Abstract: The microfluidic chip and the microfluidic system of the present invention provides a unique integration of a microfluidic chip and a label-free quantification process. The microfluidic chip uses well arrays and dielectrophoresis (DEP) to capture a polarizable agent in a well. Once the polarizable agents have been captured, non-faradaic electrochemical impedance spectroscopy (nF-EIS) measurements can be performed to quantify the polarizable agent.

Abstract: In some aspects, an analyte sensor is provided for detecting an analyte concentration level in a biological fluid sample. The analyte sensor has a base including a top and bottom side, a lid, and an attachment member including one or more retention tabs coupled proximate the top side so that the analyte sensor can be grasped by the sensor's top side. Manufacturing methods and systems adapted to use and dispense the analyte sensors are provided, as are numerous other aspects.

Abstract: Co-sensitizers that co-adsorb with a sensitizing dye to the surface of an interconnected semiconductor oxide nanoparticle material increase the efficiency of photovoltaic cells by improving their charge transfer efficiency and reducing the back transfer of electrons from the interconnected semiconductor oxide nanoparticle material to the sensitizing dye.

Abstract: A barrel plating device is disclosed, wherein hollow support shafts placed to be approximately level with each other are mounted in a piercing form to support members combined together to face each other at a prescribed interval, the opposite ends of a barrel having a hollow drum part whose opposite ends are closed with end plates are supported to the above support shafts in a rotatable condition, a lead wire having an electrode at a tip end and coated with an insulation layer is inserted in watertight and non-rotatable conditions into a hollow part of each support shaft in such a manner as to allow the above lead wire to pierce through the corresponding end plate of the barrel, and a collar formed with a low friction member is mounted to each lead wire portion that pierces through the above corresponding end plate of the barrel.

Abstract: The invention includes methods of fabrication and apparatuses. In at least some embodiments of the applicants' invention, the methods include processes of: maskless selective deposition of non-layered structures, selective etching and/or deposition without use of a separate mask and/or lithography techniques, retaining selected portions of sacrificial material during removal (e.g. etching) of other portions of sacrificial material, depositing materials other than the structural and sacrificial materials, including more than one type of structural and/or sacrificial material, and fabrication of interlacing elements. Embodiments of the methods of the invention provide increased capabilities, properties, flexibility and in the fabrication of three-dimensional structures by electro-deposition or other techniques.

Abstract: A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type formed from a laminated sheet of material having a stainless steel layer, a conductive lead layer and an insulating layer separating the stainless steel and conductive lead layers. An aperture is formed through at least the insulating layer to expose the stainless steel layer at an interconnect site. An interconnect mask is applied around the interconnect site. Conductive material is electroplated onto the stainless steel layer at the interconnect site to form a plated interconnect. The mask is then removed. The method is used to form an interconnect bond pad on the same side of the stainless steel layer as the conductive lead layer in one embodiment.

Abstract: An electro-chemical plating system includes an upper rotor assembly for receiving and holding a wafer; an electroplating reactor vessel for containing plating solution in which the wafer is immersed; an anode array including a plurality of concentric anode segments provided inside the electroplating reactor vessel; a power supply system including power supply subunits for controlling electrical potentials of the anode segments, respectively; and a plurality of sensor devices mounted inside the upper rotor assembly, wherein the sensor devices are substantially arranged in corresponding to the anode segments, and during operation, the plurality of sensor devices are utilized for in-situ feeding back a deposition profile to a control unit in real time.

Abstract: A method is provided for electroplating a gate metal or other conducting or semiconducting material directly on a dielectric such as a gate dielectric. The method involves selecting a substrate, dielectric layer, and electrolyte solution or melt, wherein the combination of the substrate, dielectric layer, and electrolyte solution or melt allow an electrochemical current to be passed from the substrate through the dielectric layer into the electrolyte solution or melt. Methods are also provided for electrochemical modification of dielectrics utilizing through-dielectric current flow.

Abstract: A thermoelectric converting device includes a P type thermoelectric element, an N type thermoelectric element, the N type thermoelectric element connected with the P type thermoelectric element alternately to be electrically in series, an electrode circuit contacting the P type thermoelectric element and the N type thermoelectric element, an insulation substrate, at least one electric circuit forming a layer with the electrode circuit via the insulation substrate, and a conduction member for electrically conducting the electrode circuit and the electric circuit.

