Abstract: A substrate processing apparatus comprises a processing section having a plurality of process units for applying a series of processes including a resist coating to a processing substrate, a developing process to an exposed substrate, and an etching to the developed processing substrate, a main transferring mechanism, moving along a transferring path, for transferring/receiving the processing substrate to/from the respective process units, and a loading/unloading portion having a transferring/receiving mechanism for transferring/receiving the processing substrate to/from the main transferring apparatus, wherein these process units, the transferring path, and the loading/unloading portion are integrally provided.