Patents Examined by Lonh K. Tran
  • Method of forming a semiconductor die with heat and electrical pipes
    Patent number: 7338840
    Abstract: Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in the substrate that extend from a bottom surface of the substrate to a point near the top surface of the substrate.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: March 4, 2008
    Assignee: National Semiconductor Corporation
    Inventors: Gobi R. Padmanabhan, Visvamohan Yegnashankaran