Abstract: Described are memory modules that support different error detection and correction (EDC) schemes in both single- and multiple-module memory systems. The memory modules are width configurable and support the different EDC schemes for relatively wide and narrow module data widths. Data buffers on the modules support the half-width and full-width modes, and also support time-division-multiplexing to access additional memory components on each module in support of enhanced EDC.

Abstract: A stacked semiconductor device includes at least one upper chip including first and second channels, each including first and second pseudo-channels; and first and second transfer control circuits respectively corresponding to the first and second channels, each configured to select one of the first and second pseudo-channels according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel, and transfer a data word between the selected pseudo-channel and a lower chip, wherein the first transfer control circuit transfers the data word in a first order in units of bytes, and the second transfer control circuit transfers the data word in a second order in units of bytes, opposite to the first order.

Abstract: A memory device may include a reference voltage generator that generates a reference voltage, a voltage regulator that includes a plurality of driving blocks generating an internal voltage based on the reference voltage, and a power line that receives the internal voltage. At least one of the plurality of driving blocks may include a first unit driver that generates a first output current flowing through the power line based on the reference voltage and a change in the internal voltage, and a second unit driver that generates a second output current larger than the first output current flowing through the power line, based on the reference voltage and the change in the internal voltage. The first unit driver may generate the first output current faster than the second output current of the second unit driver.

Abstract: In some implementations, a memory device may receive, from a host device, an erase command associated with erasing host data from a portion of a memory. The memory device may determine that the portion of the memory is associated with a reliability risk. The memory device may perform, based on determining that the portion of the memory is associated with the reliability risk, an alternative erase scheme to erase the host data from the portion of the memory, wherein during a first portion of the alternative erase scheme, a first voltage is applied to even word lines and a second voltage, that is different from the first voltage, is applied to odd word lines, and wherein during a second portion of the alternative erase scheme, a third voltage is applied to the even word lines and a fourth voltage is applied to the odd word lines.

Abstract: Provided is a memory semiconductor device in which a p-type semiconductor region is formed at an n+layer to which a bit line is connected, an n-type semiconductor layer to which a source line is connected is further formed, a first gate insulating layer and a first gate conductor layer to which a word line is connected exist, a second gate insulating layer and a second gate conductor layer to which a plate line is connected are provided, and a distance from the n+layer to the first gate conductor layer is smaller than a distance up to the second gate conductor layer. At the time of an erase operation, the plate line and the source line have a positive electric potential of the same polarity or have a voltage of 0 V.

Abstract: In some implementations, a memory device may receive, from a host device, a single-level cell (SLC) program command instructing host data to be written to one or more subblocks of memory. The memory device may determine whether a word line associated with a subblock, of the one or more subblocks, is associated with a reliability risk. The memory device may determine whether to perform a word line leakage monitoring procedure associated with a programming scheme to be used to program the subblock based on whether the word line is associated with the reliability risk.

Abstract: Disclosed are a resistive random access memory (RRAM) structure and operating method. The RRAM structure includes RRAM cells arranged in columns and rows with all cells in a column connected between source and bit lines for the column and with all cells in a row connected to a word line for the row. The RRAM structure also includes peripheral circuitry enabling all memory operations to be performed without selective source line biasing. For example, during a reset operation, the following voltage conditions can be applied: a low positive voltage (e.g., of +1.8V) to the word line of the row containing the selected RRAM cell; a low negative voltage (e.g., of ?1.8V) to all other word lines; and another low negative voltage (e.g., of ?1.6V) to the bit line of the column containing the selected RRAM cell. All source lines and all other bit lines can be discharged to ground.

Abstract: A value associated with a number of accesses of a word line and a length of said accesses may be stored on said word line. A timer may provide a periodic signal that increments a counter to update the value. The updated value may then be written back to the word line. In some examples, a memory device including the word lines may have a specification that prevents the word line from closing prior to writing the updated value to the word line.

Abstract: A memory device to determine a voltage window to read soft bit data. For example, in response to a read command, the memory device can read a group of memory cells at a plurality of test voltages to determine signal and noise characteristics, which can be used to determine an optimized read voltage for reading hard bit data and a voltage window between a first voltage and a second voltage for reading soft bit data. The soft bit data identifies exclusive or (XOR) of results read from the group of memory cells at the first voltage and at the second voltage respective. The memory device can provide a response to the read command based on the hard bit data and the soft bit data.

Abstract: A stacked semiconductor device includes at least one upper chip including a plurality of channels each including first and second pseudo-channels; and a plurality of transfer control circuits respectively corresponding to the channels and each configured to output channel commands according to a channel designation signal designating one of the first and second pseudo-channels and a location information signal indicating a location of a corresponding channel of the channels, and transmit first and second data words between the corresponding channel and a lower chip according to the channel commands.

