and thermally coupled to the electrical component. The upper plates include upper fin plates and upper spacer plates with upper ends configured to be mechanically and thermally coupled to a heat exchanger. The upper and lower fin plates are interleaved. The heat exchange assembly includes installation spring elements coupled between the upper and lower plates and biased against the upper and lower plates during installation. The installation spring elements are removable after the upper and lower plates are coupled to the electrical component and the heat exchanger to remove the biasing force between the upper and lower plates.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: September 6, 2022
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventor: Alan Weir Bucher
  • Patent number: 11428216
    Abstract: A cryopump includes: a first-stage cryopanel; a second-stage cryopanel; a cryocooler thermally coupled to the first-stage cryopanel and the second-stage cryopanel to cool the first-stage cryopanel to a first-stage cooling temperature and cool the second-stage cryopanel to a second-stage cooling temperature that is lower than the first-stage cooling temperature; and a cryocooler controller configured to execute first-stage temperature control for controlling the first-stage cooling temperature to a first-stage target temperature and increase the cooling capacity of the cryocooler when an increase in the second-stage cooling temperature is detected during the execution of the first-stage temperature control.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 30, 2022
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventor: Kakeru Takahashi
  • Patent number: 11421308
    Abstract: The present invention relates to an air conditioner. The air conditioner according to the present embodiment has a refrigeration capacity of 2 kW to 7 kW, inclusive, and uses R410a as a refrigerant circulating therein, and since a refrigerant pipe therein includes a ductile stainless steel pipe made of a material containing, at least, chrome (Cr), nickel (Ni), manganese (Mn) and copper (Cu), the refrigerant pipe can maintain strength and hardness as good as or better than those of a copper pipe, while also maintaining good processability.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: August 23, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Seokpyo Hong
  • Patent number: 11421670
    Abstract: A cryopump has a cryogenic refrigerator with cold and colder stages that cool a radiation shield, a primary cryopumping array and a frontal array. The frontal array is coupled to the cold stage and is spaced from and wrapped around the frontally facing envelope of the primary cryopumping array. The frontal array may be recessed from the frontal opening and closer to the primary cryopumping array than to the frontal opening.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: August 23, 2022
    Assignee: Edwards Vacuum LLC
    Inventors: Paul K. Mahoney, John J. Casello
  • Patent number: 11421293
    Abstract: The present invention relates to an air conditioner. The air conditioner according to the present embodiment has a refrigeration capacity of 16 kW to 28 kW, inclusive, and uses a single refrigerant R32 as a refrigerant, and a refrigerant pipe therein includes a ductile stainless steel pipe having 1% or less of a delta-ferrite matrix structure with respect to the grain size area thereof.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: August 23, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Seokpyo Hong