Patents Examined by M. Alexandra Elva
  • Patent number: 8469250
    Abstract: An auto hammer with a striking device includes a striking rod and a clamping mechanism. The striking rod continually strikes a component to gradually insert the component into a workpiece. The clamping mechanism includes at least one clamping element, a biasing device, a bush and a sleeve, and the clamping elements are movable between a closed position and an opened position. The bush is arranged around the striking rod so as to prevent the nail head from becoming trapped in a gap which is formed after the clamping elements are entirely opened. The biasing device is arranged for biasing the bush toward the direction of striking the component. This clamping mechanism can reliably clamp nails or other components to facilitate user operation of the device.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: June 25, 2013
    Assignee: Chervon Limited
    Inventor: Hongtao Zhou
  • Patent number: 6648215
    Abstract: With the mounting of a semiconductor chip onto a substrate having a portion of adhesive the bondhead is lowered to a predetermined height H above a support holding the substrate. At the same time, the pick-up tool is fixed in an upper limit position on the bondhead. As soon as the bondhead has reached the height H, the fixing of the pick-up tool is released so that the pick-up tool moves downwards from the upper limit position and presses the semiconductor chip onto the adhesive. After a predetermined time after releasing the fixing of the pick-up tool, the bondhead is raised and moved away. With a bondhead particularly suited for the method, the pick-up tool and the bondhead are connected by means of a chamber to which compressed air and/or vacuum can be applied so that, to a large extent, the movement of the pick-up tool can be controlled.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: November 18, 2003
    Assignee: ESEC Trading SA
    Inventor: Felix Leu
  • Patent number: 6198070
    Abstract: A laser beam machining method includes the steps of, irradiating a laser beam on a machining portion of a workpiece for the machining thereof, blowing out an assist gas toward the machining portion of the workpiece continuously during the irradiating step, and blowing out a blow gas toward the machining portion intermittently during the irradiating step.
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: March 6, 2001
    Assignee: Nippei Toyama Corporation
    Inventor: Masanori Nakayama