Patents Examined by M. Alexandar Elve
  • Patent number: 6092713
    Abstract: An automated apparatus for three dimensional stack package devices provides mass production of J-lead type stack packages. The apparatus includes a package loader and a package loader/unloader for loading upper and lower individual packages and for unloading packages which have been stacked and soldered; an indexing system for receiving and aligning the upper and lower individual packages and for transporting the stacked upper and lower packages, an applying unit for applying a solder flux or a solder paste to metal leads of the upper individual packages, first and second transfer tools for transferring the individual packages to the applying unit and to the indexing system; and a heating unit for heating the stacked upper and lower packages so that metal leads of the upper and lower packages are solder jointed.
    Type: Grant
    Filed: February 5, 1998
    Date of Patent: July 25, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae June Kim
  • Patent number: 6066835
    Abstract: A welding lead assembly for use with a metal inert gas welding system to operatively couple a welding gun through an electrode feed unit of the metal inert gas welder to a power supply and an inert gas supply, the welding lead assembly includes a unitary welding lead having an inner flexible inert gas conduit coaxially disposed within a flexible electrical conductor and a plurality of electrode feed control elements to selectively supply inert gas and electrical power to the electrode feed unit through the inner flexible inert gas conduit and the flexible electrical conductor respectively and control signals between the welding gun and the power supply and inert gas supply through the electrode feed control elements to control operation of the metal inert gas welding system.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: May 23, 2000
    Assignee: S M C I, Inc.
    Inventor: Rickey R. Hanks