Abstract: A thermal ink jet printhead (40) for the emission of drops of ink on a print medium (46) comprises a tank (103) containing ink (142), a lamina (67), a groove (45) and a plurality of ejectors (73), each of which comprises in turn a chamber (74) placed laterally with respect to the groove (45), and fluidly connected thereto by means of a plurality of elementary ducts (75) produced on said lamina (67).

Abstract: A method and an apparatus which permits making a composite oxide thin film excellent in crystallinity easily and at a low temperature, with the capability of controlling the basic unit cell structure as desired, and without the need for a post annealing, as well as a composite oxide thin film thereby, especially a Cu group high temperature superconducting thin film, are disclosed. A thin Cu group high temperature superconducting film, which is constituted of a charge supply block (1) and a superconducting block (2), is formed on a substrate by alternately sputtering from a sputtering target having a composition of the charge supply block (1) and a sputtering target having a composition of the superconducting block (2) and repeating such an alternate sputtering operation a number of times needed for the film to reach a desired thickness.

Abstract: The present invention relates to gated nanorod field emission devices, wherein such devices have relatively small emitter tip-to-gate distances, thereby providing a relatively high emitter tip density and low turn on voltage. Such methods employ a combination of traditional device processing techniques (lithography, etching, etc.) with electrochemical deposition of nanorods. These methods are relatively simple, cost-effective, and efficient; and they provide field emission devices that are suitable for use in x-ray imaging applications, lighting applications, flat panel field emission display (FED) applications, etc.

Abstract: A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.

Abstract: On an apparatus for electrochemical precision machining, the tool holder (1) performing the oscillatory motion is supported by bearing bushes (25, 26) made of a swelling material within a casing (2) performing the feed motion. The swelling, cooling and lubricating liquid is supplied from liquid chambers (4, 5) provided in the casing. A further liquid chamber (6) prevents electrolyte from ingressing into the bearing bushes. The linear oscillatory motion of the tool holder is generated by a rocker (33) which is arranged vertically to the tool holder, extends through the casing and is driven by the eccentric (30) of a drive motor (29) with an associated frequency converter. A measuring device (42) and a fastener (43) enable the tool holder to be locked in a defined position, this permitting the apparatus to be operated with high accuracy also in the non-oscillating mode of the electrode.

Abstract: The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, includes: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate.

Abstract: A method and apparatus for stripping electro-deposited metal sheets from a cathode blank. The blank has opposite faces, upstream and downstream ends. At least one sheet is provided on at least one blank face to define upstream and downstream edges. The apparatus comprises a stripping assembly for stripping the electro-deposited metal sheets from the cathode blank, a discharge assembly and a metal sheet out-feed assembly. The discharge assembly is positioned downstream of the stripping assembly and includes opposite guide rollers adapted to engage the metal sheet exiting the stripping assembly. The metal sheet out-feed assembly is positioned downstream the discharge assembly for receiving the metal sheet. When the metal sheet has been stripped from the cathode blank, the guide rollers controllably feed the metal sheet to the out-feed assembly. The method comprises stripping the metal sheets from the cathode and controllably discharging the stripped sheets to an out-feed assembly.

Abstract: The invention relates to a device for the targeted application of deposition material onto a substrate, especially for focusing the sputter flux onto a narrow angular range in a PVD-system. The invention is characterized in that the deposition material is directed through a filter structure (90) having several channel-shaped individual structures (60) onto said substrate (30), whereby the streams of material are limited to a narrow angle range.

Abstract: A process for producing a master carrier contains steps of: forming a desired pattern on a support to form a resist pattern support; forming a first ferromagnetic thin film on the resist pattern support by a vacuum film forming method; forming a third ferromagnetic thick film on the first ferromagnetic thin film by an electroplating; and peeling the support from the resist pattern support provided with the first ferromagnetic thin film and the third ferromagnetic thick film.

Abstract: The present invention relates to gated nanorod field emission devices, wherein such devices have relatively small emitter tip-to-gate distances, thereby providing a relatively high emitter tip density and low turn on voltage. Such methods employ a combination of traditional device processing techniques (lithography, etching, etc.) with electrochemical deposition of nanorods. These methods are relatively simple, cost-effective, and efficient; and they provide field emission devices that are suitable for use in x-ray imaging applications, lighting applications, flat panel field emission display (FED) applications, etc.

Abstract: A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.