Abstract: A system and method for efficiently resetting data stored in a memory array are described. In various implementations, an integrated circuit includes a memory for storing data, and a processing unit that generates access requests for the data stored in the memory. When access circuitry of the memory array begins a reset operation, it reduces a power supply voltage level used by memory bit cells in a column of the array to a value less than a threshold voltage of transistors. Therefore, the p-type transistors of the bit cells do not contend with the write driver during a write operation. The access circuitry provides the reset data on the write bit lines, and asserts each of the write word lines of the memory array. To complete the write operation, the access circuitry returns the power supply voltage level from below the threshold voltage level to an operating voltage level.

Abstract: Apparatuses and methods for saving power at an input buffer are described. An example apparatus includes an input buffer comprising an amplifier coupled to a pair of serially coupled inverters, and a de-emphasis circuit coupled to the input buffer in parallel with one of the pair of serially-coupled inverters. The de-emphasis circuit comprising a plurality of transistors coupled in parallel to a resistance. The example apparatus further includes an input buffer control circuit configured to selectively enable one of the plurality of transistors to adjust a gain across the one of the pair of inverters based on a latency setting.

Abstract: A first memory instance comprises one or more first bitcell arrays and one or more peripheral circuits. The first memory instance further comprises a high-speed voltage monitoring circuit operable to monitor a supply voltage and a power down signal in the first memory instance, the high-speed voltage monitoring circuit further operable to provide an output power ready signal derived from the supply voltage and the power down signal such that the output power ready signal indicates when the power down signal is low and the supply voltage is high.

Abstract: A memory device includes a first wiring, a second wiring, a memory cell connected between the first wiring and the second wiring, a first power line, a sense amplifier, a current control circuit provided between the first power line and the sense amplifier and including a control terminal connected to a first node, a capacitance element provided between the first node and the second wiring and including a first terminal electrically connected to the second wiring and a second terminal connected to the first node, a second power line, and a first element having an electrical resistance provided between the first node and the second power line.

Abstract: The memory device includes an array of memory cells that are arranged in word lines and are programmed to contain data. Circuitry is configured to erase the memory cells of the memory block in an erase operation. During erase, the circuitry is configured to begin an erase operation to erase the memory cells and suspend the erase operation for a first suspension. After the first suspension is completed, the circuitry is configured to resume the erase operation. The circuitry is then configured to receive an instruction to suspend the erase operation for a second suspension and dynamically determine a minimum resume latency based on a vulnerability of the memory block to erase errors. Only after the minimum resume latency has passed following the step of resuming the erase operation after the first suspension is completed, the circuitry is configured to suspend the erase operation for the second suspension.

Abstract: Implementations described herein relate to enabling or disabling on-die error-correcting code for a memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify, based on the one or more bits, whether the memory built-in self-test is to be performed with on-die error-correcting code (ECC) disabled or with on-die ECC enabled. The memory device may perform the memory built-in self-test, and selectively test for one or more single-bit errors, based on identifying whether the memory built-in self-test is to be performed with the on-die ECC disabled or with the on-die ECC enabled.

Abstract: Numerous examples are disclosed for performing calibration of various electrical parameters in a deep learning artificial neural network. In one example, a method comprises adjusting a bias voltage applied to one or more non-volatile memory cells in an artificial neural network, performing a performance target check on the one or more non-volatile memory cells in the artificial neural network, and repeating the adjusting and performing until the performance target check indicates an electrical parameter is within a predetermined range.

Abstract: A semiconductor module includes a board including a chip area and a tab area sequentially arranged in a first direction, a semiconductor chip provided on the chip area, a plurality of signal tabs provided on the tab area, and at least one anti-static portion having conductivity, provided in the tab area, and spaced apart from the plurality of signal tabs, where the plurality of signal tabs and the at least one anti-static portion are sequentially arranged in the first direction and the at least one anti-static portion is disposed on a line extending from at least one of the plurality of signal tabs in the first direction.

Abstract: A second read command to read second data from an array of memory cells is detected. An initial voltage to be applied to at least one wordline coupled to at least a subset of the array of memory cells is caused prior to releasing a first data associated with a first read command stored in a page buffer. The initial voltage to increase to a target value is caused. The page buffer to sense the second data from a bitline coupled to a page of the subset of the array of memory cells is caused. The sensed second data out of the bitline into the page buffer is read responsive to determining that the first data has been released from the page buffer.

Abstract: A sensing and amplifying circuit includes a driving voltage control circuit configured to control a voltage level of a driving voltage based on a surrounding temperature of the sensing and amplifying circuit, a delay control circuit configured to generate a line connection signal and an inverted line connection signal in response to a delay start signal by being supplied with the driving voltage, and a sense amplifier configured to perform a sensing and amplifying operation in response to the line connection signal and the inverted line connection signal. An interval between enable timing of the line connection signal and enable timing of the inverted line connection signal is adjusted as the surrounding temperature changes.