Abstract: The present invention provides an organic porous material having equivalent thermal insulating properties to those of a porous material of a silica material and improved brittleness. The organic porous material of the present invention is an aggregate of organogel fine particles having a particle diameter of 10 to 300 nm, wherein inter-particle crosslinking is formed between adjoining organogel fine particles.
Type:
Grant
Filed:
October 20, 1999
Date of Patent:
October 9, 2001
Assignee:
Matsushita Electric Industrial Co., Ltd.
Inventors:
Takashi Hashida, Masaaki Suzuki, Yukiyoshi Ono
Abstract: A laminate adhesive that can suppress elusion of a low molecular weight compounds of a composite film into the content, so as to prevent the inherent properties or performances of the content from being spoiled by the low molecular weight compounds. The laminate adhesive comprises a polyisocyanate component and a polyol component, wherein the polyol component includes polyester polyol and/or polyester polyurethane polyol which is produced by reaction of polyester polyol and polyisocyanate, and wherein concentration of cyclic compounds in extracted water which are extracted from a composite film bonded by the laminate adhesive by water of 0.5 mL/cm2 per unit area of the composite film is 0.5 ppb or less in terms of dibutyl phthalate concentration measured by a gas chromatograph-flame ionization detector.
Abstract: The present invention is polyurethane dispersion composition that can be mechanically frothed to yield a foam that has good resiliency. Frothed foams of the present invention can be useful in cushioned flooring applications such as attached cushion broadloom, carpet tiles, carpet underlay, or vinyl flooring. Frothed foams of the present invention can also be useful as coatings for various textiles and for diapers.
Type:
Grant
Filed:
December 16, 1999
Date of Patent:
August 7, 2001
Assignee:
The Dow Chemical Company
Inventors:
Michael Y. Gribble, Rick L. Tabor, James J. Jakubowski, Alan K. Schrock, Paulus C. J. M. Van Bellegem, James G. Kennedy