Abstract: A plurality of sheets (12,16,18) of Low-Temperature-Cofired-Ceramic (LTCC) tape or other fusible ceramic tape are laminated together. A pattern (10) is printed on an external surface (12a) of the laminated structure (20) of a material having a thermal shrinkage rate which is different from that of the tape. The pattern (10) may be printed before or after lamination. The structure (20) is then baked to burn organic materials out of the tape. During this step, the pattern (10) and underlying portions (12b,12c) of the upper tape sheet (12) shrink to a different extent than the bulk of the structure (20), and delaminate therefrom to form cavities (26,28) having the same shape as the pattern (10). The structure (20) is then fired to sinter the tape and form a fused multilayer substrate (32). The cavities (26,28) may be filled with an electrically conductive or resistive material (36,38).